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DS7811W/883

Description
IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,FP,14PIN,CERAMIC
Categorylogic    logic   
File Size151KB,3 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
Stay tuned Parametric Compare

DS7811W/883 Overview

IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,FP,14PIN,CERAMIC

DS7811W/883 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Objectid1436327589
Reach Compliance Codecompliant
JESD-30 codeR-XDFP-F14
JESD-609 codee0
Logic integrated circuit typeLOGIC CIRCUIT
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC
encapsulated codeDFP
Encapsulate equivalent codeFL14,.3
Package shapeRECTANGULAR
Package formFLATPACK
Certification statusNot Qualified
Filter level38535Q/M;38534H;883B
surface mountYES
technologyBIPOLAR
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationDUAL

DS7811W/883 Related Products

DS7811W/883 DS7812W/883 DS7812W/883B DS7812W/883C DS7811W DS7811W/883C DS7812W
Description IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,FP,14PIN,CERAMIC IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,FP,14PIN,CERAMIC IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,FP,14PIN,CERAMIC IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,FP,14PIN,CERAMIC IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,FP,14PIN,CERAMIC IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,FP,14PIN,CERAMIC IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,FP,14PIN,CERAMIC
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Objectid 1436327589 1436327640 1436327628 1436327633 1436327595 1436327583 1436327646
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant
JESD-30 code R-XDFP-F14 R-XDFP-F14 R-XDFP-F14 R-XDFP-F14 R-XDFP-F14 R-XDFP-F14 R-XDFP-F14
JESD-609 code e0 e0 e0 e0 e0 e0 e0
Logic integrated circuit type LOGIC CIRCUIT LOGIC CIRCUIT LOGIC CIRCUIT LOGIC CIRCUIT LOGIC CIRCUIT LOGIC CIRCUIT LOGIC CIRCUIT
Number of terminals 14 14 14 14 14 14 14
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
Package body material CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC
encapsulated code DFP DFP DFP DFP DFP DFP DFP
Encapsulate equivalent code FL14,.3 FL14,.3 FL14,.3 FL14,.3 FL14,.3 FL14,.3 FL14,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
surface mount YES YES YES YES YES YES YES
technology BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR
Temperature level MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form FLAT FLAT FLAT FLAT FLAT FLAT FLAT
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Filter level 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B MIL-STD-883 Class C - MIL-STD-883 Class C -
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