IS25LQ512B datasheet, PDF - EEWORLD Datasheet

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IS25LQ512B: Description3V QUAD SERIAL FLASH MEMORY WITH MULTI-I/O SPI; File Size811KB，66 Pages; ManufacturerISSI(Integrated Silicon Solution Inc.); Websitehttp://www.issi.com/

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IS25LQ512B Overview

3V QUAD SERIAL FLASH MEMORY WITH MULTI-I/O SPI

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IS25LQ025B

IS25LQ512B

IS25LQ010B

IS25LQ020B

IS25LQ040B

256K/512K/1M/2M/4MBIT

3V QUAD SERIAL FLASH MEMORY WITH

MULTI-I/O SPI

IS25LQ025/512/010/020/040B

TABLE OF CONTENTS

FEATURES ..........................................................................................................................................................2

GENERAL DESCRIPTION...................................................................................................................................2

PIN CONFIGURATION ................................................................................................................................5

PIN DESCRIPTIONS ....................................................................................................................................6

BLOCK DIAGRAM ........................................................................................................................................7

SPI MODES DESCRIPTION ........................................................................................................................8

SYSTEM CONFIGURATION......................................................................................................................10

5.1 BLOCK/SECTOR ADDRESSES ...........................................................................................................10

REGISTERS ...............................................................................................................................................12

6.1. STATUS REGISTER............................................................................................................................12

6.2. FUNCTION REGISTER .......................................................................................................................15

PROTECTION MODE ................................................................................................................................16

7.1 HARDWARE WRITE PROTECTION ....................................................................................................16

7.2 SOFTWARE WRITE PROTECTION ....................................................................................................16

DEVICE OPERATION ................................................................................................................................17

8.1 READ DATA OPERATION (RD, 03h) ...................................................................................................18

8.2 FAST READ DATA OPERATION (FR, 0Bh) ........................................................................................20

8.3 HOLD OPERATION ..............................................................................................................................21

8.4 FAST READ DUAL I/O OPERATION (FRDIO, BBh) ............................................................................21

8.5 FAST READ DUAL OUTPUT OPERATION (FRDO, 3Bh) ...................................................................24

8.6 FAST READ QUAD OUTPUT (FRQO, 6Bh) ........................................................................................26

8.7 FAST READ QUAD I/O OPERATION (FRQIO, EBh) ...........................................................................28

8.8 PAGE PROGRAM OPERATION (PP, 02h) ..........................................................................................30

8.9 QUAD INPUT PAGE PROGRAM OPERATION (PPQ, 38h) ................................................................31

8.10 ERASE OPERATION ..........................................................................................................................32

8.11 SECTOR ERASE OPERATION (SER, D7h/20h) ...............................................................................32

8.12 BLOCK ERASE OPERATION (BER32K:52h, BER64K:D8h).............................................................33

8.13 CHIP ERASE OPERATION (CER, C7h/60h) .....................................................................................34

8.14 WRITE ENABLE OPERATION (WREN, 06h).....................................................................................35

8.15 WRITE DISABLE OPERATION (WRDI, 04h) .....................................................................................35

8.16 READ STATUS REGISTER OPERATION (RDSR, 05h) ...................................................................36

8.17 WRITE STATUS REGISTER OPERATION (WRSR, 01h) .................................................................36

8.18 READ FUNCTION REGISTER OPERATION (RDFR, 48h) ...............................................................37

8.19 WRITE FUNCTION REGISTER OPERATION (WRFR, 42h) .............................................................37

8.20 PROGRAM/ERASE SUSPEND & RESUME ......................................................................................38

8.21 DEEP POWER DOWN (DP, B9h) ......................................................................................................39

8.22 RELEASE DEEP POWER DOWN (RDPD, ABh) ...............................................................................41

Integrated Silicon Solution, Inc.- www.issi.com

Rev.A

12/12/2014

IS25LQ025/512/010/020/040B

8.23 READ PRODUCT IDENTIFICATION (RDID, ABh) ............................................................................42

8.24 READ PRODUCT IDENTIFICATION BY JEDEC ID OPERATION (RDJDID, 9Fh) ...........................43

8.25 READ DEVICE MANUFACTURER AND DEVICE ID OPERATION (RDMDID, 90h) ........................44

8.26 READ UNIQUE ID NUMBER (RDUID, 4Bh).......................................................................................45

8.27 READ SFDP OPERATION (RDSFDP, 5Ah).......................................................................................46

8.28 SOFTWARE RESET (RESET-ENABLE (RSTEN, 66h) AND RESET (RST, 99h) .............................47

8.29 SECURITY INFORMATION ROW (OTP AREA) ................................................................................48

8.30 INFORMATION ROW PROGRAM OPERATION (IRP, 62h)..............................................................48

8.31 INFORMATION ROW READ OPERATION (IRRD, 68h) ...................................................................50

ELECTRICAL CHARACTERISTICS ..........................................................................................................51

9.1 ABSOLUTE MAXIMUM RATINGS

(1)

....................................................................................................51

9.2 OPERATING RANGE ...........................................................................................................................51

9.3 DC CHARACTERISTICS ......................................................................................................................51

9.4 AC MEASUREMENT CONDITIONS ....................................................................................................52

9.5 AC CHARACTERISTICS ......................................................................................................................53

9.6 SERIAL INPUT/OUTPUT TIMING ........................................................................................................54

9.7 POWER-UP AND POWER-DOWN ......................................................................................................55

9.8 PROGRAM/ERASE PERFORMANCE .................................................................................................56

9.9 RELIABILITY CHARACTERISTICS......................................................................................................56

10. PACKAGE TYPE INFORMATION .............................................................................................................57

10.1 8-Pin JEDEC 208mil Broad Small Outline Integrated Circuit (SOIC) Package (JB).........................57

10.2 8-Pin JEDEC 150mil Broad Small Outline Integrated Circuit (SOIC) Package (JN) ........................58

10.3 8-Pin 150mil TSSOP Package (JD) ..................................................................................................59

10.4 8-Pin 150mil VVSOP Package (JV) ..................................................................................................60

10.5 8-Contact Ultra-Thin Small Outline No-Lead (WSON) Package 6x5mm (JK) ..................................62

10.6 8-Contact Ultra-Thin Small Outline No-Lead (USON) Package 2x3mm (JU)...................................63

11. ORDERING INFORMATION ......................................................................................................................64

Integrated Silicon Solution, Inc.- www.issi.com

Rev.A

12/12/2014

IS25LQ512B Related Products

	IS25LQ512B	IS25LQ025B	IS25LQ040B	IS25LQ020B
Description	3V QUAD SERIAL FLASH MEMORY WITH MULTI-I/O SPI	3V QUAD SERIAL FLASH MEMORY WITH MULTI-I/O SPI	3V QUAD SERIAL FLASH MEMORY WITH MULTI-I/O SPI	3V QUAD SERIAL FLASH MEMORY WITH MULTI-I/O SPI

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