In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs,
data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device.”
S101D01/S101D02/S201D01/S201D02
s
Electrical Characteristics
Input
Parameter
Forward voltage
Reverse current
Repetitive
S101D01 / S101D02
peak OFF-state
S201D01 / S201D02
current
ON-state voltage
Holding current
Zero-cross voltage
S101D02 / S201D02
Critical rate of
S101D01 / S101D02
rise of OFF-state
S201D01 / S201D02
voltage
Minimum trigger current
Isolation resistance
Turn-on time
Symbol
V
F
I
R
I
DRM
V
T
I
H
V
OX
dV/dt
I
FT
R
ISO
t
on
Conditions
I
F
= 20mA
V
R
= 3V
V
DRM
= 400V
V
DRM
= 600V
I
T
= 1.2A
V
D
= 6V
Resistance load, I
F
= 15mA
V
DRM
= 1/
2
• 400V
V
DRM
= 1/
2
• 600V
V
D
= 6V, R
L
= 100Ω
DC500V, 40 to 60% RH
V
D
= 6V, R
L
= 100Ω , I
F
= 20mA
MIN.
-
-
-
-
-
-
-
200
100
-
5 x 10
10
-
TYP.
1.2
-
-
-
-
-
-
-
-
-
10
11
-
( Ta = 25˚C )
MAX.
1.4
10
- 5
10
- 4
10
- 4
1.7
25
35
-
-
10
-
100
Unit
V
A
A
A
V
mA
V
V/
µ
s
V/
µ
s
mA
Ω
µs
Output
Transfer
charac-
teristics
Fig. 1 RMS ON-state Current vs.
Ambient Temperature
1.6
1.4
RMS ON-state current I
T
( Arms )
Fig. 2 Forward Current vs.
Ambient Temperature
80
70
Forward current I
F
( mA )
60
50
40
30
20
10
0
- 25
1.2
1.0
0.8
0.6
0.4
0.2
0
- 25
0
40
50
25
75
85
( ˚C )
Ambient temperature T
a
100
0
25
50
55
75
85
( ˚C )
Ambient temperature T
a
100
Fig. 3 Forward Current vs.
Forward Voltage
50˚C
25˚C
0˚C
200
100
T
a
=
75˚C
Fig. 4 Minimum Trigger Current vs.
Ambient Temperature
( S101D01)
12
Minimum trigger current I
FT
( mA )
V
D
= 6V
R
L
= 100
Ω
10
Forward current I
F
( mA )
50
- 25˚C
8
20
10
5
6
4
2
1
0
2
0.5
1.0
1.5
2.0
Forward voltage V
F
( V )
2.5
3.0
0
- 30
0
20
40
60
80
Ambient temperature T
a
( ˚C )
100
S101D01/S101D02/S201D01/S201D02
Fig. 5 Minimum Trigger Current vs.
Ambient Temperature
(S101D02 , S201D02 )
12
V
D
= 6V
R
L
= 100Ω
Minimum trigger current I
FT
( mA )
Minimum trigger current I
FT
( mA )
10
10
Fig. 6 Minimum Trigger Current vs.
Ambient Temperature
(S201D01 )
12
V
D
= 6V
R
L
= 100Ω
8
8
6
6
4
4
2
2
0
- 30
0
20
40
60
80
Ambient temperature T
a
( ˚C )
100
0
- 30
0
20
40
60
80
Ambient temperature T
a
( ˚C )
100
Fig. 7 ON-state Voltage vs.
Ambient Temperature
1.4
I
T
= 1.2A
1.3
ON-state voltage V
T
( V )
Fig. 8 Relative Holding Current vs.
Ambient Temperature
Relative holding current I
H
(t˚C) /I
H
( 25˚C ) x 100(% )
V
D
= 6V
10
3
1.2
1.1
10
2
1.0
0.9
0.8
- 30
0
20
40
60
80
Ambient temperature T
a
( ˚C )
100
10
1
- 30
0
20
40
60
80
Ambient temperature T
a
( ˚C )
100
Fig. 9 ON-state Current vs.
ON-state Voltage
1.2
I
F
= 20mA
T
a
= 25˚C
1.0
Fig.10 Turn-on Time vs. Forward Current
(S101D01 )
100
90
80
70
60
Turn-on time t
on
(
µ
s )
50
40
30
V
D
= 6V
R
L
= 100Ω
T
a
= 25˚C
ON-state current I
T
( A )
0.8
0.6
0.4
20
0.2
0
0
0.5
1.0
ON-state voltage V
T
( V )
1.5
10
10
20
30
40 50
Forward current I
F
( mA )
100
S101D01/S101D02/S201D01/S201D02
Fig.11 Turn-on Time vs. Forward Current
(S101D02 , S201D02 )
100
V
D
= 6V
R
L
= 100Ω
T
a
= 25˚C
Turn-on time t
on
(
µ
s )
Turn-on time t
on
(
µ
s )
50
40
30
100
Fig.12 Turn-on Time vs. Forward Current
(S201D01)
200
V
D
= 6V
R
L
= 100Ω
T
a
= 25˚C
50
40
30
20
10
10
20
30
40 50
Forward current I
F
( mA )
100
20
10
20
30
40 50
Forward current I
F
( mA )
100
s
Basic Operation Circuit
R
1
+
V
CC
D
1
3
V
1
Tr1
Z
S
:
Surge absorption circuit
2
SSR
11
13
Z
S
Load
AC 100V (
S101D01
/
S101D02
)
AC 200V (
S201D01
/
S201D02
)
( 1 ) DC Drive
AC supply voltage
Input signal
Load current
( for resistance load)
( 2 ) Pulse Drive
( 3 ) Phase Control
9
Notes 1 ) If large amount of surge is loaded onto V
CC
or the driver circuit, add a diode D
1
between terminals 2
and 3 to prevent reverse bias from being applied to the infrared LED.
2 ) Be sure to install a surge absorption circuit.
An appropriate circuit must be chosen according to the load ( for CR, choose its constant ) . This must be
carefully done especially for an inductive load.
) For phase control, adjust such that the load current immediately after the input signal is applied will be
3
more than 60mA.
( Precautions for Use )
1 ) All pins must be soldered since they are also used as heat sinks ( heat radiation fins ) . In designing, take into the
heat radiation from the mounted SSR.
2 ) For higher radiation efficiency that allows wider thermal margin, secure a wider round pattern for Pin 13 when
designing mounting pattern. The rounded part of Pin 15 ( gate ) must be as small as possible. Pulling the gate
pattern around increases the change of being affected by external noise.
3 ) As for other general cautions, refer to the chapter “ Precautions for Use ”
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