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MX25L4006EZNI-12G

Description
2M X 2 FLASH 2.7V PROM, PDSO8
Categorystorage    storage   
File Size1MB,53 Pages
ManufacturerMacronix
Websitehttp://www.macronix.com/en-us/Pages/default.aspx
Environmental Compliance
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MX25L4006EZNI-12G Overview

2M X 2 FLASH 2.7V PROM, PDSO8

MX25L4006EZNI-12G Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Parts packaging codeQFN
package instructionHVSON, SOLCC8,.25
Contacts8
Reach Compliance Codeunknow
ECCN codeEAR99
Factory Lead Time16 weeks
Spare memory width1
Maximum clock frequency (fCLK)86 MHz
Data retention time - minimum20
Durability100000 Write/Erase Cycles
JESD-30 codeR-PDSO-N8
length6 mm
memory density4194304 bi
Memory IC TypeFLASH
memory width2
Number of functions1
Number of terminals8
word count2097152 words
character code2000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize2MX2
Package body materialPLASTIC/EPOXY
encapsulated codeHVSON
Encapsulate equivalent codeSOLCC8,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3/3.3 V
Programming voltage2.7 V
Certification statusNot Qualified
Maximum seat height0.8 mm
Serial bus typeSPI
Maximum standby current0.00001 A
Maximum slew rate0.02 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
typeNOR TYPE
width5 mm
write protectHARDWARE/SOFTWARE
Base Number Matches1
MX25L4006E
MX25L4006E
3V, 4M-BIT [x 1/x 2]
CMOS SERIAL FLASH MEMORY
Key Features
• Hold Feature
• Low Power Consumption
• Auto Erase and Auto Program Algorithms
• Provides sequential read operation on whole chip
P/N: PM1576
1
REV. 1.6, OCT. 24, 2014

MX25L4006EZNI-12G Related Products

MX25L4006EZNI-12G MX25L4006EM1I-12G MX25L4006EM2I-12G MX25L4006EPI-12G MX25L4006EZUI-12G
Description 2M X 2 FLASH 2.7V PROM, PDSO8 2M X 2 FLASH 2.7V PROM, PDSO8 2M X 2 FLASH 2.7V PROM, PDSO8 2M X 2 FLASH 2.7V PROM, PDIP8 FLASH 2.7V PROM
Is it Rohs certified? conform to conform to conform to conform to conform to
package instruction HVSON, SOLCC8,.25 SOP, SOP8,.25 SOP, SOP8,.3 DIP, DIP8,.3 HVSON, SOLCC8,.12,20
Reach Compliance Code unknow unknow unknow unknow unknow
Spare memory width 1 1 1 1 1
Maximum clock frequency (fCLK) 86 MHz 86 MHz 86 MHz 86 MHz 86 MHz
Data retention time - minimum 20 20 20 20 20
Durability 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles
JESD-30 code R-PDSO-N8 R-PDSO-G8 R-PDSO-G8 R-PDIP-T8 R-PDSO-N8
length 6 mm 4.9 mm 5.28 mm 9.27 mm 3 mm
memory density 4194304 bi 4194304 bi 4194304 bi 4194304 bi 4194304 bi
Memory IC Type FLASH FLASH FLASH FLASH FLASH
memory width 2 2 2 2 2
Number of functions 1 1 1 1 1
Number of terminals 8 8 8 8 8
word count 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words
character code 2000000 2000000 2000000 2000000 2000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C
organize 2MX2 2MX2 2MX2 2MX2 2MX2
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code HVSON SOP SOP DIP HVSON
Encapsulate equivalent code SOLCC8,.25 SOP8,.25 SOP8,.3 DIP8,.3 SOLCC8,.12,20
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE SMALL OUTLINE IN-LINE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial SERIAL SERIAL SERIAL SERIAL SERIAL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V
Programming voltage 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 0.8 mm 1.75 mm 2.16 mm 5.33 mm 0.6 mm
Serial bus type SPI SPI SPI SPI SPI
Maximum standby current 0.00001 A 0.00001 A 0.00001 A 0.00001 A 0.00001 A
Maximum slew rate 0.02 mA 0.02 mA 0.02 mA 0.02 mA 0.02 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3 V
surface mount YES YES YES NO YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form NO LEAD GULL WING GULL WING THROUGH-HOLE NO LEAD
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 2.54 mm 0.5 mm
Terminal location DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
type NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
width 5 mm 3.9 mm 5.23 mm 7.62 mm 2 mm
write protect HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE
Parts packaging code QFN SOIC SOIC DIP -
Contacts 8 8 8 8 -
ECCN code EAR99 3A991.B.1.A EAR99 EAR99 -
Factory Lead Time 16 weeks 2 weeks 16 weeks - 16 weeks
Base Number Matches 1 1 1 - 1
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