Serial Peripheral Interface (SPI) with Multi-I/O and
Industrial and Automotive Temperature
Data Sheet
(Preliminary)
Features
Serial Peripheral Interface (SPI)
– SPI Clock polarity and phase modes 0 and 3
– Command subset and footprint compatible with S25FL016K
–
–
–
–
–
Three 256-byte Security Registers with OTP protection
Low supply voltage protection of the entire memory
Top / Bottom relative Block Protection Range, 4 kB to all of memory
8-Byte Unique ID for each device
Non-volatile Status Register bits control protection modes
– Software command protection
– Hardware input signal protection
– Lock-Down until power cycle protection
– OTP protection of security registers
Read
Normal Read (Serial): 50 MHz clock rate
Fast Read (Serial): 108 MHz clock rate
Dual / Quad (Multi-I/O) Read 108 MHz clock rate
54 MB/s maximum continuous data transfer rate
Efficient eXecute-In-Place (XIP)
– Continuous and wrapped read modes
– Serial Flash Discoverable Parameters (SFDP)
–
–
–
–
–
90 nm Floating Gate Technology
Single Supply Voltage: 2.7V to 3.6V
Temperature Ranges
– Industrial (–40°C to +85°C)
– Automotive (–40°C to +105°C)
Program
– Serial-input Page Program (up to 256 bytes)
– Program Suspend and Resume
Erase
–
–
–
–
Uniform sector erase (4 kB)
Uniform block erase (64 kB)
Bulk erase
Erase Suspend and Resume
Package Options
– S25FL116K
– 8-lead SOIC (150 mil) - SOA008
– 8-lead SOIC (208 mil) - SOC008
– 8-contact WSON 5x6 - WND008
– 24-ball BGA 6 mm x 8 mm - FAB024 and FAC024
– KGD / KGW
Cycling Endurance
– 100K Program-Erase cycles on any sector, minimum
Data Retention
– 20-year data retention, typical
Security
Publication Number
S25FL116K_00
Revision
06
Issue Date
November 6, 2013
This document states the current technical specifications regarding the Spansion product(s) described herein. The Preliminary status of this document indicates that product qual-
ification has been completed, and that initial production has begun. Due to the phases of the manufacturing process that require maintaining efficiency and quality, this document
may be revised by subsequent versions or modifications due to changes in technical specifications.
The IC data collection required for this system is as follows:1. LPC1768:2. LPC1114:
3. dp83848:
4. Huawei GTM900 wireless module product description manual:5. 24C02:
6. LCD1602:
7. LM2596-5.0:
8. DS1...
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