Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
SAB-C161PI-LM CA
MA000733216
PG-MQFP-100-2
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
Substances
silicon
magnesium
silicon
nickel
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7439-95-4
7440-21-3
7440-02-0
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
16.055
0.538
2.331
10.756
344.917
3.785
6.917
200.582
1175.827
19.520
1.857
0.967
2.901
Average
Mass
[%]
0.90
0.03
0.13
0.60
19.30
0.21
0.39
11.22
65.82
1.09
0.10
0.05
0.16
29. August 2013
1786.95 mg
Sum
[%]
0.90
Average
Mass
[ppm]
8985
301
1304
6019
20.06
0.21
193020
2118
3871
112248
77.43
1.09
0.10
658006
10924
1039
541
0.21
1624
2165
1000000
774125
10924
1039
200644
2118
Sum
[ppm]
8985
wire
encapsulation
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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