W9812G6JH datasheet, PDF - EEWORLD Datasheet

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W9812G6JH: Description8M X 16 SYNCHRONOUS DRAM, 5 ns, PDSO54; Categorystorage; File Size778KB，42 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw

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W9812G6JH Overview

8M X 16 SYNCHRONOUS DRAM, 5 ns, PDSO54

W9812G6JH Parametric

Parameter Name	Attribute value
Number of functions	1
Number of terminals	54
Maximum operating temperature	85 Cel
Minimum operating temperature	-40 Cel
Maximum supply/operating voltage	3.6 V
Minimum supply/operating voltage	3 V
Rated supply voltage	3.3 V
Minimum access time	5 ns
Processing package description	0.400 INCH, ROHS COMPLIANT,TSOP2-54
Lead-free	Yes
EU RoHS regulations	Yes
state	ACTIVE
packaging shape	Rectangle
Package Size	SMALL OUTLINE, THIN PROFILE
surface mount	Yes
Terminal form	GULL WING
Terminal spacing	0.8000 mm
terminal coating	MATTE Tin
Terminal location	pair
Packaging Materials	Plastic/Epoxy
Temperature level	INDUSTRIAL
memory width	16
organize	8M × 16
storage density	1.34E8 deg
operating mode	Synchronize
Number of digits	8.39E6 words
Number of digits	8M
Access method	Four BANK PAGE BURST
Memory IC type	synchronous dynamic random access memory
Number of ports	1

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W9812G6JH

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4 BANKS

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16 BITS SDRAM

Table of Contents-

GENERAL DESCRIPTION .............................................................................................................. 3

FEATURES ...................................................................................................................................... 3

ORDER INFORMATION.................................................................................................................. 3

PIN CONFIGURATION.................................................................................................................... 4

PIN DESCRIPTION ......................................................................................................................... 5

BLOCK DIAGRAM ........................................................................................................................... 6

FUNCTIONAL DESCRIPTION ........................................................................................................ 7

7.1

Power Up and Initialization ................................................................................................. 7

7.2

Programming Mode Register .............................................................................................. 7

7.3

Bank Activate Command .................................................................................................... 7

7.4

Read and Write Access Modes .......................................................................................... 7

7.5

Burst Read Command ........................................................................................................ 8

7.6

Burst Write Command......................................................................................................... 8

7.7

Read Interrupted by a Read................................................................................................ 8

7.8

Read Interrupted by a Write ................................................................................................ 8

7.9

Write Interrupted by a Write ................................................................................................ 8

7.10

Write Interrupted by a Read ................................................................................................ 8

7.11

Burst Stop Command.......................................................................................................... 9

7.12

Addressing Sequence of Sequential Mode......................................................................... 9

7.13

Addressing Sequence of Interleave Mode .......................................................................... 9

7.14

Auto-precharge Command................................................................................................ 10

7.15

Precharge Command ........................................................................................................ 10

7.16

Self Refresh Command..................................................................................................... 10

7.17

Power Down Mode ............................................................................................................ 11

7.18

No Operation Command ................................................................................................... 11

7.19

Deselect Command .......................................................................................................... 11

7.20

Clock Suspend Mode ........................................................................................................ 11

8. OPERATION MODE ...................................................................................................................... 12

9. ELECTRICAL CHARACTERISTICS ............................................................................................. 13

9.1

Absolute Maximum Ratings .............................................................................................. 13

9.2

Recommended DC Operating Conditions ........................................................................ 13

9.3

Capacitance ...................................................................................................................... 14

9.4

DC Characteristics ............................................................................................................ 14

9.5

AC Characteristics and Operating Condition .................................................................... 15

10. TIMING WAVEFORMS.................................................................................................................. 17

10.1

Command Input Timing..................................................................................................... 17

10.2

Read Timing ...................................................................................................................... 18

10.3

Control Timing of Input/Output Data ................................................................................. 19

10.4

Mode Register Set Cycle .................................................................................................. 20

Publication Release Date: Jul. 18, 2014

Revision: A07

-1-

W9812G6JH

11. OPERATING TIMING EXAMPLE .................................................................................................. 21

11.1

Interleaved Bank Read (Burst Length = 4, CAS Latency = 3) .......................................... 21

11.2

Interleaved Bank Read (Burst Length = 4, CAS Latency = 3, Auto-precharge) ............... 22

11.3

Interleaved Bank Read (Burst Length = 8, CAS Latency = 3) .......................................... 23

11.4

Interleaved Bank Read (Burst Length = 8, CAS Latency = 3, Auto-precharge) ............... 24

11.5

Interleaved Bank Write (Burst Length = 8) ....................................................................... 25

11.6

Interleaved Bank Write (Burst Length = 8, Auto-precharge) ............................................ 26

11.7

Page Mode Read (Burst Length = 4, CAS Latency = 3) ................................................... 27

11.8

Page Mode Read / Write (Burst Length = 8, CAS Latency = 3) ....................................... 28

11.9

Auto Precharge Read (Burst Length = 4, CAS Latency = 3) ............................................ 29

11.10 Auto Precharge Write (Burst Length = 4) ......................................................................... 30

11.11 Auto Refresh Cycle ........................................................................................................... 31

11.12 Self Refresh Cycle ............................................................................................................ 32

11.13 Burst Read and Single Write (Burst Length = 4, CAS Latency = 3) ................................. 33

11.14 Power Down Mode ............................................................................................................ 34

11.15 Auto-precharge Timing (Read Cycle) ............................................................................... 35

11.16 Auto-precharge Timing (Write Cycle) ............................................................................... 36

11.17 Timing Chart of Read to Write Cycle ................................................................................ 37

11.18 Timing Chart of Write to Read Cycle ................................................................................ 37

11.19 Timing Chart of Burst Stop Cycle (Burst Stop Command) ............................................... 38

11.20 Timing Chart of Burst Stop Cycle (Precharge Command) ................................................ 38

11.21 CKE/DQM Input Timing (Write Cycle) .............................................................................. 39

11.22 CKE/DQM Input Timing (Read Cycle) .............................................................................. 40

12. PACKAGE SPECIFICATION ......................................................................................................... 41

13. REVISION HISTORY..................................................................................................................... 42

-2-

Publication Release Date: Jul. 18, 2014

Revision: A07

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Description	8M X 16 SYNCHRONOUS DRAM, 5 ns, PDSO54	8M X 16 SYNCHRONOUS DRAM, 5 ns, PDSO54	8M X 16 SYNCHRONOUS DRAM, 5 ns, PDSO54	8M X 16 SYNCHRONOUS DRAM, 5 ns, PDSO54	8M X 16 SYNCHRONOUS DRAM, 5 ns, PDSO54	8M X 16 SYNCHRONOUS DRAM, 5 ns, PDSO54	8M X 16 SYNCHRONOUS DRAM, 5 ns, PDSO54	IC DRAM 128M PARALLEL 54TSOP
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	54	54	54	54	54	54	54	54
Maximum operating temperature	85 Cel	70 °C	85 °C	85 °C	105 °C	70 °C	85 Cel	70 °C
Minimum operating temperature	-40 Cel	-	-40 °C	-40 °C	-40 °C	-	-40 Cel	-
surface mount	Yes	YES	YES	YES	YES	YES	Yes	YES
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal location	pair	DUAL	DUAL	DUAL	DUAL	DUAL	pair	DUAL
Temperature level	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL
memory width	16	16	16	16	16	16	16	16
organize	8M × 16	8MX16	8MX16	8MX16	8MX16	8MX16	8M × 16	8MX16
Number of ports	1	1	1	1	1	1	1	1
Is it lead-free?	-	Lead free	Lead free	Lead free	-	Lead free	-	Lead free
Is it Rohs certified?	-	conform to	conform to	conform to	conform to	conform to	-	conform to
Parts packaging code	-	TSOP2	TSOP2	TSOP2	TSOP2	TSOP2	-	TSOP2
package instruction	-	TSOP2, TSOP54,.46,32	TSOP2, TSOP54,.46,32	TSOP2, TSOP54,.46,32	TSOP2,	TSOP2, TSOP54,.46,32	-	TSOP2, TSOP54,.46,32
Contacts	-	54	54	54	54	54	-	54
Reach Compliance Code	-	unknow	compli	compli	unknow	compli	-	compliant
ECCN code	-	EAR99	EAR99	EAR99	EAR99	EAR99	-	EAR99
access mode	-	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	-	FOUR BANK PAGE BURST
Maximum access time	-	5 ns	5 ns	5 ns	5 ns	5.4 ns	-	4.5 ns
Other features	-	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	-	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	-	166 MHz	166 MHz	166 MHz	-	133 MHz	-	200 MHz
I/O type	-	COMMON	COMMON	COMMON	-	COMMON	-	COMMON
interleaved burst length	-	1,2,4,8	1,2,4,8	1,2,4,8	-	1,2,4,8	-	1,2,4,8
JESD-30 code	-	R-PDSO-G54	R-PDSO-G54	R-PDSO-G54	R-PDSO-G54	R-PDSO-G54	-	R-PDSO-G54
JESD-609 code	-	e3	e3	e3	-	e3	-	e3
length	-	22.22 mm	22.22 mm	22.22 mm	22.22 mm	22.22 mm	-	22.22 mm
memory density	-	134217728 bi	134217728 bi	134217728 bi	134217728 bi	134217728 bi	-	134217728 bit
Memory IC Type	-	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	-	SYNCHRONOUS DRAM
word count	-	8388608 words	8388608 words	8388608 words	8388608 words	8388608 words	-	8388608 words
character code	-	8000000	8000000	8000000	8000000	8000000	-	8000000
Operating mode	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	-	SYNCHRONOUS
Output characteristics	-	3-STATE	3-STATE	3-STATE	-	3-STATE	-	3-STATE
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY
encapsulated code	-	TSOP2	TSOP2	TSOP2	TSOP2	TSOP2	-	TSOP2
Encapsulate equivalent code	-	TSOP54,.46,32	TSOP54,.46,32	TSOP54,.46,32	-	TSOP54,.46,32	-	TSOP54,.46,32
Package shape	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR
Package form	-	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	-	SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Celsius)	-	260	260	260	-	260	-	260
power supply	-	3.3 V	3.3 V	3.3 V	-	3.3 V	-	3.3 V
Certification status	-	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	-	Not Qualified
refresh cycle	-	4096	4096	4096	-	4096	-	4096
Maximum seat height	-	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	-	1.2 mm
self refresh	-	YES	YES	YES	YES	YES	-	YES
Continuous burst length	-	1,2,4,8,FP	1,2,4,8,FP	1,2,4,8,FP	-	1,2,4,8,FP	-	1,2,4,8,FP
Maximum standby current	-	0.002 A	0.002 A	0.002 A	-	0.002 A	-	0.002 A
Maximum slew rate	-	0.075 mA	0.075 mA	0.075 mA	-	0.07 mA	-	0.08 mA
Maximum supply voltage (Vsup)	-	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	-	3.6 V
Minimum supply voltage (Vsup)	-	3 V	3 V	3 V	3 V	3 V	-	3 V
Nominal supply voltage (Vsup)	-	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	-	3.3 V
technology	-	CMOS	CMOS	CMOS	CMOS	CMOS	-	CMOS
Terminal surface	-	Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	-	Matte Tin (Sn)	-	Matte Tin (Sn)
Terminal pitch	-	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	-	0.8 mm
Maximum time at peak reflow temperature	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	-	NOT SPECIFIED
width	-	10.16 mm	10.16 mm	10.16 mm	10.16 mm	10.16 mm	-	10.16 mm
Maker	-	-	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	-	Winbond Electronics Corporation

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