In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs,
data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device.”
S11MD7T/S11MD8T/S11MD9T/S21MD7T/S21MD8T/S21MD9T
s
Electro-optical Characteristics
Input
Parameter
Forward voltage
Reverse current
Repetitive peak OFF-state current
S11MD7T/S21MD7T
S11MD9T/S21MD9T
ON-state voltage
S11MD8T/S21MD8T
Holding current
Critical rate of rise of OFF-state voltage
Zere-cross voltage
S11MD8T/S21MD8T
S11MD7T/S21MD7T
Minimum trigger
S11MD8T/S21MD8T
current
S11MD9T/S21MD9T
Isolation resistance
S11MD7T
S11MD9T/S21MD7T/
Turn-on time
S21MD9T
S11MD8T/S21MD8T
Symbol
Conditions
I
F
= 20mA
V
F
V
R
= 3V
I
R
I
DRM
V
DRM
= Rated
V
T
I
H
dV/dt
V
OX
I
FT
R
ISO
I
T
= 0.1A
V
D
= 6V
V
DRM
= 1/
2
• Rated
Resistance load, I
F
= 10mA
V
D
= 6V, R
L
= 100Ω
DC500V, 40 to 60% RH
V
D
= 6V, R
L
= 100Ω
I
F
= 20mA
MIN.
-
-
-
-
-
0.1
100
-
-
-
5 x 10
10
-
-
-
TYP.
1.2
-
-
1.5
1.7
0.5
-
-
-
-
10
11
70
60
20
( Ta = 25˚C)
MAX.
1.4
10
- 5
10
- 6
2.5
2.5
3.5
-
35
5
7
-
100
100
50
Unit
V
A
A
V
mA
V/
µs
V
mA
Ω
µs
Output
Transfer
charac-
teristics
t
on
Fig. 1 RMS ON-state Current vs.
Ambient Temperature
Fig. 2 Forward Current vs.
Ambient Temperature
70
60
Forward current I
F
( mA )
50
40
30
20
10
0.10
RMS ON-state current I
T
(Arms)
0.05
0
- 30
0
20
40
60
80
Ambient temperature T
a
( ˚C )
100
0
- 30
0
25
50
75
100
Ambient temperature T
a
( ˚C )
125
S11MD7T/S11MD8T/S11MD9T/S21MD7T/S21MD8T/S21MD9T
Fig. 3 Forward Current vs. Forward Voltage
Fig. 4 Minimum Trigger Current vs.
Ambient Temperature
12
500
Minimum trigger current I
FT
( mA )
10
200
Forward current I
F
( mA )
100
50
20
10
5
2
1
0
0.5
2.0
Forward voltage V
F
( V )
1.0
1.5
2.5
3.0
T
a
= 100˚C
75˚C
50˚C
25˚C
0˚C
- 30˚C
V
D
= 6V
R
L
= 100Ω
8
6
S11MD9T/S21MD9T
4
S11MD8T/S21MD8T
2
0
S11MD7T/S21MD7T
-30
0
20
40
60
80
Ambient temperature T
a
( ˚C )
100
Fig. 5 Relative Repetitive Peak OFF-State
Voltage vs. Ambient Temperature
1.3
Relative repetitive peak OFF-state voltage
V
DRM
( T
j
= T
a
) /V
DRM
( T
j
= 25˚C)
Fig. 6 ON-state Voltage vs. Ambient
Temperature
1.9
I
T
= 100mA
S11MD8T
1.2
ON-state voltage V
T
( V )
S11MD7T/S21MD7T
S11MD9T/S21MD9T
1.8
1.1
1.7
S21MD8T
1.0
S11MD8T/S21MD8T
1.6
0.9
1.5
S11MD7T/S21MD7T
S11MD9T/S21MD9T
1.4
1.3
-30
0.8
0.7
- 30
0
20
40
60
80
Ambient temperature T
a
( ˚C )
100
0
20
40
60
80
Ambient temperature T
a
( ˚C )
100
Fig. 7 Holding Current vs.
Ambient Temperature
10
V
D
= 6V
5
Holding current I
H
( mA )
Fig. 8-a Repetitive Peak OFF-state Current
vs. OFF-state Voltage
(S11MD7T/S11MD9T )
2
Repetitive peak OFF-state current I
DRM
( A )
T
a
= 25˚C
10
-9
2
S11MD8T/S21MD8T
1
0.5
5
2
0.2
0.1
- 30
S11MD7T/S21MD7T
S11MD9T/S21MD9T
0
20
40
60
80
Ambient temperature T
a
( ˚C )
100
-10
10
5
100
200
300
400
500
600
OFF-state voltage V
D
( V )
S11MD7T/S11MD8T/S11MD9T/S21MD7T/S21MD8T/S21MD9T
Fig. 8-b Repetitive Peak OFF-state Current
vs. OFF-state Voltage
(S11MD8T/S21MD8T)
2
Fig. 8-c Repetitive Peak OFF-state Current
vs. OFF-state Voltage
(S21MD7T/S21MD9T )
Repetitive peak OFF-state current I
DRM
( A )
10
- 9
5
Repetitive peak OFF-state current I
DRM
( A )
T
a
= 25˚C
10
- 7
S21MD8T
T
a
=25˚C
5
2
S11MD8T
2
10
- 10
5
10
- 8
2
5
100
200
300
400
500
OFF-stage voltage V
D
( V )
600
10
- 11
100
200
300
400
500
Off-state voltage V
D
( V )
600
Fig. 9-a Repetitive Peak OFF-state Current
vs. Ambient Temperature
(S11MD7T/S11MD9T/S21MD7T/S21MD9T)
-7
10
Repetitive peak OFF-state current I
DRM
( A )
V
D
= 400V (
S11MD7T/S11MD9T
)
V
D
= 600V (
S21MD7T/S21MD9T
)
10
- 8
Fig. 9-b Repetitive Peak OFF-state Current
vs. Ambient Temperature
(S11MD8T/S21MD8T )
-4
10
Repetitive peak OFF-state current I
DRM
(A)
V
D
= 400V
(
S11MD8T
)
V
D
= 600V
(
S21MD8T
)
10
- 5
S21MD8T
10
- 6
S11MD8T
10
- 7
10
- 9
10
- 10
10
- 11
10
- 8
10
- 12
- 30
0
20
40
60
80
Ambient temperature T
a
( ˚C )
100
10
- 9
- 30
0
20
40
60
80
Ambient temperature T
a
( ˚C )
100
Fig.10 Zero-cross Voltage vs.
Ambient Temperature
(S11MD8T/S21MD8T )
R load
I
F
= 10mA
Zero-cross voltage V
OX
( V )
25
Fig.11-a Turn-on Time vs. Forward Current
( S11MD7T )
200
V
D
= 6V
R
L
= 100Ω
Turn-on time t
on
(
µs
)
0
20
40
60
80
Ambient temperature T
a
( ˚C )
100
100
20
50
30
20
5
10
20
Forward current I
F
( mA )
50
15
-30
S11MD7T/S11MD8T/S11MD9T/S21MD7T/S21MD8T/S21MD9T
Fig.11-b Turn-on Time vs. Forward Current
(S11MD8T/S21MD8T )
100
V
D
= 6V
R
L
= 100Ω
Fig.11-c Turn-on Time vs. Forward Current
(S11MD9T/S21MD7T/S21MD9T )
200
V
D
= 6V
R
L
= 100Ω
Turn-on time t
on
(
µs
)
50
Turn-on time t
on
(
µs
)
5
10
20
Forward current I
F
( mA)
50
100
50
20
30
10
20
5
10
20
Forward current I
F
( mA )
50
Fig.12-a ON-state Current vs.
ON-state Voltage
(S11MD7T/S21MD7T/S11MD9T/S21MD9T )
100
90
80
ON-state current I
T
( mA )
I
F
= 20mA
T
a
= 25˚C
Fig.12-b ON-state Current vs.
ON-state Voltage
(S11MD8T/S21MD8T )
100
90
80
ON-state current I
T
( mA )
70
60
S21MD8T
50
S11MD8T
40
30
20
10
0
I
F
= 20mA
T
a
= 25˚C
70
60
50
40
30
20
10
0
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
ON-state voltage V
T
( V )
S11MD7T
S21MD7T
S11MD9T
S21MD9T
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
ON-state voltage V
T
( V )
s
Basic Operation Circuit
S11MD7T/S11MD8T/S11MD9T
S21MD7T/S21MD8T/S21MD9T
1
6
+
V
CC
Load
AC100V
(S11MD7T/S11MD8T/S11MD9T )
AC200V
(S21MD7T/S21MD8T/S21MD9T )
2
V
IN
Zero-
cross
circuit
4
Zero-cross Circuit
( S11MD8T/S21MD8T )
q
Please refer to the chapter “ Precautions for Use.”
The crisis is here, the bad luck is here? More importantly, the opportunity is here too. Can the government solve this crisis? Judging from the current government policies, the crisis will continue. L...
The problem of dynamic sealing of equipment always exists with the operation of the equipment. Today, we have specially sorted out the various commonly used sealing forms, usage scope and character...[Details]
"Have you set your calendar reminder?"
On August 24, Nvidia Robotics' official account posted a photo of a black gift box on a social media platform, with an attached greeting card sig...[Details]
Ever since the Tesla fire incident, electric cars, already known for their poor reputation, have been subjected to even more scathing criticism. Despite this, many people are still willing to buy t...[Details]
The most significant feature of IPS panels is that both electrodes are located on the same surface, unlike other LCD panels, which have electrodes arranged on top and bottom surfaces in a three-dim...[Details]
Definition of interactive projection system:
Interactive projection systems, also known as multimedia interactive projection, are available in floor, wall, and tabletop interactive projection....[Details]
Robotics
has become
LiDAR
's "second growth curve."
While LiDAR was still battling with its "pure vision" rivals in the automotive field, another field ignited the demand f...[Details]
The all-new MG4 was recently officially announced on the Ministry of Industry and Information Technology's (MIIT) new vehicle announcement. The all-new MG4's semi-solid-state battery version addres...[Details]
Electric vehicles are powered by electricity, and charging is a device that supplements the vehicle's energy source. It is common to need to recharge the vehicle when driving. But can you charge th...[Details]
Reflow soldering is one of the most commonly used methods in electronics manufacturing, allowing for the soldering of large numbers of components in a relatively short time. However, any experience...[Details]
Recently, Joyson Electronics has made positive progress in the core technology research and development of the robot's "brain and brain" and key components, and launched the industry's first integr...[Details]
On August 21st, BYD announced the launch of its next-generation "Little White Pile" product, the "Lingchong"
charging
pile
, which is now available for general sale. This charging pile feat...[Details]
A tubular motor is an electric motor that is typically used to control the movement of machines and equipment. Tubular motors are generally divided into two categories: linear tubular motors and ro...[Details]
A scale, a large, ground-mounted scale, is typically used to measure the tonnage of truck cargo. It's the primary weighing device used in factories, mines, and businesses for bulk cargo measurement...[Details]
"I want to ask why there are so many manufacturers making mobile phone CPUs, but only Intel and AMD make computer CPUs?"
The progress of domestic PC CPU production has disappointed many ...[Details]
introduction
The OMAP-L138 dual-core processor is a new generation of low-power single-chip systems (SoCs) from TI. It is widely used in communications, industrial, medical diagnostic, and aud...[Details]
Embedded System
京公网安备 11010802033920号
EEWORLD
