IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,FP,14PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Objectid | 1436327583 |
| Reach Compliance Code | compliant |
| JESD-30 code | R-XDFP-F14 |
| JESD-609 code | e0 |
| Logic integrated circuit type | LOGIC CIRCUIT |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL14,.3 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 Class C |
| surface mount | YES |
| technology | BIPOLAR |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| DS7811W/883C | DS7812W/883 | DS7812W/883B | DS7812W/883C | DS7811W | DS7811W/883 | DS7812W | |
|---|---|---|---|---|---|---|---|
| Description | IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,FP,14PIN,CERAMIC | IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,FP,14PIN,CERAMIC | IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,FP,14PIN,CERAMIC | IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,FP,14PIN,CERAMIC | IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,FP,14PIN,CERAMIC | IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,FP,14PIN,CERAMIC | IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,FP,14PIN,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Objectid | 1436327583 | 1436327640 | 1436327628 | 1436327633 | 1436327595 | 1436327589 | 1436327646 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| JESD-30 code | R-XDFP-F14 | R-XDFP-F14 | R-XDFP-F14 | R-XDFP-F14 | R-XDFP-F14 | R-XDFP-F14 | R-XDFP-F14 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Logic integrated circuit type | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT |
| Number of terminals | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DFP | DFP | DFP | DFP | DFP | DFP | DFP |
| Encapsulate equivalent code | FL14,.3 | FL14,.3 | FL14,.3 | FL14,.3 | FL14,.3 | FL14,.3 | FL14,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | YES | YES | YES | YES | YES | YES | YES |
| technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT | FLAT | FLAT | FLAT | FLAT | FLAT | FLAT |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Filter level | MIL-STD-883 Class C | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | MIL-STD-883 Class C | - | 38535Q/M;38534H;883B | - |
京公网安备 11010802033920号
EEWORLD
