IS25LQ025B
IS25LQ512B
IS25LQ010B
IS25LQ020B
IS25LQ040B
256K/512K/1M/2M/4MBIT
3V QUAD SERIAL FLASH MEMORY WITH
MULTI-I/O SPI
IS25LQ025/512/010/020/040B
256K/512K/1M/2M/4MBIT
3V QUAD SERIAL FLASH MEMORY WITH MULTI-I/O SPI
FEATURES
Industry Standard Serial Interface
-
IS25LQ040B: 4Mbit/ 512Kbyte
-
IS25LQ020B: 2Mbit/ 256Kbyte
-
IS25LQ010B: 1Mbit/ 128Kbyte
-
IS25LQ512B: 512Kbit/ 64Kbyte
-
IS25LQ025B: 256Kbit/ 32Kbyte
-
256-bytes per Programmable Page Standard
-
Standard SPI/Dual/Quad Multi-I/O SPI
-
Supports Serial Flash Discoverable Parameters
(SFDP)
High Performance Serial Flash (SPI)
-
104 MHz SPI/Dual/Quad Multi-I/O SPI
-
416 MHz equivalent Quad SPI
-
52MB/S Continuous Data Throughput
-
Supports SPI Modes 0 and 3
-
More than 100,000 erase/program cycles
-
More than 20-year data retention
Efficient Read and Program modes
-
Low Instruction Overhead Operations
-
Continuous data read with Byte Wrap around
-
Allows XIP operations (execute in place)
-
Outperforms X16 Parallel Flash
Flexible & Cost Efficient Memory Architecture
-
Uniform 4Kbyte Sectors or 32/64Kbyte Blocks
-
Flexible 4, 32, 64Kbyte, or Chip Erase
-
Standard Page Program 1 to 256 bytes
-
Program/Erase Suspend and Resume
Low Power with Wide Temp. Ranges
-
Single 2.3V to 3.6V Voltage Supply
-
10 mA Active Read Current
-
8 µA Standby Current
-
Deep Power Down
-
Temp Grades:
Extended: -40°C to +105°C
V Grade: -40°C to +125°C
Auto Grade: -40°C to +125°C
Advanced Security Protection
-
Software and Hardware Write Protection
-
4x256-Byte dedicated security area with
user-lockable bits, (OTP) One Time
Programmable Memory
-
128 bit Unique ID for each device
Industry Standard Pin-out & Pb-Free Packages
-
JB = 8-pin SOIC 208mil
-
JN = 8-pin SOIC 150mil
-
JD = 8-pin TSSOP 150mil
-
JV = 8-pin VVSOP 150mil
-
JK = 8-contact WSON 6x5mm
-
JU = 8-contact USON 2x3mm
-
KGD (call factory)
Note1: IS25LQ040B (not available in JD)
1
GENERAL DESCRIPTION
The IS25LQ025/512/010/020/040B (256K/512K/1M/2M/4Mbit) Serial Flash memory offers a storage solution with
flexibility and performance in a simplified pin count package. ISSI’s “Industry Standard Serial Interface” is for systems
that have limited space, pins, and power. The IS25LQ025/512/010/020/040B is accessed through a 4-wire SPI
Interface consisting of a Serial Data Input (SI), Serial Data Output (SO), Serial Clock (SCK), and Chip Enable (CE#)
pins, which also serve as multi-function I/O pins in Dual and Quad modes (see pin descriptions). The IS25xQ series of
Flash is ideal for code shadowing to RAM, execute in place (XIP) operations, and storing non-volatile data.
The memory array is organized into programmable pages of 256-bytes each. The IS25LQ025/512/010/020/040B
supports page program mode where 1 to 256 bytes of data can be programmed into the memory with one command.
Pages can be erased in groups of 4Kbyte sectors, 32Kbyte blocks, 64Kbyte blocks, and/or the entire chip. The uniform
sectors and blocks allow greater flexibility for a variety of applications requiring solid data retention.
The device supports the standard Serial Peripheral Interface (SPI), Dual/Quad output (SPI), and Dual/Quad I/O (SPI).
Clock frequencies of up to 104MHz for all read modes allow for equivalent clock rates of up to 416MHz (104MHz x 4)
allowing up to 52MBytes/S of throughput. These transfer rates can outperform 16-bit Parallel Flash memories allowing
for efficient memory access for a XIP (execute in place) operation. The IS25LQ025/512/010/020/040B is manufactured
using industry leading non-volatile memory technology and offered in industry standard lead-free packages. See
Ordering Information for the density and package combinations available.
Integrated Silicon Solution, Inc.- www.issi.com
Rev.A
12/12/2014
2
IS25LQ025/512/010/020/040B
TABLE OF CONTENTS
FEATURES ..........................................................................................................................................................2
GENERAL DESCRIPTION...................................................................................................................................2
1.
2.
3.
4.
5.
6.
PIN CONFIGURATION ................................................................................................................................5
PIN DESCRIPTIONS ....................................................................................................................................6
BLOCK DIAGRAM ........................................................................................................................................7
SPI MODES DESCRIPTION ........................................................................................................................8
SYSTEM CONFIGURATION......................................................................................................................10
5.1 BLOCK/SECTOR ADDRESSES ...........................................................................................................10
REGISTERS ...............................................................................................................................................12
6.1. STATUS REGISTER............................................................................................................................12
6.2. FUNCTION REGISTER .......................................................................................................................15
7.
PROTECTION MODE ................................................................................................................................16
7.1 HARDWARE WRITE PROTECTION ....................................................................................................16
7.2 SOFTWARE WRITE PROTECTION ....................................................................................................16
8.
DEVICE OPERATION ................................................................................................................................17
8.1 READ DATA OPERATION (RD, 03h) ...................................................................................................18
8.2 FAST READ DATA OPERATION (FR, 0Bh) ........................................................................................20
8.3 HOLD OPERATION ..............................................................................................................................21
8.4 FAST READ DUAL I/O OPERATION (FRDIO, BBh) ............................................................................21
8.5 FAST READ DUAL OUTPUT OPERATION (FRDO, 3Bh) ...................................................................24
8.6 FAST READ QUAD OUTPUT (FRQO, 6Bh) ........................................................................................26
8.7 FAST READ QUAD I/O OPERATION (FRQIO, EBh) ...........................................................................28
8.8 PAGE PROGRAM OPERATION (PP, 02h) ..........................................................................................30
8.9 QUAD INPUT PAGE PROGRAM OPERATION (PPQ, 38h) ................................................................31
8.10 ERASE OPERATION ..........................................................................................................................32
8.11 SECTOR ERASE OPERATION (SER, D7h/20h) ...............................................................................32
8.12 BLOCK ERASE OPERATION (BER32K:52h, BER64K:D8h).............................................................33
8.13 CHIP ERASE OPERATION (CER, C7h/60h) .....................................................................................34
8.14 WRITE ENABLE OPERATION (WREN, 06h).....................................................................................35
8.15 WRITE DISABLE OPERATION (WRDI, 04h) .....................................................................................35
8.16 READ STATUS REGISTER OPERATION (RDSR, 05h) ...................................................................36
8.17 WRITE STATUS REGISTER OPERATION (WRSR, 01h) .................................................................36
8.18 READ FUNCTION REGISTER OPERATION (RDFR, 48h) ...............................................................37
8.19 WRITE FUNCTION REGISTER OPERATION (WRFR, 42h) .............................................................37
8.20 PROGRAM/ERASE SUSPEND & RESUME ......................................................................................38
8.21 DEEP POWER DOWN (DP, B9h) ......................................................................................................39
8.22 RELEASE DEEP POWER DOWN (RDPD, ABh) ...............................................................................41
Integrated Silicon Solution, Inc.- www.issi.com
Rev.A
12/12/2014
3
IS25LQ025/512/010/020/040B
8.23 READ PRODUCT IDENTIFICATION (RDID, ABh) ............................................................................42
8.24 READ PRODUCT IDENTIFICATION BY JEDEC ID OPERATION (RDJDID, 9Fh) ...........................43
8.25 READ DEVICE MANUFACTURER AND DEVICE ID OPERATION (RDMDID, 90h) ........................44
8.26 READ UNIQUE ID NUMBER (RDUID, 4Bh).......................................................................................45
8.27 READ SFDP OPERATION (RDSFDP, 5Ah).......................................................................................46
8.28 SOFTWARE RESET (RESET-ENABLE (RSTEN, 66h) AND RESET (RST, 99h) .............................47
8.29 SECURITY INFORMATION ROW (OTP AREA) ................................................................................48
8.30 INFORMATION ROW PROGRAM OPERATION (IRP, 62h)..............................................................48
8.31 INFORMATION ROW READ OPERATION (IRRD, 68h) ...................................................................50
9.
ELECTRICAL CHARACTERISTICS ..........................................................................................................51
9.1 ABSOLUTE MAXIMUM RATINGS
(1)
....................................................................................................51
9.2 OPERATING RANGE ...........................................................................................................................51
9.3 DC CHARACTERISTICS ......................................................................................................................51
9.4 AC MEASUREMENT CONDITIONS ....................................................................................................52
9.5 AC CHARACTERISTICS ......................................................................................................................53
9.6 SERIAL INPUT/OUTPUT TIMING ........................................................................................................54
9.7 POWER-UP AND POWER-DOWN ......................................................................................................55
9.8 PROGRAM/ERASE PERFORMANCE .................................................................................................56
9.9 RELIABILITY CHARACTERISTICS......................................................................................................56
10. PACKAGE TYPE INFORMATION .............................................................................................................57
10.1 8-Pin JEDEC 208mil Broad Small Outline Integrated Circuit (SOIC) Package (JB).........................57
10.2 8-Pin JEDEC 150mil Broad Small Outline Integrated Circuit (SOIC) Package (JN) ........................58
10.3 8-Pin 150mil TSSOP Package (JD) ..................................................................................................59
10.4 8-Pin 150mil VVSOP Package (JV) ..................................................................................................60
10.5 8-Contact Ultra-Thin Small Outline No-Lead (WSON) Package 6x5mm (JK) ..................................62
10.6 8-Contact Ultra-Thin Small Outline No-Lead (USON) Package 2x3mm (JU)...................................63
11. ORDERING INFORMATION ......................................................................................................................64
Integrated Silicon Solution, Inc.- www.issi.com
Rev.A
12/12/2014
4
IS25LQ025/512/010/020/040B
1. PIN CONFIGURATION
CE#
1
8
Vcc
CE#
1
8
Vcc
7
HOLD# (IO3)
6
SCK
SO (IO1)
2
7
HOLD# (IO3)
SO (IO1)
2
WP# (IO2)
3
6
SCK
WP# (IO2)
3
GND
4
5
SI (IO0
)
GND
4
5
SI (IO0
)
8-contact WSON 6x5mm (Package: JK)
8-pin SOIC 208mil (Package: JB)
8-pin SOIC 150mil (Package: JN)
8-pin TSSOP 150mil (Package: JD)
8-pin VVSOP 150mil (Package: JV)
CE#
SO (IO1)
WP# (IO2)
GND
1
2
3
4
8
7
6
5
Vcc
HOLD# (IO3)
SCK
SI (IO0
)
8-contact USON 2x3mm (Package: JU)
Integrated Silicon Solution, Inc.- www.issi.com
Rev.A
12/12/2014
5
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