Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BTS50085-1TMB
MA000908284
PG-TO220-7-11
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
plastics
noble metal
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
Polyimide
silver
tin
lead
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
26023-21-2
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
15.514
1.492
0.447
1489.617
6.155
8.707
95.778
475.989
23.005
0.216
0.001
0.124
0.094
0.076
3.609
Average
Mass
[%]
0.73
0.07
0.02
70.25
0.29
0.41
4.52
22.44
1.08
0.01
0.00
0.01
0.00
0.00
0.17
29. August 2013
2120.82 mg
Sum
[%]
0.73
Average
Mass
[ppm]
7315
703
211
70.34
0.29
702376
2902
4106
45161
27.37
1.08
224436
10847
102
0.01
0.01
0
58
45
36
0.17
1702
1783
1000000
102
58
273703
10847
703290
2902
Sum
[ppm]
7315
wire
encapsulation
leadfinish
plating
glue
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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