In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs,
data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device.”
11.2
MIN.
4
-
1.1
±
0.2
4
-
1.25
±
0.3
4
-
0.8
±
0.2
19.6
±
0.2
(36.0)
S102S01/S102S02/S202S01/S202S02
s
Electro-optical Characteristics
Input
Parameter
Forward voltage
Reverse current
Repetitive peak OFF-state current
ON-state voltage
Holding current
Critical rate of rise of OFF-state voltage
Critical rate of rise of commutating
OFF-state voltage
S102S02
Zero-cross voltage
S202S02
Minimum
trigger
current
S102S01
S202S01
S102S02
S202S02
( Ta = 25˚C )
Symbol
V
F
I
R
I
DRM
V
T
I
H
dV/dt
( dV/dt )
C
V
OX
I
FT
R
ISO
Conditions
I
F
= 20mA
V
R
= 3V
V
D
= V
DRM
Resistance load
I
F
= 20mA, I
T
= 2Arms
-
V
D
= 2/3 • V
DRM
T
j
= 125˚C, dI
T
/dt= - 4.0A/ms,
V
D
= 400V
I
F
= 8mA
V
D
= 12V, R
L
= 30Ω
V
D
= 6V, R
L
= 30Ω
DC500V, 40 to 60 % RH
AC 50Hz
-
-
-
Output
MIN.
-
-
-
-
-
30
5
-
-
-
10
10
-
-
-
-
-
TYP.
1.2
-
-
-
-
-
-
-
-
-
-
-
-
-
4.5
40
MAX.
1.4
10
-
4
10
-
4
1.5
50
-
-
35
8
8
-
1
10
10
-
-
Unit
V
A
A
V
rms
mA
V/µ s
V/µ s
V
mA
mA
Ω
ms
ms
ms
˚C/W
˚C/W
Transfer
charac-
teristics
Isolation resistance
Turn-on
time
S102S01
S202S01
S102S02
S202S02
t
on
t
off
R
th (j - c)
R
th (j - a)
Turn-off time
( Between junction and case )
Thermal resistance
( Between junction and ambience)
Thermal resistance
Fig. 1 RMS ON-state Current vs.
Ambient Temperature
10
9
RMS ON-state current I
T
( Arms )
8
7
(5)
6
5
4
3
2
1
0
- 25
0
25
50
75
100
Ambient temperature T
a
( ˚C )
125
(6)
(4)
(3)
(2)
(1)
( 1 ) With infinite heat sink
( 2 ) With heat sink ( 200 x 200 x 2 mm Al plate )
( 3 ) With heat sink ( 100 x 100 x 2 mm Al plate )
( 4 ) With heat sink ( 75 x 75 x 2 mm Al plate )
( 5 ) With heat sink ( 50 x 50 x 2 mm Al plate )
( 6 ) Without heat sink
( Note) With the Al heat sink set up vertically,tighten
the device at the center of the Al heat sink
with a torque of 0.4N • m and apply thermal
conductive silicone grease on the heat sink
mounting plate. Forcible cooling shall not be
carried out.
S102S01/S102S02/S202S01/S202S02
Fig. 2 RMS ON-state Current vs.
Case Temperature
10
Fig. 3 Forward Current vs.
Ambient Temperature
60
RMS ON-state current I
T
( Arms )
8
Forward current I
F
( mA )
50
40
6
30
4
20
2
10
0
- 25
0
25
50
75
100
Case temperature T
C
( ˚C )
125
0
- 25
0
25
50
75
100
Ambient temperature T
a
( ˚C )
125
Fig. 4 Forward Current vs. Forward Voltage
200
100
Forward current I
F
( mA )
Fig. 5 Surge Current vs. Power-on Cycle
100
f= 50Hz
T
j
= 25˚C Start
75˚C
20
10
- 25˚C
5
50˚C
25˚C
0˚C
Surge current I
surge
( A )
50
T
a
= 100˚C
80
60
40
20
2
1
0
0
1
1.0
Forward voltage V
F
( V )
2.0
2
5
20
10
Power-on cycle ( Times )
50
100
Fig. 6 Maximum ON-state Power Dissipation
vs. RMS ON-state Current (Typical Value)
20
T
a
= 25˚C
Maximum ON-state power dissipation ( W )
18
16
14
12
10
8
6
4
2
0
0
2
4
6
8
10
RMS ON-state current I
T
( A
rms
)
12
Fig. 7 Minimum Trigger Current vs.
Ambient Temperature (Typical Value)
10
V
D
= 12V
( S102S01/S202S01 )
V
D
= 6V
( S102S02/S202S02 )
R
L
= 30Ω
S102S01
S202S01
Minimum trigger current I
FT
( mA )
8
6
4
S102S02
S202S02
2
0
- 25
0
25
50
Ambient temperature T
a
75
( ˚C )
100
S102S01/S102S02/S202S01/S202S02
Fig. 8 Repetitive Peak OFF-state Current
vs. Ambient Temperature (Typical Value)
10
- 4
Repetitive peak OFF-state currednt I
DRM
( A )
V
D
= 400V
( S102S01/S102S02 )
V
D
= 600V
( S202S01/S202S02 )
S102S02
10
- 6
S202S02
S102S01
10
- 7
S202S01
10
- 5
10
- 8
10
- 9
- 25
0
25
50
75
Ambient temperature T
a
( ˚C )
100
q
Please refer to the chapter “ Precautions for Use ”
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