Above ratings are based on the thermal resistances using a multi-layer circuit board (EIA/JESD51). For mounting on a mono-layer board, power derating shall be
needed. Please inquire of us about conditions.
※1 素子毎の負荷電力の合計が、パッケージ定格電力を超えない条件で御½用ください。
※1 Total power consumption of all elements should not exceed the package power rating.
The resistor of this product is formed by narrow patterning a thin metal film. Thus, application of excessive voltage causes burn and destruction of the resistive film, abnormality
in resistance or open resistance and loss of proper function. The properly and electrostatically measured taping materials are used for the components, but attention should be paid
to the fact that there is some danger the parts may be destructed by static electricity(equivalent to 500V or over at 100pF, 1.5kΩ) to cause a change in resistance in the conditions
of an excessive dryness when mounting on the boards. Similarly, care should be given not to apply the excessive static electricity at the time of mounting on the boards. When
designing, consideration can be taken into withstanding ESD for customized KPC products. Please consult with us about the details.
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Hand soldering by iron soldering or repairment are not recommended because KPC is a multi-pin product.
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Avoid storing components under direct sun rays, high temperature/humidity. Direct sun rays will cause quality change of taping and difficulty of keeping appropriate peeling
strength. In the case of 5〜35℃/35〜75%RH, there is no deterioration of solderability for 12 months, but take special care for storing, because condensation, dust, and toxic gas
like hydrogen sulfide, sulfurous acid gas, hydrogen chloride, etc. may drop solderability.
This article mainly analyzes and studies the common problems (defects) in the process of EMC packaging forming, such as unfilled, pores, pits, punching, cracking, overflow, and sticking mold, and prop...
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Abstract
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RFID technology will be ubiquitous in the future, and there is no doubt about it, because it brings convenience and timeliness to people, which means efficiency and...[Details]
Radio Frequency Identification (RFID) technology is a contactless automatic identification technology that uses radio frequency signals to read and write relevant data from target objects to achiev...[Details]
The role of digital-to-analog converters
Real-world analog signals, such as temperature, pressure, sound, or images, are constantly being converted into digital form that is easier to store, p...[Details]
As FPGAs incorporate more and more capabilities, the need for effective debugging tools will become more critical. Careful planning for internal visibility will enable teams to adopt the right debuggi...[Details]
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1 Introduction
In the current test field, the correlation detection method is increasingly widely used for filtering. Correlation filtering can easily separate a signal of a specific frequency...[Details]
Over the past 15 to 20 years, automotive power MOSFETs have evolved from an initial technical topic to a thriving commercial sector. Power MOSFETs were chosen because they can withstand transient ...[Details]
0 Introduction
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Chapter 1 Proposal
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Unauthorized persons ente...[Details]
introduction
The fall detector is suitable for elderly people and children with poor self-care and self-protection abilities. It senses changes in the body posture of the individual wearing th...[Details]
System Introduction
EraSoC-1000 series chips are high-performance SoCs (System on Chips) based on the Loongson core. With their powerful CPU processing capabilities, 64-bit floating-point ...[Details]
At present, the IEEE802.11 wireless LAN standard is widely used in voice communication, wireless office and other fields, but it is still mainly limited to wireless communication on general platfor...[Details]
Power Integrations (PI) has introduced three charger/adapter reference designs using its new LinkSwitch-II series of AC-DC switching power conversion ICs. The new LinkSwitch-II devices use high-pre...[Details]