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BCR27400DCAKWS

Description
Fixed Resistor, Thin Film, 0.25W, 2740ohm, 75V, 0.5% +/-Tol, 50ppm/Cel, Surface Mount, 0202, CHIP
CategoryPassive components    The resistor   
File Size80KB,3 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Environmental Compliance
Download Datasheet Parametric View All

BCR27400DCAKWS Overview

Fixed Resistor, Thin Film, 0.25W, 2740ohm, 75V, 0.5% +/-Tol, 50ppm/Cel, Surface Mount, 0202, CHIP

BCR27400DCAKWS Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid968489605
package instructionCHIP
Reach Compliance Codeunknown
ECCN codeEAR99
structureRectangular
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature175 °C
Minimum operating temperature-55 °C
Package height0.254 mm
Package length0.5 mm
Package formSMT
Package width0.5 mm
method of packingWAFFLE PACK
Rated power dissipation(P)0.25 W
Rated temperature70 °C
resistance2740 Ω
Resistor typeFIXED RESISTOR
size code0202
surface mountYES
technologyTHIN FILM
Temperature Coefficient50 ppm/°C
Terminal surfaceAluminum (Al)
Terminal shapeONE SURFACE
Tolerance0.5%
Operating Voltage75 V
BCR
www.vishay.com
Vishay Electro-Films
Thin Film, Back-Contact Resistor
FEATURES
Product may not be to scale
The Back Contact Resistor (BCR) series single-value
back-contact resistor chip is one of the smallest chips
available.
The BCR requires only one wire bond thus saving hybrid
space.
The BCRs are manufactured using Vishay Electro-Films
(EFI) sophisticated thin film equipment and manufacturing
technology. The BCRs are 100 % electrically tested and
visually inspected to MIL-STD-883, method 2032 class H
or K.
Wire bondable
Only one wire bond required
Small size: 0.020 inches square
Resistance range: 10
to 1 M
Oxidized silicon substrate for good power
dissipation
Moisture resistant
Case size: 0202
Resistor material: tantalum nitride, self-passivating
Material categorization: for definitions of compliance
please see
www.vishay.com/doc?99912
APPLICATIONS
Vishay EFI BCR resistor chips are widely used in hybrid
packages where space is limited. The bottom connection is
made by attaching the back of the chip to the substrate
either eutectic or with conductive epoxy. The single wire
bond is made to the notched pad on the top of the chip. (The
other rectangular pad on the top of the chip is a via hole, a
low-ohmic contact connecting the resistor to the bottom of
the chip.)
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES, AND TOLERANCES
PARAMETER
Total Resistance Range
Standard Tolerances
TCR
VALUE
10 to 1M
± 0.1, ± 0.2, ± 0.5, ± 1, ± 2, ± 5
± 25, ± 50, ± 100, ± 250
UNIT
%
ppm/°C
Tightest Standard Tolerance Available
5%
2%
1%
0.5 % 0.2 %
0.1 %
± 25 ppm/°C
± 50 ppm/°C
± 100 ppm/°C
± 250 ppm/°C
360 kΩ
1 MΩ
200 kΩ
620 kΩ
10
Ω
20
Ω
50
Ω
100
Ω
200
Ω
1 kΩ
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
Noise, MIL-STD-202, Method 308
100
to 250 k
< 100
or > 251 k
Moisture resistance, MIL-STD-202, Method 106
Stability, 1000 h, +125 °C, 125 mW
Operating Temperature Range
Thermal Shock, MIL-STD-202, Method 107, Test Condition F
High Temperature Exposure, +150 °C, 100 h
Dielectric Voltage Breakdown
Insulation Resistance
Operating Voltage
DC Power Rating at +70 °C (Derated to Zero at +175 °C)
5x Rated Power Short-Time Overload, +25 °C, 5 s
Revision: 21-Feb-17
VALUE
-35 typ.
-20 typ.
± 0.5 max.
R/R
± 1.0 max.
R/R
-55 to +125
± 0.25 max.
R/R
± 0.5 max.
R/R
200
10
12
min.
75 max.
0.250
± 0.25 max.
R/R
UNIT
dB
%
%
°C
%
%
V
V
W
%
Document Number: 61023
1
For technical questions, contact:
efi@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
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