• Multilayer Chips Ceramic Capacitors for operating
temperature up to 250°C
• NPO and X7R dielectrics
• Capacitance range: 10pF to 3.3µF
• Voltage range at 20°C: 25 V
DC
to 500 V
DC
Dissipation factor at 200°C
≤1.5% at 1MHz for C ≤ 100pF
≤1.5% at 1kHz for C > 100pF
Dissipation factor at 220°C
≤0.5% at 1MHz for C ≤ 100pF
≤0.5% at 1kHz for C > 100pF
PHYSICAL CHARACTERISTICS
CONSTRUCTION
Selfprotected radial or axial leaded chips capacitors for
through-hole circuits. Mechanical stress is eliminated by
replacement of epoxy by selfprotected ceramic.
MARKING
(clear or coded)
Series, capacitance value, tolerance, voltage, date code.
Dissipation factor at 250°C
≤0.5% at 1MHz for C ≤ 100pF
≤0.5% at 1kHz for C > 100pF
≥ 100,000MΩ or ≥ 1,000MΩ.µF
(whichever is less)
≥ 1,000MΩ or ≥ 10MΩ.µF
(whichever is less)
≥ 200MΩ or ≥ 4MΩ.µF
(whichever is less)
≥ 100MΩ or ≥ 2MΩ.µF
(whichever is less)
≤ 2.5% per decade hour
Insulation resistance at 20°C
under U
RC
Insulation resistance at 200°C
under U
RC
Insulation resistance at 220°C
under U
RC
Insulation resistance at 250°C
under U
RC
Ageing
HOW TO ORDER
TCN2
TCN2X
TCN5X
Series
64
64
64
Exxelia size code
2
Leads spacing code
W
RoHS compliant
180pF
Capacitance
10%
Tolerance
100 V
Rated voltage at20°C
Operating temperature
Up to 200°C
TCE2
= NPO
TCN2
= X7R
Up to 220°C
TCE2X
= NPO
TCN2X
= X7R
Up to 250°C
TCE5X
= NPO
TCN5X
= X7R
12
13
14
15
16
62
63
64
65
66
Available on sizes 62, 63,
-
= No RoHS
64, 65, 66:
-
Available on sizes 62, 63,
2
64, 65, 66:
3
W =
RoHS compliant
Lead free version available
for operating temperature
up to 175°C (contact your
sales representative)
Capacitance value
in clear
NPO:
cap. value ≤ 12pF
±0.25pF
cap. value ≤ 8.2pF
±0.5pF
±1pF
cap. value > 22pF
±1%
cap. value > 12pF
±2%
cap. value > 8.2pF
±5%
±10%
cap. value > 3.9pF
±20%
X7R:
±10%
±20%
25 V
50 V
100 V
500 V
www.exxelia.com
109
info@exxelia.com
Page revised 06/20
HIGH TEMPERATURE
CERAMIC CAPACITORS
TCE / TCN Self-Protected Series
Taping : dimensions
DIMENSIONS in inches (mm)
L
≥ 0.472
(≥ 12)
High Temperature Self-Protected Capacitors
L
T
W
W
≥ 0.472
(≥ 12)
Ø
X
14
-
0.315 ± 0.012
(8 ± 0.3)
0.315 ± 0.012
(8 ± 0.3)
0.15
(3.8)
0.2 ± 0.008
(5.08 ± 0.2)
0.031
(0.8)
NPO
X7R
270pF
15nF
15
-
0.559 ± 0.012
(14.2 ± 0.3)
0.417 ± 0.012
(10.6 ± 0.3)
0.099
(2.5)
0.4 ± 0.008
(10.16 ± 0.2)
0.039
(1)
NPO
X7R
680pF
22nF
16
-
0.559 ± 0.012
(14.2 ± 0.3)
0.417 ± 0.012
(10.6 ± 0.3)
0.15
(3.8)
0.4 ± 0.008
(10.16 ± 0.2)
0.039
(1)
NPO
X7R
680pF
39nF
-
Ø
X
STANDARD RATINGS
Exxelia size code
Leads spacing code
L
Dimensions
inches (mm)
W
T max.
X
Ø ± 10%
Dielectric
Min. Capacitance value
20°C 200°C 220°C 250°C
Rated voltage (U
RC
)
25V
50V
100V
12V
25V
50V
8V
16V
25V
125V
5V
10V
16V
63V
-
6.8nF
3.9nF
-
-
390nF
180nF
-
-
12nF
6.8nF
-
-
680nF
330nF
-
-
22nF
15nF
-
-
1.2µF
680nF
-
-
33nF
22nF
-
12
-
0.284 ± 0.012
(7.2 ± 0.3)
0.244 ± 0.012
(6.2 ± 0.3)
0.099
(2.5)
0.2 ± 0.008
(5.08 ± 0.2)
0.024
(0.6)
NPO
X7R
10pF
3.3nF
13
-
0.315 ± 0.012
(8 ± 0.3)
0.315 ± 0.012
(8 ± 0.3)
0.099
(2.5)
0.2 ± 0.008
(5.08 ± 0.2)
0.024
(0.6)
NPO
X7R
270pF
6.8nF
T
63
2
0.267 max
(6.85 max)
0.1 max
(2.54 max)
0.1
(2.54)
0.5 ± 0.02 0.6 ± 0.02
(12.7 ± 0.5) (15.24 ± 0.5)
0.024
(0.6)
NPO
X7R
1pF
100pF
-
1.8µF
1µF
-
-
56nF
39nF
-
-
3.9µF
1.8µF
-
8.2nF
4.7nF
3.3nF
330pF
180nF
120nF
47nF
-
500V 250V
Exxelia size code
Leads spacing code
L
Dimensions
inches (mm)
W
T max.
X
Ø ± 10%
Dielectric
Min. Capacitance value
Rated voltage (U
RC
)
20°C 200°C 220°C 250°C
25V
50V
100V
12V
25V
50V
8V
16V
25V
5V
10V
16V
27nF
15nF
10nF
NPO
100pF
0.6 ± 0.02
(15.24 ± 0.5)
-
64
2
0.4 max
(10.16 max)
0.15 max
(3.8 max)
0.15
(3.8)
0.7 ± 0.02
(17.78 ± 0.5)
0.024
(0.6)
3
65
-
0.517
(13.2 max)
0.264 max
(6.7 max)
0.158
(4)
0.7 ± 0.02
(17.78 ± 0.5)
0.024
(0.6)
NPO
390pF
X7R
390pF
-
66
2
0.717
(18.2 max)
0.37 max
(9.4 max)
0.158
(4)
0.95 ± 0.02
(24.13 ± 0.5)
0.024
(0.6)
3
1 ± 0.02
(25.4 ± 0.5)
0.9 ± 0.02
(22.86 ± 0.5)
1 ± 0.02
(25.4 ± 0.5)
X7R
180pF
NPO
820pF
X7R
820pF
560nF
330nF
120nF
68nF
39nF
22nF
1.8µF
1µF
330nF
150nF
100nF
56nF
3.3µF
1.8µF
820nF
Available capacitance values:
NPO: E6, E12, E24 (see page 14). Specific values upon request.
X7R: E6, E12 (see page 14). Specific values upon request.
Exxelia can delivery axial leads on size code 262, 263, 264, 265, 266 to allow the customer to obtain the leads spacing needed (leads spacing code = 9). In that case we recommend to bend the connections at a
distance from the ceramic body of 5mm minimum.
The above table defines the standard products, other components may be built upon request.
www.exxelia.com
110
info@exxelia.com
Page revised 06/20
CERAMIC CAPACITORS
General Information
Taping : dimensions
High temperature capacitors are made of class 1 or class 2 ceramic dielectrics
featuring special compositions based upon high purity oxides to reduce ionic
conduction inherent to the presence of atoms such as sodium.
In addition, all quality controls carried out at intermediate and final production
stages (lot acceptance test under U
RC
and insulation resistance measurement
at operating temperature) are the assurance of enhanced reliability.
High temperature capacitors include :
• chip class 1 (CEC 203 to CEC 233) and class 2 (CNC 203 to 233),
• encapsulated radial leads class 1 and 2 (TCE / TCN 201 to 204),
• encapsulated axial leads class 1 and 2 (TCE / TCN 252 to 254),
• selfprotected radial leads class 1 and 2 (TCE / TCN 212 to 216)
and radial leads class 1 and 2 (TCE / TCN 263).
Mechanical stress is eliminated with replacement of epoxy by selfprotected
ceramic. This also allows the increase of the capacitance ranges and improves
the reliability.
• high voltage varnished capacitors (TCH 279 to 285)
• high capacitance value SCT Series.
They are highly recommended for operation at temperatures of up to 200°C.
Capacitors specifically designed for higher operating temperatures (e.g. TCE /
TCN 212 to 216 and TCE / TCN 263 to 266) are also available.
High temperature capacitors are made of class 1 or class 2 ceramic dielectrics
featuring special compositions based upon high purity oxides to reduce ionic
conduction inherent to the presence of atoms such as sodium.
TYPICAL CURVES: CE / CN Series, TCE / TCN Series, TCH Series
NPO: TYPICAL CAPACITANCE VARIATION VERSUS TEMPERATURE
∆C/C (%)
0.8
0.6
100000
1000000
NPO: TYPICAL INSULATION RESISTANCE VERSUS TEMPERATURE
Insulation
resistance (M .µF)
0.4
0.2
10000
0
–0.2
–0.4
1000
100
–0.6
–0.8
–50
–20
10
40
70
100
Typical
130
Limit
160
190
220
250
1
25
50
75
100
125
150
175
200
225
250
10
Temperature (°C)
Temperature (°C)
X7R: TYPICAL CAPACITANCE VARIATION VERSUS TEMPERATURE
∆C/C (%)
X7R: TYPICAL INSULATION RESISTANCE VERSUS TEMPERATURE
Insulation
resistance (M .µF)
10000
5
–5
–15
1000
–25
100
–35
–45
10
–55
–65
–50
–20
10
40
70
100
130
160
190
220
250
1
25
50
75
100
125
150
175
200
225
250
Temperature coefficient without voltage
Temperature coefficient at full rated voltage
Temperature (°C)
Temperature (°C)
www.exxelia.com
98
info@exxelia.com
Page revised 06/20
CERAMIC CAPACITORS
General characteristics
General Information
TYPICAL CURVES: SCT Series
∆C/C VERSUS APPLIED VOLTAGE AND RATED VOLTAGE (U
R
)
∆C/C (%)
CAPACITANCE VERSUS TEMPERATURE
∆C/C (%)
10
0
–10
–20
–30
–40
–50
–60
20
10
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
0
50
100
150
200
U
R
= 100V
250
U
R
= 200V
300
U
R
= 500V
350
400
450
500
–70
–60
–40
–20
0
20
40
60
80
100
120
140
160
180
200
Voltage (V)
Temperature (°C)
DIELECTRIC LOSSES VERSUS TEMPERATURE
DF (%)
3,5
3
2.5
2
1.5
1
0.5
0
–0.5
–60
–40
–20
0
20
40
60
80
100
120
140
160
180
200
INSULATION RESISTANCE VERSUS TEMPERATURE
RI ( .F)
100000
10000
1000
100
10
–60
–40
–20
0
20
40
60
80
100
120
140
160
180
200
Temperature (°C)
Temperature (°C)
www.exxelia.com
99
info@exxelia.com
Page revised 06/20
HIGH TEMPERATURE
CERAMIC CAPACITORS
General Information
Taping : dimensions
MATERIALS EXPERT
For 50 years and as a market leader, EXXELIA’s comprehensive knowledge of
the materials properties and performances have enabled us to design capaci-
tors in Porcelain, NPO, BX, 2C1, BP, X7R and –2200ppm/°C ceramics.
ENVIRONMENT
EXXELIA is committed to applying a robust environmental policy, from product
design through to shipment. To control its environmental footprint and recon-
cile this with the company’ functional imperatives, our environmental policy
provides for the reduction or elimination of hazardous substances. We also
focus on compliance with European Union directives and regulations, notably
REACH and RoHS.
CUSTOM DESIGNS
Our catalog products don’t meet your application?
Based on the valuable experience accumulated over the design of 2,000+ spe-
cific ceramic capacitors, you can trust EXXELIA to define a qualitative custom
solution in a time effective manner.
RoHS COMPLIANCY
SMD CAPACITORS
The capacitor terminations are generally protected by a nickel barrier formed
by electrolytic deposit. This barrier gives chip capacitors leaching performance
far exceeding the requirements of all applicable standards. The nickel barrier
guarantees a minimum resistance to soldering heat for a period of 1 minute at
260°C in a tin-lead (60/40) or tin-lead-silver (62/36/2) bath without noticeable
alteration to the solderability. It also allows repeated soldering-unsoldering
and the longer soldering times required by reflow techniques.
However nickel barrier amplifies thermal shock and is not recommended for
chip sizes equal or greater than CNC Y (30 30) - (C 282 to C 288 - CNC 80 to
CNC 94).
Metallization
Silver-Palladium (or Silver)
CerUflex
(polymer)
Nickel barrier
Tinning:
Tin-Lead
No RoHs
Pure Tin
RoHS (W)
2 - 3 µm
3 - 8 µm
10 - 60 µm
NO OBSOLESCENCE
Choosing a standard or custom EXXELIA product means you won’t have to wor-
Since both projects have certain commercial secrets, I can only share resources related to the development board when sharing my trial experience. I do not have the authority to share information rela...
What command can I use to get the unique ID of nand flash? Is there a standard command? I found some flashes use 0xED on Google, but it doesn't work on k9gag08u0m. Can you give me some advice?...
[size=4]1. Temperature rise test, 45℃ oven environment, input 90,264 when transformer core, wire package does not exceed 110℃, PCB is within 130℃. For the specific values of other components, refer to...
Traditionally, a mobile phone that supports making calls, sending text messages, network services, and APP applications generally consists of five parts: radio frequency, baseband, power management, p...
What do you think? When you hold a paper leaflet of a forum, what kind of content will attract you to pay attention to this forum? Recently, a friend reminded me of this, and I want to hear your sugge...
The editor has listed as many easily accessible resources as possible for you. When developing applications based on MSP430, you can refer to the MSP430-related Getting Started Guide, watch practical ...
This program is written to simulate the serial port hardware mechanism. When used, a timed interrupt can be set with a time interval of 1/4 baud rate. The receiving function is called once for ea...[Details]
introduction
1 The significance of using RTOS on MSP430
It is understandable that it is meaningless to use RTOS on MSP430. Because the hardware resources of MSP430 are limited (for exampl...[Details]
Do you often have to add brake fluid to your car's brakes? The fact that you need to pump out the brake fluid to make sure there is no gas in the brake fluid line may not be done by the car owner h...[Details]
For a long time, due to the limitation of hardware conditions, the display devices of traditional small handheld devices such as PDA are usually monochrome LCD, and the user interface is very simpl...[Details]
DSP (digital signal processor) is used more and more frequently in today's engineering applications. There are three main reasons for this: first, it has powerful computing power and is capable of ...[Details]
Battery life is critical for portable applications. For applications such as smoke detectors, security devices, and thermostats, factory-installed batteries need to last for more than 10 years. The...[Details]
With the rapid development of intelligent control technology, computers and information technology, the trend of information appliances IA (Information Application), computers and communications integ...[Details]
introduction
MEMS is a high-tech that has flourished on the basis of integrated circuit production technology and dedicated micro-electromechanical processing methods. Pressure sensors develop...[Details]
Abstract: With the development and construction of BeiDou II system, China will shift from the situation dominated by GPS to the situation dominated by BeiDou II global navigation system independen...[Details]
0 Introduction
Ultrasonic waves
are mechanical waves with a frequency of more than 20KHz, and the propagation speed in the air is about 340 m/s (at 20°C). Ultrasonic waves can be gene...[Details]
Abstract: In order to realize wireless automatic alarm and monitoring of major safety places, based on the basic principle of pyroelectric infrared sensing, a detector for receiving infrared radia...[Details]
a. Keep the battery clean, wipe off the spilled electrolyte, contaminated dirt and dust in time; keep the poles and terminal clamps clean and in good contact, and apply vaseline or butter to preven...[Details]
The production process of lithium batteries does not mention the previous processes such as material preparation, winding, liquid injection, and packaging, but only talks about the final formation ...[Details]
1. Brief Introduction
With the continuous development and improvement of single-chip microcomputer technology, single-chip microcomputers have been widely used in all walks of life, and ...[Details]
0 Introduction
This paper designs a dot matrix LED text display screen that is easy to update, expandable, and low-cost. The ways to reduce costs are: ① Use the Bluetooth data transmission...[Details]
NXP MCU
京公网安备 11010802033920号
EEWORLD
