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370

Description
136 CONTACT(S), FEMALE, VERTICAL SINGLE PART CARD EDGE CONN, SOLDER
Categorysemiconductor    Other integrated circuit (IC)   
File Size434KB,2 Pages
ManufacturerMaxell
Websitehttp://www.maxell.com
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370 Overview

136 CONTACT(S), FEMALE, VERTICAL SINGLE PART CARD EDGE CONN, SOLDER

300 series
Marvell ARMADA 370 System-on-Chip (SoC)
Family of Integrated Controllers
PRODUCT OVERVIEW
The Marvell
®
ARMADA™ 370 is a highly integrated and high-performance ARM V7-based system-on-chip (SoC) suited
for a variety of home and enterprise applications. With its on-chip floating point engine, 256K L2 cache, and multiple
I/O peripherals, the ARMADA 370 provides new levels of performance, integration, and efficiency, while enabling a
simple system design. The ARMADA 370 is suited for a wide range of applications, including SmartHub for Home,
networked attached storage (NAS) devices, media servers, and wireless access points, as well as networking and
education applications.
The SoCs integrate:
High-performance, dual-issue, and out-of-order ARMv7 CPU with Floating Point Unit (FPU) operating up
to 1.2 GHz (3000 DMIPS)
Single/double precision FPU (VFP3-16) IEEE 754 compliant
32KB-instruction 4-way and 32KB-data 8-way, set-associative L1 cache
256KB unified 4-way, set-associative L2 cache/SRAM
16-bit DDR3/L-1333 memory interface
Two Ethernet networking MACs controllers
Four SERDES lanes with versatile muxing options for SGMII, PCIe2.0, and SATA2.0
Two x1 PCI Express 2.0 interfaces
Two SATA Gen2.0 ports
Two USB 2.0 host/device ports with integrated PHY
Network security engine with various encryption algorithm support
Two TDM channels
SDIO/MMC, NAND flash, two SPI, two TWSI, Device Bus, I2S/SPDIF and two UART interfaces
Two DMA/XOR engines with two independent channels per each engine
RTC and thermal sensor
286-pin HSBGA 19 x 19 mm, 1 mm ball pitch, green-compliant package
The innovative Coherency Fabric architecture provides a coherent interconnect between the CPU and the I/Os. The bus
efficiency also enables a high-frequency, high-bandwidth, and low-latency access time throughout the CPU memory
subsystem.
The on-chip Mbus architecture, a Marvell proprietary crossbar interconnect for non-blocking any-to-any connectivity,
enables concurrent transactions among multiple units. This design results in high system throughput, enabling system
designers to create high-performance products.
BLOCK DIAGRAM
L2/SRAM
256KB-4W
Deposit
ARM v7
CPU
(with FPU)
Advanced
Power Mng.
DDR3/3L
Controller
16 bits
Dev. Bus 8/16
NAND 8/16b,
2 x SPI,
UARTs,
12C, SDIO
4 x IDMA
4 x XOR
I2S/SPDIF
1 Gbps
Security
Engine
2 x USB 2.0
Host/Dev
USB Phy
Coherency Fabric
2 x GbE/
RGMII/
SGMII
2x
SATA II
System Crossbar
PCI-e 2.0
x1
4 lanes SERDES
PCI-e 2.0
x1
Fig 1. Marvell ARMADA 370 SoC Block Diagram
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