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PZU5.6B2,115

Description
zener diodes zener diode
CategoryDiscrete semiconductor    diode   
File Size122KB,13 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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PZU5.6B2,115 Overview

zener diodes zener diode

PZU5.6B2,115 Parametric

Parameter NameAttribute value
Brand NameNXP Semiconduc
Is it Rohs certified?conform to
Parts packaging codeSOD
package instructionPLASTIC, SC-90, 2 PIN
Contacts2
Manufacturer packaging codeSOD323F
Reach Compliance Codecompli
ECCN codeEAR99
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
Maximum dynamic impedance100 Ω
JESD-30 codeR-PDSO-F2
JESD-609 codee3
Humidity sensitivity level1
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-65 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
polarityUNIDIRECTIONAL
Maximum power dissipation0.31 W
Certification statusNot Qualified
GuidelineIEC-60134
Nominal reference voltage5.6 V
surface mountYES
technologyZENER
Terminal surfaceTin (Sn)
Terminal formFLAT
Terminal locationDUAL
Maximum time at peak reflow temperature40
Maximum voltage tolerance2%
Working test current5 mA
Base Number Matches1
PZUxB series
Single Zener diodes in a SOD323F package
Rev. 02 — 15 November 2009
Product data sheet
1. Product profile
1.1 General description
General-purpose Zener diodes in a SOD323F (SC-90) very small and flat lead Surface
Mounted Device (SMD) plastic package.
1.2 Features
Total power dissipation:
310 mW
Tolerance series: B: approximately
±5
%; B1, B2, B3: sequential, approximately
±2
%
Small plastic package suitable for surface mounted design
Wide working voltage range: nominal 2.4 V to 36 V
1.3 Applications
General regulation functions
1.4 Quick reference data
Table 1.
Symbol
V
F
P
tot
Quick reference data
Parameter
forward voltage
total power dissipation
Conditions
I
F
= 100 mA
T
amb
25
°C
[1]
[2]
[3]
Min
-
-
-
Typ
-
-
-
Max
1.1
310
550
Unit
V
mW
mW
[1]
[2]
[3]
Pulse test: t
p
300
μs; δ ≤
0.02
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1cm
2
.

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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