PCA9671_10 datasheet, PDF - EEWORLD Datasheet

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PCA9671_10: Description16 I/O, PIA-GENERAL PURPOSE, PDSO24; Categorysemiconductor The embedded processor and controller; File Size275KB，35 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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PCA9671_10 Overview

16 I/O, PIA-GENERAL PURPOSE, PDSO24

PCA9671_10 Parametric

Parameter Name	Attribute value
Number of functions	1
Number of terminals	24
Maximum operating temperature	85 Cel
Minimum operating temperature	-40 Cel
Maximum supply/operating voltage	5.5 V
Minimum supply/operating voltage	2.3 V
Rated supply voltage	3 V
Number of input and output buses	16
Processing package description	7.50 MM, PLASTIC, MS-013, SOT137-1,SOP-24
Lead-free	Yes
EU RoHS regulations	Yes
China RoHS regulations	Yes
state	ACTIVE
packaging shape	RECTANGULAR
Package Size	SMALL OUTLINE
surface mount	Yes
Terminal form	GULL WING
Terminal spacing	1.27 mm
terminal coating	NOT SPECIFIED
Terminal location	DUAL
Packaging Materials	PLASTIC/EPOXY
Temperature level	INDUSTRIAL
Microprocessor type	PIA-GENERAL PURPOSE
Number of ports	1

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PCA9671

Remote 16-bit I/O expander for Fm+ I

C-bus with reset

Rev. 2 — 29 July 2010

Product data sheet

1. General description

The PCA9671 provides general purpose remote I/O expansion for most microcontroller

families via the two-line bidirectional bus (I

C-bus) and is a part of the Fast-mode Plus

(Fm+) family.

The PCA9671 is a drop in upgrade for the PCF8575 providing higher I

C-bus speeds

(1 MHz versus 400 kHz) so that the output can support PWM dimming of LEDs, higher

C-bus drive (30 mA versus 3 mA) so that many more devices can be on the bus without

the need for bus buffers, higher total package sink capacity (400 mA versus 100 mA) that

supports having all 25 mA LEDs on at the same time and more device addresses

(64 versus 8) to allow many more devices on the bus without address conflicts.

The difference between the PCA9671 and the PCF8575 is that the interrupt output on the

PCF8575 is replaced by a RESET input on the PCA9671.

The device consists of a 16-bit quasi-bidirectional port and an I

C-bus interface. The

PCA9671 has a low current consumption and includes latched outputs with 25 mA high

current drive capability for directly driving LEDs. The internal Power-On Reset (POR),

hardware reset pin (RESET) or software reset sequence initializes the I/Os as inputs.

2. Features and benefits

1 MHz I

C-bus interface

Compliant with the I

C-bus Fast-mode and Standard-mode

SDA with 30 mA sink capability for 4000 pF buses

2.3 V to 5.5 V operation with 5.5 V tolerant I/Os

16-bit remote I/O pins that default to inputs at power-up

Latched outputs with 25 mA sink capability for directly driving LEDs

Total package sink capability of 400 mA

Active LOW reset input

64 programmable slave addresses using 3 address pins

Readable device ID (manufacturer, device type, and revision)

Low standby current

−40 °C

to +85

°C

operation

ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per

JESD22-A115, and 1000 V CDM per JESD22-C101

Latch-up testing is done to JEDEC standard JESD78 which exceeds 100 mA

Packages offered: SO24, SSOP24, QSOP24, TSSOP24, HVQFN24, DHVQFN24

PCA9671_10 Related Products

	PCA9671_10	PCA9671BQ	PCA9671BS
Description	16 I/O, PIA-GENERAL PURPOSE, PDSO24	16 I/O, PIA-GENERAL PURPOSE, PDSO24	16 I/O, PIA-GENERAL PURPOSE, PDSO24
Number of terminals	24	24	24
Maximum operating temperature	85 Cel	85 °C	85 °C
Minimum operating temperature	-40 Cel	-40 °C	-40 °C
surface mount	Yes	YES	YES
Terminal form	GULL WING	NO LEAD	NO LEAD
Terminal location	DUAL	QUAD	QUAD
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Number of ports	1	1	1
Is it Rohs certified?	-	conform to	conform to
Maker	-	NXP	NXP
Parts packaging code	-	QFN	QFN
package instruction	-	3.50 X 5.50 MM, 0.85 MM HEIGHT, PLASTIC, SOT815-1, DHVQFN-24	HVQCCN, LCC24,.16SQ,20
Contacts	-	24	24
Reach Compliance Code	-	unknow	compli
ECCN code	-	EAR99	EAR99
JESD-30 code	-	R-PQCC-N24	S-PQCC-N24
length	-	5.5 mm	4 mm
Humidity sensitivity level	-	1	1
Number of digits	-	16	16
Number of I/O lines	-	16	16
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	HVQCCN	HVQCCN
Encapsulate equivalent code	-	LCC24,.14X.2,60/20	LCC24,.16SQ,20
Package shape	-	RECTANGULAR	SQUARE
Package form	-	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	-	260	260
power supply	-	2.3/5.5 V	2.3/5.5 V
Certification status	-	Not Qualified	Not Qualified
Maximum seat height	-	1 mm	1 mm
Maximum supply voltage	-	5.5 V	5.5 V
Minimum supply voltage	-	2.3 V	2.3 V
Nominal supply voltage	-	3 V	3 V
technology	-	CMOS	CMOS
Terminal pitch	-	0.5 mm	0.5 mm
Maximum time at peak reflow temperature	-	30	30
width	-	3.5 mm	4 mm
uPs/uCs/peripheral integrated circuit type	-	PARALLEL IO PORT, GENERAL PURPOSE	PARALLEL IO PORT, GENERAL PURPOSE

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