EEWORLDEEWORLDEEWORLD

Part Number

Search

CR2010-2W-1070DSNB

Description
Fixed Resistor, Metal Glaze/thick Film, 0.5W, 107ohm, 200V, 0.5% +/-Tol, -100,100ppm/Cel, 2010,
CategoryPassive components    The resistor   
File Size59KB,6 Pages
ManufacturerVENKEL LTD
Environmental Compliance
Download Datasheet Parametric View All

CR2010-2W-1070DSNB Overview

Fixed Resistor, Metal Glaze/thick Film, 0.5W, 107ohm, 200V, 0.5% +/-Tol, -100,100ppm/Cel, 2010,

CR2010-2W-1070DSNB Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid836436943
Reach Compliance Codenot_compliant
ECCN codeEAR99
structureChip
JESD-609 codee3
Number of terminals2
Maximum operating temperature175 °C
Minimum operating temperature-55 °C
Package height0.56 mm
Package length5 mm
Package formSMT
Package width2.5 mm
method of packingBulk
Rated power dissipation(P)0.5 W
resistance107 Ω
Resistor typeFIXED RESISTOR
seriesCR2010-2W(D,F TOL)
size code2010
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient100 ppm/°C
Terminal surfaceMatte Tin (Sn) - with Nickel (Ni) barrier
Tolerance0.5%
Operating Voltage200 V
Chip Resistors – CR, LCR and ULCR
Features
Flat Chip Resistors for surface mount applications
LCR and ULCR for current sensing applications
Dimensions
L
C
C
C
C
t
w
0201
L (Length) Inches
(mm)
W (Width) Inches
(mm)
t (Thickness) Inches
(mm)
C (End Band) Inches
(mm)
0.024
±
.002
(0.6
±
0.05)
0.012
±
.001
(0.3
±
0.02)
0.010
±
.002
(0.25
±
0.05)
0.006
±
.002
(0.15
±
0.05)
0402
0.040
±
.002
(1.0
±
0.05)
0.020
±
.001
(0.5
±
0.02)
0.014
±
.002
(0.35
±
.05)
0.008
±
.004
(0.2
±
0.1)
0603
0.063
±
.004
(1.6
±
0.1)
0.031
±
.004
(0.8
±
0.1)
0.018
±
.004
(0.45
±
0.1)
0.012
±
.006
(0.30
±
0.15)
0805
0.079
±
.006
(2.0
±
0.15)
0.050
±
.006
(1.25
±
0.15)
0.018
±
.006
(0.45
±
0.15)
0.014
±
.006
(0.35
±
0.15)
1206
0.126
±
.006
(3.2
±
0.15)
0.063
±
.006
(1.6
±
0.15)
0.022
±
.006
(0.56
±
0.15)
0.020
±
.008
(0.50
±
0.20)
1210
0.126
±
.006
(3.2
±
0.15)
0.098
±
.006
(2.50
±
0.15)
0.022
±
.006
(0.56
±
0.15)
0.020
±
.008
(0.50
±
0.20)
2010
0.197
±
.006
(5.0
±
0.15)
0.098
±
.006
(2.50
±
0.15)
0.022
±
.006
(0.56
±
0.15)
0.024
±
.008
(0.60
±
0.20)
2512
0.248
±
.006
(6.3
±
0.15)
0.126
±
.006
(3.2
±
0.15)
0.022
±
.006
(0.56
±
0.15)
0.024
±
.008
(0.60
±
0.20)
Structure
CR Series
3
LCR and ULCR Series
2
3
2
4
5
6
1
Description
1
2
3
4
5
6
Substrate
Resistive element
Protective coating
Inner termination
Inner Plating
Outer Plating
Alumina
Ruthenium Oxide (RuO
2
)
Boro-Silicate Glass
Silver Palladium (Ag-Pd)
Nickel (Ni)
Solder Plating, Sn-Pb
(100% Sn for Lead free)
1
2
3
4
5
6
7
Substrate
Resistive element
Protective coating
Inner termination
1st Plating
2nd Plating
3rd Plating
7
4
5
6
1
Description
Alumina
Silver Palladium (Ag-Pd)
Boro-Silicate Glass
Silver Palladium (Ag-Pd)
Copper (Cu)
Nickel (Ni)
Solder Plating, Sn-Pb
(100% Sn for Lead free)
5900 Shepherd Mountain Cove • Austin, TX 78730
Phone: 512 / 794-0081 • Fax: 512 / 794-0087 • Toll Free: 800 / 950-8365
e-mail: sales@venkel.com • www.venkel.com
44
Questions about zcl
I have been looking at ZCL stuff, but now I want to implement security under HA. I saw that there is a family in ZCL for this purpose, but now I am working on it based on the TI 2530 protocol station,...
cfqz11234 RF/Wirelessly
Several dusty boards, 430/7620/2440/GPRS modules
1. LSD-TEST430F548 development board, 1 piece, CPU is MSP430F5438, with a black and white LCD, acceleration sensor, 120 yuan 2. MSP430F5438 core board, 2 pieces, CPU is MSP430F5438, all I/O leads are ...
losingamong Buy&Sell
PLL frequency multiplication problem
The external crystal selects 6M and 8M PLL is 400M, but the error is 0 when 6M is selected, and the error is 0.0047% when 8M is selected. I don't know what this means. Since there is an error, why is ...
啸傲 Microcontroller MCU
I have a question: When I was building a project in EVC, I clicked the final Finish button and it froze. Is it because my memory is too high? I have 256
: When I was building a project in EVC, I clicked the final Finish button and it froze. Is it because my memory is too high? I have 256...
ccec Embedded System
Bluetooth debugging process
1. Create a Bluetooth project 2. Import header files #import3. Implement proxy:[/size] [size=4]4. Create the central device and peripheral device arrays and initialize them. [/size] [size=4] [/size] [...
灞波儿奔 RF/Wirelessly
May I ask which software is the main one for PCB board design in coastal areas?
I am a student majoring in electronics. I would like to ask which software is mainly used for PCB board design in the coastal area. Our school only teaches protel 99 se....
zengpeipei PCB Design

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1936  513  1445  2298  2444  39  11  30  47  50 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号