W9812G6JH-6I datasheet, PDF - EEWORLD Datasheet

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W9812G6JH-6I: Description8M X 16 SYNCHRONOUS DRAM, 5 ns, PDSO54; Categorystorage storage; File Size778KB，42 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw; Environmental Compliance

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W9812G6JH-6I Overview

8M X 16 SYNCHRONOUS DRAM, 5 ns, PDSO54

W9812G6JH-6I Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Winbond Electronics Corporation
Parts packaging code	TSOP2
package instruction	TSOP2, TSOP54,.46,32
Contacts	54
Reach Compliance Code	compli
ECCN code	EAR99
access mode	FOUR BANK PAGE BURST
Maximum access time	5 ns
Other features	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	166 MHz
I/O type	COMMON
interleaved burst length	1,2,4,8
JESD-30 code	R-PDSO-G54
JESD-609 code	e3
length	22.22 mm
memory density	134217728 bi
Memory IC Type	SYNCHRONOUS DRAM
memory width	16
Number of functions	1
Number of ports	1
Number of terminals	54
word count	8388608 words
character code	8000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	8MX16
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP2
Encapsulate equivalent code	TSOP54,.46,32
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Celsius)	260
power supply	3.3 V
Certification status	Not Qualified
refresh cycle	4096
Maximum seat height	1.2 mm
self refresh	YES
Continuous burst length	1,2,4,8,FP
Maximum standby current	0.002 A
Maximum slew rate	0.075 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn)
Terminal form	GULL WING
Terminal pitch	0.8 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	10.16 mm
Base Number Matches	1

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W9812G6JH

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4 BANKS

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16 BITS SDRAM

Table of Contents-

GENERAL DESCRIPTION .............................................................................................................. 3

FEATURES ...................................................................................................................................... 3

ORDER INFORMATION.................................................................................................................. 3

PIN CONFIGURATION.................................................................................................................... 4

PIN DESCRIPTION ......................................................................................................................... 5

BLOCK DIAGRAM ........................................................................................................................... 6

FUNCTIONAL DESCRIPTION ........................................................................................................ 7

7.1

Power Up and Initialization ................................................................................................. 7

7.2

Programming Mode Register .............................................................................................. 7

7.3

Bank Activate Command .................................................................................................... 7

7.4

Read and Write Access Modes .......................................................................................... 7

7.5

Burst Read Command ........................................................................................................ 8

7.6

Burst Write Command......................................................................................................... 8

7.7

Read Interrupted by a Read................................................................................................ 8

7.8

Read Interrupted by a Write ................................................................................................ 8

7.9

Write Interrupted by a Write ................................................................................................ 8

7.10

Write Interrupted by a Read ................................................................................................ 8

7.11

Burst Stop Command.......................................................................................................... 9

7.12

Addressing Sequence of Sequential Mode......................................................................... 9

7.13

Addressing Sequence of Interleave Mode .......................................................................... 9

7.14

Auto-precharge Command................................................................................................ 10

7.15

Precharge Command ........................................................................................................ 10

7.16

Self Refresh Command..................................................................................................... 10

7.17

Power Down Mode ............................................................................................................ 11

7.18

No Operation Command ................................................................................................... 11

7.19

Deselect Command .......................................................................................................... 11

7.20

Clock Suspend Mode ........................................................................................................ 11

8. OPERATION MODE ...................................................................................................................... 12

9. ELECTRICAL CHARACTERISTICS ............................................................................................. 13

9.1

Absolute Maximum Ratings .............................................................................................. 13

9.2

Recommended DC Operating Conditions ........................................................................ 13

9.3

Capacitance ...................................................................................................................... 14

9.4

DC Characteristics ............................................................................................................ 14

9.5

AC Characteristics and Operating Condition .................................................................... 15

10. TIMING WAVEFORMS.................................................................................................................. 17

10.1

Command Input Timing..................................................................................................... 17

10.2

Read Timing ...................................................................................................................... 18

10.3

Control Timing of Input/Output Data ................................................................................. 19

10.4

Mode Register Set Cycle .................................................................................................. 20

Publication Release Date: Jul. 18, 2014

Revision: A07

-1-

W9812G6JH

11. OPERATING TIMING EXAMPLE .................................................................................................. 21

11.1

Interleaved Bank Read (Burst Length = 4, CAS Latency = 3) .......................................... 21

11.2

Interleaved Bank Read (Burst Length = 4, CAS Latency = 3, Auto-precharge) ............... 22

11.3

Interleaved Bank Read (Burst Length = 8, CAS Latency = 3) .......................................... 23

11.4

Interleaved Bank Read (Burst Length = 8, CAS Latency = 3, Auto-precharge) ............... 24

11.5

Interleaved Bank Write (Burst Length = 8) ....................................................................... 25

11.6

Interleaved Bank Write (Burst Length = 8, Auto-precharge) ............................................ 26

11.7

Page Mode Read (Burst Length = 4, CAS Latency = 3) ................................................... 27

11.8

Page Mode Read / Write (Burst Length = 8, CAS Latency = 3) ....................................... 28

11.9

Auto Precharge Read (Burst Length = 4, CAS Latency = 3) ............................................ 29

11.10 Auto Precharge Write (Burst Length = 4) ......................................................................... 30

11.11 Auto Refresh Cycle ........................................................................................................... 31

11.12 Self Refresh Cycle ............................................................................................................ 32

11.13 Burst Read and Single Write (Burst Length = 4, CAS Latency = 3) ................................. 33

11.14 Power Down Mode ............................................................................................................ 34

11.15 Auto-precharge Timing (Read Cycle) ............................................................................... 35

11.16 Auto-precharge Timing (Write Cycle) ............................................................................... 36

11.17 Timing Chart of Read to Write Cycle ................................................................................ 37

11.18 Timing Chart of Write to Read Cycle ................................................................................ 37

11.19 Timing Chart of Burst Stop Cycle (Burst Stop Command) ............................................... 38

11.20 Timing Chart of Burst Stop Cycle (Precharge Command) ................................................ 38

11.21 CKE/DQM Input Timing (Write Cycle) .............................................................................. 39

11.22 CKE/DQM Input Timing (Read Cycle) .............................................................................. 40

12. PACKAGE SPECIFICATION ......................................................................................................... 41

13. REVISION HISTORY..................................................................................................................... 42

-2-

Publication Release Date: Jul. 18, 2014

Revision: A07

W9812G6JH-6I Related Products

	W9812G6JH-6I	W9812G6JH-6	W9812G6JH-6A	W9812G6JH-6K	W9812G6JH-75	W9812G6JH_13	W9812G6JH	W9812G6JH-5
Description	8M X 16 SYNCHRONOUS DRAM, 5 ns, PDSO54	8M X 16 SYNCHRONOUS DRAM, 5 ns, PDSO54	8M X 16 SYNCHRONOUS DRAM, 5 ns, PDSO54	8M X 16 SYNCHRONOUS DRAM, 5 ns, PDSO54	8M X 16 SYNCHRONOUS DRAM, 5 ns, PDSO54	8M X 16 SYNCHRONOUS DRAM, 5 ns, PDSO54	8M X 16 SYNCHRONOUS DRAM, 5 ns, PDSO54	IC DRAM 128M PARALLEL 54TSOP
memory width	16	16	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1	1
Number of terminals	54	54	54	54	54	54	54	54
Maximum operating temperature	85 °C	70 °C	85 °C	105 °C	70 °C	85 Cel	85 Cel	70 °C
Minimum operating temperature	-40 °C	-	-40 °C	-40 °C	-	-40 Cel	-40 Cel	-
organize	8MX16	8MX16	8MX16	8MX16	8MX16	8M × 16	8M × 16	8MX16
surface mount	YES	YES	YES	YES	YES	Yes	Yes	YES
Temperature level	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	pair	pair	DUAL
Is it lead-free?	Lead free	Lead free	Lead free	-	Lead free	-	-	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	-	-	conform to
Maker	Winbond Electronics Corporation	-	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	-	-	Winbond Electronics Corporation
Parts packaging code	TSOP2	TSOP2	TSOP2	TSOP2	TSOP2	-	-	TSOP2
package instruction	TSOP2, TSOP54,.46,32	TSOP2, TSOP54,.46,32	TSOP2, TSOP54,.46,32	TSOP2,	TSOP2, TSOP54,.46,32	-	-	TSOP2, TSOP54,.46,32
Contacts	54	54	54	54	54	-	-	54
Reach Compliance Code	compli	unknow	compli	unknow	compli	-	-	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	-	-	EAR99
access mode	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	-	-	FOUR BANK PAGE BURST
Maximum access time	5 ns	5 ns	5 ns	5 ns	5.4 ns	-	-	4.5 ns
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	-	-	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	166 MHz	166 MHz	166 MHz	-	133 MHz	-	-	200 MHz
I/O type	COMMON	COMMON	COMMON	-	COMMON	-	-	COMMON
interleaved burst length	1,2,4,8	1,2,4,8	1,2,4,8	-	1,2,4,8	-	-	1,2,4,8
JESD-30 code	R-PDSO-G54	R-PDSO-G54	R-PDSO-G54	R-PDSO-G54	R-PDSO-G54	-	-	R-PDSO-G54
JESD-609 code	e3	e3	e3	-	e3	-	-	e3
length	22.22 mm	22.22 mm	22.22 mm	22.22 mm	22.22 mm	-	-	22.22 mm
memory density	134217728 bi	134217728 bi	134217728 bi	134217728 bi	134217728 bi	-	-	134217728 bit
Memory IC Type	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	-	-	SYNCHRONOUS DRAM
word count	8388608 words	8388608 words	8388608 words	8388608 words	8388608 words	-	-	8388608 words
character code	8000000	8000000	8000000	8000000	8000000	-	-	8000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	-	-	SYNCHRONOUS
Output characteristics	3-STATE	3-STATE	3-STATE	-	3-STATE	-	-	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	-	PLASTIC/EPOXY
encapsulated code	TSOP2	TSOP2	TSOP2	TSOP2	TSOP2	-	-	TSOP2
Encapsulate equivalent code	TSOP54,.46,32	TSOP54,.46,32	TSOP54,.46,32	-	TSOP54,.46,32	-	-	TSOP54,.46,32
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	-	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	-	-	SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Celsius)	260	260	260	-	260	-	-	260
power supply	3.3 V	3.3 V	3.3 V	-	3.3 V	-	-	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	-	-	Not Qualified
refresh cycle	4096	4096	4096	-	4096	-	-	4096
Maximum seat height	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	-	-	1.2 mm
self refresh	YES	YES	YES	YES	YES	-	-	YES
Continuous burst length	1,2,4,8,FP	1,2,4,8,FP	1,2,4,8,FP	-	1,2,4,8,FP	-	-	1,2,4,8,FP
Maximum standby current	0.002 A	0.002 A	0.002 A	-	0.002 A	-	-	0.002 A
Maximum slew rate	0.075 mA	0.075 mA	0.075 mA	-	0.07 mA	-	-	0.08 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	-	-	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	-	-	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	-	-	3.3 V
technology	CMOS	CMOS	CMOS	CMOS	CMOS	-	-	CMOS
Terminal surface	Matte Tin (Sn)	Tin (Sn)	Matte Tin (Sn)	-	Matte Tin (Sn)	-	-	Matte Tin (Sn)
Terminal pitch	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	-	-	0.8 mm
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	-	-	NOT SPECIFIED
width	10.16 mm	10.16 mm	10.16 mm	10.16 mm	10.16 mm	-	-	10.16 mm

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