S1A THRU S1M
SURFACE MOUNT RECTIFIER
Reverse Voltage -
50 to 1000 Volts
DO-214AC
Forward Current -
1.0 Ampere
FEATURES
♦
Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
♦
For surface mounted applications
♦
Low profile package
♦
Built-in strain relief, ideal for
automated placement
♦
Glass passivated chip junction
♦
High temperature soldering:
250°C/10 seconds at terminals
0.065 (1.65)
0.049 (1.25)
0.110 (2.79)
0.100 (2.54)
0.177 (4.50)
0.157 (3.99)
0.012 (0.305)
0.006 (0.152)
0.090 (2.29)
0.078 (1.98)
MECHANICAL DATA
Case:
JEDEC DO-214AC molded plastic over
passivated chip
Terminals:
Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity:
Color band denotes cathode end
Weight:
0.002 ounce, 0.064 gram
0.060 (1.52)
0.030 (0.76)
0.008 (0.203) MAX.
0.208 (5.28)
0.194 (4.93)
Dimensions are in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
SYMBOLS
S1A
SA
S1B
SB
S1D
SD
S1G
SG
S1J
SJ
S!K
SK
S1M
SM
UNITS
Device marking code
Maximum recurrent peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
See Figure 1
Peak forward surge current
8.3ms single half sine-wave superimposed on
rated load (JEDEC Method) T
L
=110°C
Maximum instantaneous forward voltage at 1.0A
Maximum DC reverse current
at Rated DC blocking voltage
Typical reverse recovery time
(NOTE 1)
Typical junction capacitance
(NOTE 2)
Typical thermal resistance
(NOTE 3)
Operating junction and storage temperature range
T
A
=25°C
T
A
=125°C
V
RRM
V
RMS
VDC
I
(AV)
50
35
50
100
70
100
200
140
200
400
280
400
1.0
600
420
600
800
560
800
1000
700
1000
Volts
Volts
Volts
Amp
I
FSM
V
F
I
R
t
rr
C
J
R
ΘJA
R
ΘJL
T
J
, T
STG
40.0
1.10
1.0
50.0
1.8
12.0
75.0
27.0
-55 to +150
30.0
Amps
Volts
5.0
µA
µs
pF
85.0
30.0
°C/W
°C
NOTES:
(1) Reverse recovery test conditions: I
F
=0.5A, I
R
=1.0A, I
rr
=0.25A
(2) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
(3) Thermal resistance from junction to ambient and from junction to lead mounted on
0.2 x 0.2” (5.0 x 5.0mm) copper pad areas
4/98
RATING AND CHARACTERISTIC CURVES S1A THRU S1M
FIG. 1 - FORWARD CURRENT DERATING CURVE
AVERAGE FORWARD CURRENT,
AMPERES
FIG. 2 - MAXIMUM NON-REPETITIVE PEAK
FORWARD SURGE CURRENT
1.2
RESISTIVE OR INDUCTIVE LOAD
100
PEAK FORWARD SURGE CURRENT,
AMPERES
1.0
S1(A-J)
TL=110°C
8.3ms SINGLE HALF SINE-WAVE
(JEDEC Method)
0.8
S1(K,M)
S1(A-J)
0.6
0.4
0.2
0
0.2 x 0.2” (5.0 x 5.0mm)
THICK COPPER PAD AREAS
10
S1(K,M)
0
20
40
60
80
100
120
140
160
LEAD TEMPERATURE, °C
1
1
10
NUMBER OF CYCLES AT 60 H
Z
100
FIG. 3 - TYPICAL INSTANTANEOUS FORWARD
CHARACTERISTICS
FIG. 4 - TYPICAL REVERSE CHARACTERISTICS
100
100
INSTANTANEOUS FORWARD CURRENT,
AMPERES
INSTANTANEOUS REVERSE CURRENT,
MICROAMPERES
10
T
J
=25°C
10
T
J
=125°C
1
1
T
J
=75°C
0.1
PULSE WIDTH=300µs
1% DUTY CYCLE
0.1
T
J
=25°C
0.01
0.01
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
0.001
0
20
40
60
80
100
PERCENT OF RATED PEAK REVERSE
VOLTAGE, %
INSTANTANEOUS FORWARD VOLTAGE, VOLTS
FIG. 5 - TYPICAL JUNCTION CAPACITANCE
TRANSIENT THERMAL IMPEDANCE, °C/W
FIG. 6 - TRANSIENT THERMAL IMPEDANCE
100
JUNCTION CAPACITANCE, pF
1,000
T
J
=25°C
f=1.0 MH
Z
Vsig=50mVp-p
100
S1(K,M)
10
S1(A-J)
10
UNITS MOUNTED on
0.20 x 0.20” (5.0 x 5.0mm) x 0.5 mil.
INCHES (0.013mm)
THICK COPPER LAND AREAS
1
0.01
0.1
1
10
100
REVERSE VOLTAGE, VOLTS
1
0.01
0.1
1
t, PULSE DURATION,
10
100
Embedded System
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