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PCA9671BQ

Description
16 I/O, PIA-GENERAL PURPOSE, PDSO24
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size275KB,35 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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PCA9671BQ Overview

16 I/O, PIA-GENERAL PURPOSE, PDSO24

PCA9671BQ Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeQFN
package instruction3.50 X 5.50 MM, 0.85 MM HEIGHT, PLASTIC, SOT815-1, DHVQFN-24
Contacts24
Reach Compliance Codeunknow
ECCN codeEAR99
JESD-30 codeR-PQCC-N24
JESD-609 codee4
length5.5 mm
Humidity sensitivity level1
Number of digits16
Number of I/O lines16
Number of ports1
Number of terminals24
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeHVQCCN
Encapsulate equivalent codeLCC24,.14X.2,60/20
Package shapeRECTANGULAR
Package formCHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)260
power supply2.3/5.5 V
Certification statusNot Qualified
Maximum seat height1 mm
Maximum supply voltage5.5 V
Minimum supply voltage2.3 V
Nominal supply voltage3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formNO LEAD
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
width3.5 mm
uPs/uCs/peripheral integrated circuit typePARALLEL IO PORT, GENERAL PURPOSE
PCA9671
Remote 16-bit I/O expander for Fm+ I
2
C-bus with reset
Rev. 2 — 29 July 2010
Product data sheet
1. General description
The PCA9671 provides general purpose remote I/O expansion for most microcontroller
families via the two-line bidirectional bus (I
2
C-bus) and is a part of the Fast-mode Plus
(Fm+) family.
The PCA9671 is a drop in upgrade for the PCF8575 providing higher I
2
C-bus speeds
(1 MHz versus 400 kHz) so that the output can support PWM dimming of LEDs, higher
I
2
C-bus drive (30 mA versus 3 mA) so that many more devices can be on the bus without
the need for bus buffers, higher total package sink capacity (400 mA versus 100 mA) that
supports having all 25 mA LEDs on at the same time and more device addresses
(64 versus 8) to allow many more devices on the bus without address conflicts.
The difference between the PCA9671 and the PCF8575 is that the interrupt output on the
PCF8575 is replaced by a RESET input on the PCA9671.
The device consists of a 16-bit quasi-bidirectional port and an I
2
C-bus interface. The
PCA9671 has a low current consumption and includes latched outputs with 25 mA high
current drive capability for directly driving LEDs. The internal Power-On Reset (POR),
hardware reset pin (RESET) or software reset sequence initializes the I/Os as inputs.
2. Features and benefits
1 MHz I
2
C-bus interface
Compliant with the I
2
C-bus Fast-mode and Standard-mode
SDA with 30 mA sink capability for 4000 pF buses
2.3 V to 5.5 V operation with 5.5 V tolerant I/Os
16-bit remote I/O pins that default to inputs at power-up
Latched outputs with 25 mA sink capability for directly driving LEDs
Total package sink capability of 400 mA
Active LOW reset input
64 programmable slave addresses using 3 address pins
Readable device ID (manufacturer, device type, and revision)
Low standby current
−40 °C
to +85
°C
operation
ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per
JESD22-A115, and 1000 V CDM per JESD22-C101
Latch-up testing is done to JEDEC standard JESD78 which exceeds 100 mA
Packages offered: SO24, SSOP24, QSOP24, TSSOP24, HVQFN24, DHVQFN24

PCA9671BQ Related Products

PCA9671BQ PCA9671BS PCA9671_10
Description 16 I/O, PIA-GENERAL PURPOSE, PDSO24 16 I/O, PIA-GENERAL PURPOSE, PDSO24 16 I/O, PIA-GENERAL PURPOSE, PDSO24
Number of ports 1 1 1
Number of terminals 24 24 24
Maximum operating temperature 85 °C 85 °C 85 Cel
Minimum operating temperature -40 °C -40 °C -40 Cel
surface mount YES YES Yes
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form NO LEAD NO LEAD GULL WING
Terminal location QUAD QUAD DUAL
Is it Rohs certified? conform to conform to -
Maker NXP NXP -
Parts packaging code QFN QFN -
package instruction 3.50 X 5.50 MM, 0.85 MM HEIGHT, PLASTIC, SOT815-1, DHVQFN-24 HVQCCN, LCC24,.16SQ,20 -
Contacts 24 24 -
Reach Compliance Code unknow compli -
ECCN code EAR99 EAR99 -
JESD-30 code R-PQCC-N24 S-PQCC-N24 -
length 5.5 mm 4 mm -
Humidity sensitivity level 1 1 -
Number of digits 16 16 -
Number of I/O lines 16 16 -
Package body material PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code HVQCCN HVQCCN -
Encapsulate equivalent code LCC24,.14X.2,60/20 LCC24,.16SQ,20 -
Package shape RECTANGULAR SQUARE -
Package form CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE -
Peak Reflow Temperature (Celsius) 260 260 -
power supply 2.3/5.5 V 2.3/5.5 V -
Certification status Not Qualified Not Qualified -
Maximum seat height 1 mm 1 mm -
Maximum supply voltage 5.5 V 5.5 V -
Minimum supply voltage 2.3 V 2.3 V -
Nominal supply voltage 3 V 3 V -
technology CMOS CMOS -
Terminal pitch 0.5 mm 0.5 mm -
Maximum time at peak reflow temperature 30 30 -
width 3.5 mm 4 mm -
uPs/uCs/peripheral integrated circuit type PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE -

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