Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BTM7751G
MA000913874
PG-DSO-28-22
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
11.033
0.072
0.288
5.754
233.637
1.728
1.098
78.525
469.504
4.913
0.196
0.000
0.678
0.546
2.573
Average
Mass
[%]
1.36
0.01
0.04
0.71
28.82
0.21
0.14
9.69
57.92
0.61
0.02
0.00
0.08
0.07
0.32
29. August 2013
810.55 mg
Sum
[%]
1.36
Average
Mass
[ppm]
13612
89
355
7099
29.58
0.21
288247
2132
1355
96879
67.75
0.61
579244
6062
242
1
0.10
836
673
0.39
3174
3847
1000000
1079
677478
6062
295790
2132
Sum
[ppm]
13612
wire
encapsulation
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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