datasheet
EEWORLDEEWORLDEEWORLD
Datasheet
Part Number

Keyword

Search
Keyword

Part Number

Search
Datasheet> All Categories > Passive components> The resistor> D25/CRCW1206-P1002K260.5%ET6E3
PDF
Preview

D25/CRCW1206-P1002K260.5%ET6E3

Description
Fixed Resistor, Metal Glaze/thick Film, 0.25W, 2260ohm, 200V, 0.5% +/-Tol, 100ppm/Cel, Surface Mount, 1206, CHIP, HALOGEN FREE AND ROHS COMPLIANT
CategoryPassive components    The resistor   
File Size101KB，6 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Environmental Compliance
Download Datasheet Parametric View All

D25/CRCW1206-P1002K260.5%ET6E3 Overview

Fixed Resistor, Metal Glaze/thick Film, 0.25W, 2260ohm, 200V, 0.5% +/-Tol, 100ppm/Cel, Surface Mount, 1206, CHIP, HALOGEN FREE AND ROHS COMPLIANT

D25/CRCW1206-P1002K260.5%ET6E3 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid8071822574
package instructionCHIP, HALOGEN FREE AND ROHS COMPLIANT
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresRATED AC VOLTAGE (V): 200, SEMI-PRECISION
structureChip
JESD-609 codee3
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height0.55 mm
Package length3.2 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width1.6 mm
method of packingTR, PAPER, 13 INCH
Rated power dissipation(P)0.25 W
Rated temperature70 °C
GuidelineAEC-Q200
resistance2260 Ω
Resistor typeFIXED RESISTOR
size code1206
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient100 ppm/°C
Terminal surfaceMatte Tin (Sn) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
Tolerance0.5%
Operating Voltage200 V

D25/CRCW1206-P1002K260.5%ET6E3 Preview

D/CRCW-P e3
www.vishay.com
Vishay
Lead (Pb)-Free Thick Film, Rectangular,
Semi-Precision Chip Resistors
FEATURES
• Low temperature coefficient (50 ppm/K) and
tight tolerances (± 0.25 %)
• Pure tin plating provides compatibility with
lead (Pb)-free and lead containing soldering
processing
• Metal glaze on high quality ceramic
• AEC-Q200 qualified
• Material categorization: For definitions of compliance
please see
www.vishay.com/doc?99912
STANDARD ELECTRICAL SPECIFICATIONS
CASE
SIZE
INCH
CASE
SIZE
METRIC
POWER
RATING
P
70
W
LIMITING
ELEMENT
VOLTAGE
U
max.
AC
RMS
/DC
V
50
TEMPERATURE
COEFFICIENT
ppm/K
± 100
± 50
± 100
D11/CRCW0603-P
0603
1608
0.1
75
± 50
± 100
D12/CRCW0805-P
0805
2012
0.125
150
± 50
± 100
D25/CRCW1206-P
1206
3216
0.25
200
± 50
± 100
± 50
± 100
± 50
± 100
± 50
± 100
± 50
TOLERANCE
%
RESISTANCE
RANGE
1R to 1M1
100R to 1M
1R to 10M
100R to 1M
100R to 10M
10R to 10M
100R to 1M
100R to 10M
10R to 10M
100R to 1M
100R to 10M
100R to 1M
100R to 1M
100R to 2M2
100R to 2M2
10R to 10M
100R to 10M
10R to 10M
100R to 10M
E24; E96
E24; E96
E24; E96
E24; E96
E24; E96
E24; E96
E24; E96
MODEL
SERIES
D10/CRCW0402-P
0402
1005
0.063
± 0.5
± 0.25, ± 0.5, ± 1
± 0.5, ± 0.25
± 0.25
± 0.5, ± 1
± 0.5
± 0.25
± 0.5, ± 1
± 0.5
± 0.25
± 0.5, ± 1
± 0.5
± 0.5, ± 1
± 0.5
± 0.5, ± 1
± 0.5
± 0.5, ± 1
± 0.5
± 0.5, ± 1
E24; E96
CRCW1210-P
CRCW1218-P
CRCW2010-P
CRCW2512-P
1210
1218
2010
2512
3225
3246
5025
6332
0.5
1.0
0.75
1.0
200
200
400
500
Notes
• These resistors do not feature a limited lifetime when operated within the limits of rated dissipation, permissible operating voltage and
permissible film temperature. However, the resistance typically increase due to the resistor’s film temperature over operating time generally
known as drift. The drift may exceed the stability requirements of an individual application circuit and thereby limits the functional time.
• Marking and packaging: See datasheet “Surface Mount Resistor Marking” (www.vishay.com/doc?20020).
• Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material.
Revision: 07-Apr-14
Document Number: 20036
1
For technical questions, contact:
thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
D/CRCW-P e3
www.vishay.com
Vishay
TECHNICAL SPECIFICATIONS
PARAMETER
Rated Dissipation at
P
70 (1)
Operating Voltage
U
max.
AC
RMS
/DC
Insulation Voltage
U
ins
(1 min)
Insulation Resistance
Operating Temperature Range
Failure Rate
Weight
UNIT
W
V
V
°C
h
-1
mg
0.65
2
5.5
D10/
D11/
D12/
D25/
CRCW1210-P CRCW1218-P CRCW2010-P CRCW2512-P
CRCW0402-P CRCW0603-P CRCW0805-P CRCW1206-P
0.063
50
75
0.1
75
100
0.125
150
200
0.25
200
300
> 10
9
- 55 to + 155
< 0.1 x 10
-9
10
16
29.5
25.5
40.5
0.5
200
300
1.0
200
300
0.75
400
300
1.0
500
300
Note
(1)
The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the
printed-ciruit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 °C is not exceeded.
PART NUMBER AND PRODUCT DESCRIPTION
PART NUMBER: CRCW040275R0DKEDP
C
R
C
W
0
4
0
2
7
5
R
0
D
K
E
D
P
MODEL
CRCW0402
CRCW0603
CRCW0805
CRCW1206
CRCW1210
CRCW1218
CRCW2010
CRCW2512
RESISTANCE
R
= Decimal
K
= Thousand
M
= Million
TOLERANCE
C
= ± 0.25 %
D
= ± 0.5 %
F
= ± 1.0 %
TCR
H
= ± 50 ppm/K
K
= ± 100 ppm/K
PACKAGING
EA, EB,
EC, ED,
EE, EF,
EG, EH,
EI, EL
EK
SPECIAL
P
=
Semi-Precision
PRODUCT DESCRIPTION: D10/CRCW0402-P 100 75R 0.5 % ET7 e3
D10/CRCW0402-P
MODEL
D10/CRCW0402-P
D11/CRCW0603-P
D12/CRCW0805-P
D25/CRCW1206-P
CRCW1210-P
CRCW1218-P
CRCW2010-P
CRCW2512-P
100
TCR
± 50
ppm/K
± 100
ppm/K
75R
RESISTANCE
49K9
= 49.9 k
5R1
= 5.1
0.5 %
TOLERANCE
± 0.25 %
± 0.5 %
±1%
ET7
PACKAGING
ET1, ET2,
ET3, ET4,
ET5, ET6,
ET7, ET8,
ET9, EF4,
E02, E67,
E82
e3
LEAD (Pb)-FREE
e3
= Pure tin
termination
finish
Revision: 07-Apr-14
Document Number: 20036
2
For technical questions, contact:
thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
D/CRCW-P e3
www.vishay.com
Vishay
QUANTITY
10 000
50 000
5000
10 000
20 000
50 000
5000
10 000
20 000
5000
10 000
20 000
5000
10 000
20 000
5000
10 000
20 000
4000
4000
2000
4000
Blister tape acc. to
IEC 60068-3
Type II
12 mm
12 mm
12 mm
4 mm
4 mm
8 mm
4 mm
12 mm
4 mm
8 mm
4 mm
Paper tape acc. to
IEC 60068-3
Type I
8 mm
4 mm
8 mm
4 mm
8 mm
2 mm
CARRIER TAPE
WIDTH
8 mm
PITCH
2 mm
REEL DIAMETER
180 mm/7"
330 mm/13"
180 mm/7"
180 mm/7"
285 mm/11.25"
330 mm/13"
180 mm/7"
285 mm/11.25"
330 mm/13"
180 mm/7"
285 mm/11.25"
330 mm/13"
180 mm/7"
285 mm/11.25"
330 mm/13"
180 mm/7"
285 mm/11.25"
330 mm/13"
180 mm/7"
180 mm/7"
180 mm/7"
PACKAGING
MODEL
D10/CRCW0402-P
CODE
ED = ET7
EE = EF4
EI = ET2
ED = ET3
EL = ET4
D11/CRCW0603-P
EE = ET8
EA = ET1
EB = ET5
EC = ET6
EA = ET1
D12/CRCW0805-P
EB = ET5
EC = ET6
EA = ET1
D25/CRCW1206-P
EB = ET5
EC = ET6
EA = ET1
CRCW1210-P
CRCW1218-P
CRCW2010-P
CRCW2512-P
EB = ET5
EC = ET6
EK = ET9
EF = E02
EG = E67
EH = E82
DIMENSIONS
in millimeters
SIZE
INCH METRIC
0402
0603
0805
1206
1210
1218
2010
2512
1005
1608
2012
3216
3225
3246
5025
6332
L
1.0 ± 0.05
1.55
2.0
3.2
+ 0.10
- 0.05
+ 0.20
- 0.10
+ 0.10
- 0.20
DIMENSIONS
W
0.5 ± 0.05
0.85 ± 0.1
H
T1
T2
0.2 ± 0.1
0.3 ± 0.2
0.3 ± 0.2
0.4 ± 0.2
0.4 ± 0.2
0.4 ± 0.2
0.6 ± 0.2
0.6 ± 0.2
SOLDER PAD DIMENSIONS
REFLOW SOLDERING
a
0.4
0.5
0.7
0.9
0.9
1.05
1.0
1.0
b
0.6
0.9
1.3
1.7
2.5
4.9
2.5
3.2
l
0.5
1.0
1.2
2.0
2.0
1.9
3.9
5.2
0.9
0.9
1.1
1.1
1.25
1.2
1.2
0.9
1.3
1.7
2.5
4.8
2.5
3.2
1.0
1.3
2.3
2.2
1.9
3.9
5.2
WAVE SOLDERING
a
b
l
0.35 ± 0.05 0.25 ± 0.05
0.45 ± 0.05
0.3 ± 0.2
0.3
+ 0.20
- 0.10
1.25 ± 0.15 0.45 ± 0.05
1.6 ± 0.15
2.5 ± 0.2
4.6 ± 0.15
2.5 ± 0.15
3.15 ± 0.15
0.55 ± 0.05
0.55 ± 0.05
0.55 ± 0.05
0.6 ± 0.1
0.6 ± 0.1
0.45 ± 0.2
0.45 ± 0.2
0.45 ± 0.2
0.6 ± 0.2
0.6 ± 0.2
3.2 ± 0.2
3.2
+ 0.10
- 0.20
5.0 ± 0.15
6.3 ± 0.2
Revision: 07-Apr-14
Document Number: 20036
3
For technical questions, contact:
thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
D/CRCW-P e3
www.vishay.com
FUNCTIONAL PERFORMANCE
Fraction of Rated Dissipation
P
70
Vishay
100
%
50
0
- 50
0
50
100
°C
150
70
Ambient Temperature in
amb
TEST PROCEDURES AND REQUIREMENTS
IEC
EN 60115-1 60068-2
CLAUSE
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
STABILITY CLASS 1 OR BETTER
1 to 10 M
± 0.25 %; ± 0.5 %; ± 1 %
No flashover or breakdown
± (0.25 %
R
+ 0.05
)
Stability for product types:
D/CRCW-P e3
4.5
4.7
4.13
-
-
-
Resistance
Voltage proof
Short time overload
-
U
= 1.4 x
U
ins
; 60 s
U
= 2.5 x
P
70
x
R
2 x
U
max.;
duration acc. to style
Solder bath method;
Sn60Pb40
non-activated flux;
(235 ± 5) °C
(2 ± 0.2) s
4.17.2
58 (Td)
Solderability
Solder bath method;
Sn96.5Ag3Cu0.5
non-activated flux;
(245 ± 5) °C
(3 ± 0.3) s
4.8.4.2
4.32
4.33
-
21 (Uu
3
)
21 (Uu
1
)
Temperature
coefficient
Shear
(adhesion)
Substrate bending
(20/- 55/20) °C and
(20/125/20) °C
RR 1608 and smaller: 9 N
RR 2012 and larger: 45 N
Depth 2 mm;
3 times
30 min at - 55 °C;
30 min at 125 °C
5 cycles
1000 cycles
Good tinning ( 95 % covered)
no visible damage
Good tinning ( 95 % covered)
no visible damage
± 50 ppm/K; ± 100 ppm/K
No visible damage
No visible damage, no open circuit in bent position
± (0.25 %
R
+ 0.05
)
4.19
14 (Na)
Rapid change of
temperature
± (0.25 %
R
+ 0.05
)
± (1 %
R
+ 0.05
)
Revision: 07-Apr-14
Document Number: 20036
4
For technical questions, contact:
thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
D/CRCW-P e3
www.vishay.com
Vishay
TEST PROCEDURES AND REQUIREMENTS
IEC
EN 60115-1 60068-2
CLAUSE
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
STABILITY CLASS 1 OR BETTER
1 to 10 M
Stability for product types:
D/CRCW-P e3
4.23
4.23.2
4.23.3
4.23.4
4.23.5
4.23.6
4.23.7
-
2 (Ba)
30 (Db)
1 (Aa)
13 (M)
30 (Db)
-
Climatic sequence:
Dry heat
Damp heat, cyclic
Cold
Low air pressure
Damp heat, cyclic
DC load
-
125 °C; 16 h
55 °C;
90 % RH;
24 h; 1 cycle
- 55 °C; 2 h
1 kPa; (25 ± 10) °C; 1 h
55 °C;
90 % RH;
24 h; 5 cycles
U
=
P
70
x
R
U
=
P
70
x
R
U
max.;
1.5 h on; 0.5 h off;
4.25.1
-
Endurance at 70 °C
70 °C; 1000 h
70 °C; 8000 h
4.18.2
58 (Td)
Resistance to
soldering heat
Flamability,
needle flame test
Damp heat,
steady state
Endurance at
upper category
temperature
Electrostatic
discharge
(human body model)
Component solvent
resistance
Solvent resistance
of marking
Vibration, endurance
by sweeping
Solder bath method
(260 ± 5) °C;
(10 ± 1) s
IEC 60695-11-5;
10 s
(40 ± 2) °C;
(93 ± 3) % RH;
56 days
155 °C, 1000 h
IEC 61340-3-1;
3 pos. + 3 neg. discharges;
ESD voltage acc. to size
Isopropyl alcohol;
50 °C; method 2
Isopropyl alcohol;
50 °C; method 1,
toothbrush
f = 10 Hz to 2000 Hz;
x, y, z
1.5 mm;
A
200 m/s
2
;
10 sweeps per axis
U
=
4.37
-
Periodic electric
overload
Single pulse high
voltage overload,
10 μs/700 μs
15 x
P
70
x
R
2 x
U
max.;
0.1 s on; 2.5 s off;
1000 cycles
± (1 %
R
+ 0.05
)
± (1 %
R
+ 0.05
)
± (2 %
R
+ 0.05
)
± (0.25 %
R
+ 0.05
)
4.35
-
No burning after 30 s
± (1 %
R
+ 0.05
)
4.24
78 (Cab)
4.25.3
-
± (1 %
R
+ 0.05
)
4.40
4.29
4.30
-
45 (XA)
45 (XA)
± (1 %
R
+ 0.05
)
No visible damage
Marking legible,
no visible damage
4.22
6 (Fc)
± (0.25 %
R
+ 0.05
)
± (1 %
R
+ 0.05
)
4.27
-
Û
= 10 x
P
70
x
R
2 x
U
max.;
10 pulses
± (1 %
R
+ 0.05
)
All tests are carried out in accordance with the following specifications:
• EN 60115-1, generic specification
• EN 140400, sectional specification
• EN 140401-802, detail specification
• IEC 60068-2-x, variety of environmental test procedures
Packaging of components is done in paper or blister tapes according to IEC 60286-3.
Revision: 07-Apr-14
Document Number: 20036
5
For technical questions, contact:
thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
More (Only the first 5 pages are displayed. Please Download Datasheet to view the full content.) >

Recommended Resources

Battery discharge protector circuit diagram

STK1060 power amplifier circuit diagram

Thermistor input circuit

Full wave light control circuit

Integrated audio power amplifier circuit LM380

Samsung 753DFhe755DF monitor diagram

24C64 storage capacity issues
There are mainly a few questions, I hope you can help answer them: 1. The Datesheet says 8192x8=64KB, and there are 32 bytes per page, so there are 256 pages in total, so isn't that only 8192 bytes? I...
lxc115 51mcu
Guangzhou color TV company is looking for hardware engineers
[align=left]Direct recruitment by enterprises [Positions in Guangzhou] [/align][align=left]Job responsibilities: [/align][align=left]1. Participate in the hardware development of the company's new pro...
SKY招聘 Talking about work
[NUCLEO-WL55JC2 Review 4] STM32WL sub-GHZ RF (LoRa\FSK..)
[i=s]This post was last edited by nich20xx on 2020-7-5 06:31[/i] # 1 Introduction The sub-GHZ RF module of STM32WL can operate in the 150~960MHz ISM frequency band, supports the transceiver functions ...
nich20xx Special Edition for Assessment Centres
AVRDUDE released version 6.4 and moved to github
The open source AVR download software AVRDUDE has been upgraded to v6.4, and the source code has been migrated to github.Message from: https://lists.nongnu.org/archive/html/avrdude-dev/2021-12/msg0009...
dcexpert DIY/Open Source Hardware
Things with TI--Talk about launchpad
[color=rgb(68,68,68)][backcolor=rgb(238,238,238)]The left side of the picture is 430 Launchpad, which is familiar to students who participated in the 2012 Electronic Design. It has an onboard simulato...
buer1209 Microcontroller MCU
Several issues on hysteresis compensation
1. Why should hysteresis compensation be targeted at the lowest upper frequency limit? 2. Why should simple hysteresis compensation make 20lg|AF|=0db at fh2, and fh2 greater than or equal to 10fh1'?...
msddw Analog electronics
Shortcut:   A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components

  1. M85049/25-133N
  2. JTS06RE-22-14PC(SR)
  3. CD-700-KAF-GHB-28.704
  4. 240-383PM17-99SSCCNN
  5. AS52A10
  6. 85101R1412PX50
  7. 47LAC-140G-P
  8. CNC12ATWMS68NF20%25VEM
  9. 1SMB5921-AU_R2_00001
  10. GLZJ3.9A_R1_10001
  11. BZQ5226D_R2_10001
  12. TCR2512L220KD50

Popular Articles

  1. Nexperia Semiconductor: Nexperia 5G PA/TWS/IoT module SiP products are off the assembly line
  2. 37-Design of intelligent temperature control fan based on 51 single chip microcomputer
  3. Wuling's domestically produced chips and battery swaps at the Hainan conference
  4. Xiaomi Mi 12 CAD rendering reveals a more compact design
  5. Share tiny4412, emmc burning u-boot, support fastboot mode burning emmc
  6. India believes chipmakers will start producing locally in 2-3 years
  7. Introduction to the performance of vegetable pesticide residue tester
  8. LCD1602 temperature display program design process
  9. The difference between variable frequency motor and rated motor
  10. New breakthrough in edible electronics: Scientists create first edible rechargeable battery

Technical ResourceMore

  1. Guangdong Tower 5G Network Construction Experience Sharing
  2. Embedded VxWorks system development and application
  3. Research on a voltage mode controlled PWM switching power supply
  4. Sine wave power signal source with phase shift and frequency conversion function
  5. How to set up differential routing in Altium Designer
  6. AG6320 Specifications
  7. Detailed explanation of automotive electronic control systems
  8. Mobile phone sound cavity design
  9. Design of various amplifiers (scheme design + circuit design)
  10. Detailed Introduction to the Basic Principles of DDR SDRAM

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

About Us Customer Service Contact Information Datasheet Sitemap LatestNews
Index Files: 561  908  2461  651  2656  12  19  50  14  54 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号