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.EATURES
32K x 8 LOW POWER CMOS STATIC RAM
Access time: 45, 70 ns
Low active power: 200 mW (typical)
Low standby power
250 µW (typical) CMOS standby
28 mW (typical) TTL standby
.ully static operation: no clock or refresh
required
TTL compatible inputs and outputs
Single 5V power supply
DESCRIPTION
The
1+51
IC62C256 is a low power, 32,768 word by 8-bit
CMOS static RAM. It is fabricated using
1+51
's high-
performance, low power CMOS technology.
When
CS
is HIGH (deselected), the device assumes a standby
mode at which the power dissipation can be reduced down to
250 µW (typical) at CMOS input levels.
Easy memory expansion is provided by using an active LOW
Chip Select (CS) input and an active LOW Output Enable (OE)
input. The active LOW Write Enable (WE) controls both writing
and reading of the memory.
The IC62C256 is pin compatible with other 32K x 8 SRAMs in
330mil SOP or 8*13.4mm TSOP-1 package.
.UNCTIONAL BLOCK DIAGRAM
A0-A14
DECODER
32K X 8
MEMORY ARRAY
VCC
GND
I/O
DATA
CIRCUIT
I/O0-I/O7
COLUMN I/O
CS
OE
WE
CONTROL
CIRCUIT
ICSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any errors
which may appear in this publication. © Copyright 2000, Integrated Circuit Solution Inc.
Integrated Circuit Solution Inc.
ALSR010-0A 05/23/2001
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PIN CON.IGURATION
28-Pin SOP
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
I/O1
I/O2
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
VCC
WE
A13
A8
A9
A11
OE
A10
CS
I/O7
I/O6
I/O5
I/O4
I/O3
PIN CON.IGURATION
8x13.4mm TSOP-1
OE
A11
A9
A8
A13
WE
VCC
A14
A12
A7
A6
A5
A4
A3
22
23
24
25
26
27
28
1
2
3
4
5
6
7
21
20
19
18
17
16
15
14
13
12
11
10
9
8
A10
CS
I/O7
I/O6
I/O5
I/O4
I/O3
GND
I/O2
I/O1
I/O0
A0
A1
A2
PIN DESCRIPTIONS
A0-A14
CS
OE
WE
I/O0-I/O7
Vcc
GND
Address Inputs
Chip Select Input
Output Enable Input
Write Enable Input
Input/Output
Power
Ground
TRUTH TABLE
Mode
Not Selected
(Power-down)
Output Disabled
Read
Write
WE
X
H
H
L
CS
H
L
L
L
OE
X
H
L
X
I/O Operation
High-Z
High-Z
D
OUT
D
IN
Vcc Current
I
SB
, I
SB
I
CC
, I
CC
I
CC
, I
CC
I
CC
, I
CC
ABSOLUTE MAXIMUM RATINGS
(1)
Symbol
V
TERM
T
BIAS
T
STG
P
T
I
OUT
Parameter
Terminal Voltage with Respect to GND
Temperature Under Bias
Storage Temperature
Power Dissipation
DC Output Current (LOW)
Value
0.5 to +7.0
55 to +125
65 to +150
Unit
V
°C
°C
W
mA
0.5
20
Note:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause
permanent damage to the device. This is a stress rating only and functional operation of the
device at these or any other conditions above those indicated in the operational sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect reliability.
2
Integrated Circuit Solution Inc.
ALSR010-0A 05/23/2001
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OPERATING RANGE
Range
Commercial
Industrial
Ambient Temperature
0°C to +70°C
40°C to +85°C
V
CC
5V ± 10%
5V ± 10%
DC ELECTRICAL CHARACTERISTICS
Symbol
V
OH
V
OL
V
IH
V
IL
I
LI
I
LO
Parameter
Output HIGH Voltage
Output LOW Voltage
Input HIGH Voltage
Input LOW Voltage
Input Leakage
Output Leakage
Test Conditions
V
CC
= Min., I
OH
= 1.0 mA
V
CC
= Min., I
OL
= 2.1 mA
Min.
2.4
2.2
0.3
Com.
Ind.
Com.
Ind.
2
10
2
10
Max.
0.4
V
CC
+ 0.5
0.8
2
10
2
10
Unit
V
V
V
V
µA
µA
GND
≤
V
IN
≤
V
CC
GND
≤
V
OUT
≤
V
CC
,
Outputs Disabled
Note:
1. V
IH
=V
CC
+3.0V for pulse width less than 10ns.
2. V
IL
= 3.0V for pulse width less than 10 ns.
POWER SUPPLY CHARACTERISTICS
(1)
(Over Operating Range)
Symbol
I
CC
I
CC
I
SB
Parameter
Vcc Operating
Supply Current
Vcc Dynamic Operating
Supply Current
TTL Standby Current
(TTL Inputs)
CMOS Standby
Current (CMOS Inputs)
Test Conditions
V
CC
= Max.,
CS
= V
IL
I
OUT
= 0 mA, f = 0
V
CC
= Max.,
CS
= V
IL
I
OUT
= 0 mA, f = f
MAX
V
CC
= Max.,
V
IN
= V
IH
or V
IL
CS
≥
V
IH
, f = 0
V
CC
= Max.,
CS
≥
V
CC
0.2V,
V
IN
≥
V
CC
0.2V, or
V
IN
≤
0.2V, f = 0
-45 ns
Min. Max.
60
70
70
80
5
10
0.5
1.0
-70 ns
Min. Max.
60
70
65
75
5
10
0.5
1.0
Unit
mA
mA
mA
Com.
Ind.
Com.
Ind.
Com.
Ind.
Com.
Ind.
I
SB
mA
Note:
1. At f = f
MAX
, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change.
CAPACITANCE
(1,2)
Symbol
C
IN
C
OUT
Parameter
Input Capacitance
Output Capacitance
Conditions
V
IN
= 0V
V
OUT
= 0V
Max.
8
10
Unit
p.
p.
Notes:
1. Tested initially and after any design or process changes that may affect these parameters.
2. Test conditions: T
A
= 25°C, f = 1 MHz, Vcc = 5.0V.
Integrated Circuit Solution Inc.
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READ CYCLE SWITCHING CHARACTERISTICS
(1)
(Over Operating Range)
Symbol
Parameter
Read Cycle Time
Address Access Time
Output Hold Time
CS
Access Time
OE
Access Time
-45 ns
Min. Max.
45
2
0
0
3
0
0
45
45
25
20
20
30
-70 ns
Min.
Max.
70
2
0
0
3
0
0
70
70
35
25
25
50
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
t
RC
t
AA
t
OHA
t
ACS
t
DOE
t
LZOE
OE
to Low-Z Output
t
HZOE
OE
to High-Z Output
t
LZCS
CS
to Low-Z Output
t
HZCS
CS
to High-Z Output
t
PU
!
t
PD
!
CS
to Power-Up
CS
to Power-Down
Notes:
1. Test conditions assume signal transition times of 5 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V
and output loading specified in .igure 1.
2. Tested with the load in .igure 2. Transition is measured ±500 mV from steady-state voltage. Not 100% tested.
3. Not 100% tested.
AC TEST CONDITIONS
Parameter
Input Pulse Level
Input Rise and .all Times
Input and Output Timing
and Reference Levels
Output Load
Unit
0V to 3.0V
3 ns
1.5V
See .igures 1 and 2
AC TEST LOADS
480
Ω
5V
5V
480
Ω
OUTPUT
100 pF
Including
jig and
scope
255
Ω
OUTPUT
5 pF
Including
jig and
scope
255
Ω
.igure 1.
.igure 2.
4
Integrated Circuit Solution Inc.
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AC WAVE.ORMS
READ CYCLE NO. 1
(1,2)
t
RC
ADDRESS
t
AA
t
OHA
D
OUT
PREVIOUS DATA VALID
t
OHA
DATA VALID
READ CYCLE NO. 2
(1,3)
t
RC
ADDRESS
t
AA
OE
t
OHA
t
DOE
CS
t
HZOE
t
LZOE
t
ACS
t
LZCS
t
HZCS
DATA VALID
D
OUT
HIGH-Z
Notes:
1.
WE
is HIGH for a Read Cycle.
2. The device is continuously selected.
OE, CS
= V
IL
.
3. Address is valid prior to or coincident with
CS
LOW transitions.
Integrated Circuit Solution Inc.
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