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3D3D8G32YB2496I

Description
DDR DRAM, 256MX32, CMOS, PBGA136, BGA-136
Categorystorage    storage   
File Size166KB,2 Pages
Manufacturer3D PLUS
Download Datasheet Parametric Compare View All

3D3D8G32YB2496I Overview

DDR DRAM, 256MX32, CMOS, PBGA136, BGA-136

3D3D8G32YB2496I Parametric

Parameter NameAttribute value
Objectid1329860106
package instructionFBGA,
Reach Compliance Codeunknown
ECCN codeEAR99
access modeMULTI BANK PAGE BURST
Other featuresALSO OPERATES AT 1.5V; SELF REFRESH; SEATED HGT-NOM
JESD-30 codeR-PBGA-B136
length14.8 mm
memory density8589934592 bit
Memory IC TypeDDR DRAM
memory width32
Number of functions1
Number of ports1
Number of terminals136
word count268435456 words
character code256000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize256MX32
Package body materialPLASTIC/EPOXY
encapsulated codeFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, FINE PITCH
Maximum seat height3.3 mm
self refreshYES
Maximum supply voltage (Vsup)1.45 V
Minimum supply voltage (Vsup)1.283 V
Nominal supply voltage (Vsup)1.35 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
width10.8 mm
MEMORY MODULE
DDR3 SDRam 256Mx32-BGA
DDR3 Synchronous Dynamic Ram
3D3D8G32YB2496
8Gbit DDR3 SDRam organized as 256Mx32
Pin Assignment (Top View)
Main applications:
Embedded Systems
Workstations
Servers
Super Computers
Test Systems
BGA 136 (Pitch : 0.80 mm)
Features and Benefits
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JEDEC-standard ball-out
Combines two 4Gb x16 devices in one package
Vdd=VddQ = +1.35V, backward compatible to
1.5V operation
Differential bidirectional data strobe
8n-bit prefetch architecture
8 internal banks per memory
Nominal and dynamic on-die termination
Programmable CAS latency
Posted CAS additive latency
Fixed burst lengths of 8 and burst chp (BC) of 4
Selectable BC4 or BL8 on-the-fly
Self refresh mode
Write leveling
Multipurpose register
Output driver calibration
Clock rate available : 1066, 1333 and 1600 Mbps
Commercial, Industrial and Military temperature
range.
FUNCTIONAL Block Diagram
DM2
DQS2, DQS2#
DQ[23 :16]
DM0
DQS0, DQS0#
DQ[7 : 0]
DM1
DQS1, DQS1#
DQ[15 :8]
DM3
DQS3, DQS3#
DQ[31 : 24]
1
256Mx16
ZQ0
General description
3D Plus offers a new 8Gbit
DDR3 SDRAM
cube with a
compatible JEDEC standard footprint.
This product embeds 2 chips with a capacity of 4Gb
(256Mx16) each.
Our products are available at 1066, 1333 and 1600 Mbps in
Commercial, Industrial and Military temperature range.
Thanks to the high density patented technology the
memories are embedded in a small form factor device
without compromising electrical or thermal performance.
This device is ideal for high density memory applications
that require high speed transfer and compatibility with
standard servers and networking equipment.
DDR3 Memory Module
2
256Mx16
ZQ1
(All other signals are common to the devices)
PRELIMINARY
3D Plus SA reserves the right to cancel product or specifications without notice
3DFP-0496-REV 1 - AUGUST 2012

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Description DDR DRAM, 256MX32, CMOS, PBGA136, BGA-136 DRAM DRAM DRAM DRAM DDR DRAM, 256MX32, CMOS, PBGA136, BGA-136 DDR DRAM, 256MX32, CMOS, PBGA136, BGA-136 DDR DRAM, 256MX32, CMOS, PBGA136, BGA-136 DDR DRAM, 256MX32, CMOS, PBGA136, BGA-136
Objectid 1329860106 114111909 114111907 114111910 114111911 1329860105 1842937402 1842937466 1842937404
package instruction FBGA, , , , , FBGA, FBGA, FBGA, FBGA,
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
access mode MULTI BANK PAGE BURST - - - - MULTI BANK PAGE BURST MULTI BANK PAGE BURST MULTI BANK PAGE BURST MULTI BANK PAGE BURST
Other features ALSO OPERATES AT 1.5V; SELF REFRESH; SEATED HGT-NOM - - - - ALSO OPERATES AT 1.5V; SELF REFRESH; SEATED HGT-NOM SELF REFRESH; SEATED HGT-NOM SELF REFRESH; SEATED HGT-NOM SELF REFRESH; SEATED HGT-NOM
JESD-30 code R-PBGA-B136 - - - - R-PBGA-B136 R-PBGA-B136 R-PBGA-B136 R-PBGA-B136
length 14.8 mm - - - - 14.8 mm 14.8 mm 14.8 mm 14.8 mm
memory density 8589934592 bit - - - - 8589934592 bit 8589934592 bit 8589934592 bit 8589934592 bit
Memory IC Type DDR DRAM - - - - DDR DRAM DDR DRAM DDR DRAM DDR DRAM
memory width 32 - - - - 32 32 32 32
Number of functions 1 - - - - 1 1 1 1
Number of ports 1 - - - - 1 1 1 1
Number of terminals 136 - - - - 136 136 136 136
word count 268435456 words - - - - 268435456 words 268435456 words 268435456 words 268435456 words
character code 256000000 - - - - 256000000 256000000 256000000 256000000
Operating mode SYNCHRONOUS - - - - SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C - - - - 70 °C 70 °C 85 °C 125 °C
organize 256MX32 - - - - 256MX32 256MX32 256MX32 256MX32
Package body material PLASTIC/EPOXY - - - - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code FBGA - - - - FBGA FBGA FBGA FBGA
Package shape RECTANGULAR - - - - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, FINE PITCH - - - - GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH
Maximum seat height 3.3 mm - - - - 3.3 mm 3.3 mm 3.3 mm 3.3 mm
self refresh YES - - - - YES YES YES YES
Maximum supply voltage (Vsup) 1.45 V - - - - 1.45 V 1.45 V 1.45 V 1.45 V
Minimum supply voltage (Vsup) 1.283 V - - - - 1.283 V 1.283 V 1.283 V 1.283 V
Nominal supply voltage (Vsup) 1.35 V - - - - 1.35 V 1.35 V 1.35 V 1.35 V
surface mount YES - - - - YES YES YES YES
technology CMOS - - - - CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL - - - - COMMERCIAL COMMERCIAL INDUSTRIAL MILITARY
Terminal form BALL - - - - BALL BALL BALL BALL
Terminal pitch 0.8 mm - - - - 0.8 mm 0.8 mm 0.8 mm 0.8 mm
Terminal location BOTTOM - - - - BOTTOM BOTTOM BOTTOM BOTTOM
width 10.8 mm - - - - 10.8 mm 10.8 mm 10.8 mm 10.8 mm

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