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PHT2010Y2213FN

Description
RESISTOR, THIN FILM, 0.1 W, 1 %, 25 ppm, 221000 ohm, SURFACE MOUNT, 2010, CHIP, GREEN
CategoryPassive components    The resistor   
File Size111KB,6 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Environmental Compliance  
Download Datasheet Parametric View All

PHT2010Y2213FN Overview

RESISTOR, THIN FILM, 0.1 W, 1 %, 25 ppm, 221000 ohm, SURFACE MOUNT, 2010, CHIP, GREEN

PHT2010Y2213FN Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Objectid1016478273
package instruction, 2010
Reach Compliance Codeunknown
ECCN codeEAR99
Other featuresHIGH PRECISION
JESD-609 codee2
Manufacturer's serial numberPHT
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature215 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
method of packingWAFFLE PACK
Rated power dissipation(P)0.1 W
resistance221000 Ω
Resistor typeFIXED RESISTOR
size code2010
surface mountYES
technologyTHIN FILM
Temperature Coefficient25 ppm/°C
Terminal surfaceTin/Silver (Sn/Ag)
Terminal shapeWRAPAROUND
Tolerance1%
Operating Voltage300 V
PHT
www.vishay.com
Vishay Sfernice
High Stability - High Temperature (230 °C)
Thin Film Wraparound Chip Resistors
FEATURES
• Operating temperature range:
- 55 °C; + 215 °C
• Storage temperature: - 55 °C; + 230 °C
• Gold terminations (< 1 μm thick)
• 4 sizes available (0603, 0805, 1206, 2010).
Other sizes upon request.
• Temperature coefficient down to 15 ppm
(- 55 °C; + 215 °C)
• Tolerance down to 0.05 %
• Load life stability: 0.5 % max after 1000 h at 215 °C
(ambient) at Pn
• SMD wraparound
• 0.02 % upon request
• TCR remains constant after long term storage at 230 °C
(15 000 h)
• Compliant to RoHS Directive 2002/95/EC
Note
**
Please see document “Vishay Material Category Policy”:
www.vishay.com/doc?99902
INTRODUCTION
For applications such as down hole applications, the need
for parts able to withstand very severe conditions
(temperature as high as 215 °C powered or up to 230 °C
un-powered) has leaded Vishay Sfernice to push out the
limit of the thin film technology.
Designers might read the application note: Power
Dissipation Considerations in High Precision Vishay
Sfernice Thin Film Chip Resistors and Arrays
(P, PRA etc…) (High Temperature Application)
www.vishay.com/doc?53047
in conjunction with this
datasheet to help them to properly design their PCBs and
get the best performances of the PHT.
Vishay Sfernice R&D engineers will be willing to support any
customer design considerations.
DIMENSIONS
in millimeters (inches)
A
D
D
C
B
E
E
A
MAX. TOL.
+ 0.152 (+ 0.006)
MIN. TOL.
- 0.152 (- 0.006)
NOMINAL
0603
0805
1206
2010
1.52 (0.060)
1.91 (0.075)
3.06 (0.120)
5.08 (0.200)
B
MAX. TOL.
+ 0.127 (+ 0.005)
MIN. TOL.
- 0.127 (- 0.005)
NOMINAL
0.85 (0.033)
0.38 (0.015)
1.27 (0.050)
1.60 (0.063)
2.54 (0.100)
0.5 (0.02)
± 0.127 (0.005)
0.13 (0.005)
0.40 (0.016)
0.48 (0.019)
D/E
C
CASE SIZE
NOMINAL
NOMINAL
Revision: 28-Nov-11
1
For technical questions, contact:
sfer@vishay.com
Document Number: 53050
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
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