REVISIONS
LTR
A
DESCRIPTION
Add device type 03. Add case outline H. Add radiation hardness
requirements.
Update boilerplate to reflect new requirements. - rrp
Make change to TCV
OS
, I
OS
, I
IB
, CMRR, V
O
, PSRR, SR, GBW, P
D
tests as
specified under table I. Make change to figure 1. Add subgroup 7 to table IIA.
- ro
Make changes to V
O
and P
D
tests as specified in table I. Add footnote 2/ to
Group C end point electrical parameters under the device class “V” column.
Delete figure 2, the radiation exposure circuit. - ro.
Drawing updated to reflect current requirements. -rrp
DATE (YR-MO-DA)
00-07-12
APPROVED
R. MONNIN
B
00-10-23
R. MONNIN
C
03-02-18
R. MONNIN
D
05-03-09
R. MONNIN
THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
PREPARED BY
RICK OFFICER
D
1
D
2
D
3
D
4
D
5
D
6
D
7
D
8
D
9
D
10
D
11
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
CHARLES REUSING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
APPROVED BY
MICHAEL A. FRYE
MICROCIRCUIT, LINEAR, JFET-INPUT,
OPERATIONAL AMPLIFIER, MONOLITHIC
SILICON
DRAWING APPROVAL DATE
89-10-31
AMSC N/A
REVISION LEVEL
D
SIZE
A
SHEET
CAGE CODE
67268
1 OF
11
5962-89542
DSCC FORM 2233
APR 97
5962-E170-05
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M)
and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or
Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
1.2 PIN. The PIN is as shown in the following examples.
For device classes M and Q:
5962
-
89542
01
G
X
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
Device
type
(see 1.2.2)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\/
Drawing number
For device class V:
5962
R
89542
01
V
G
X
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
03
Generic number
OP-15A
OP-15B
OP-15A
Circuit function
JFET-Input, operational amplifier
JFET-Input, operational amplifier
Radiation hardened, JFET-Input, operational amplifier
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed
below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q
designators will not be included in the PIN and will not be marked on the device.
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant, non-
JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Certification and qualification to MIL-PRF-38535
Q or V
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89542
SHEET
D
2
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
G
H
P
Descriptive designator
MACY1-X8
GDFP1-F10 or CDFP2-F10
GDIP1-T8 or CDIP2-T8
Terminals
8
10
8
Package style
Can
Flat pack
Dual-in-line
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1.3 Absolute maximum ratings. 1/
Positive supply voltage (+V
S
) ....................................................................... +22 V dc
Negative supply voltage (-V
S
) .......................................................................
Storage temperature range ...........................................................................
Maximum power dissipation (P
D
) ..................................................................
Differential input voltage ...............................................................................
Input voltage .................................................................................................
Output short circuit duration ..........................................................................
Lead temperature (soldering, 60 seconds) ...................................................
Junction temperature (T
J
) .............................................................................
-22 V dc
-65°C to +150°C
500 mW 2/
±40 V
±20 V
Indefinite
+300°C
+150°C
Thermal resistance, junction-to-case (θ
JC
) ................................................... See MIL-STD-1835
Thermal resistance, junction-to-ambient (θ
JA
) 2/
Case G ..................................................................................................... 150°C/W
Case P ..................................................................................................... 119°C/W
Case H ..................................................................................................... 180°C/W
1.4 Recommended operating conditions.
Supply voltage (V
S
) ...................................................................................... ±15 V
Ambient operating temperature (T
A
) ............................................................. -55°C to +125°C
1.5 Radiation features.
Maximum total dose available (dose rate = 50 – 300 rads(Si)/s) ................. 100 Krads 3/
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
1/
2/
Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
Derate linearly 6.7 mW/°C above T
A
= +75°C for P package; derate linearly 7.1 mW/°C above T
A
= +80°C for G package;
derate linearly 5.6 mW/°C above T
A
= +70°C for H package.
3/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects.
Radiation end point limits for the noted parameters are guaranteed only for the conditions as specified in MIL-STD-883,
method 1019, condition A.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89542
SHEET
D
3
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
http://assist.daps.dla.mil
or
from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document
revision level control and shall be made available to the preparing and acquiring activity upon request.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be
in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89542
SHEET
D
4
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions 1/ 2/ 3/
-55°C
≤
T
A
≤
+125°C
unless otherwise specified
Group A
subgroups
Device
Type
Min
Input offset voltage
V
OS
V
CM
= 0 V
M,D,P,L,R
1
2, 3
1
1
2, 3
Input offset voltage
temperature coefficient
Input offset current
TCV
OS
I
OS
-55°C and +125°C 4/
V
S
= ±20 V, V
CM
= 0 V 5/
M,D,P,L,R
2, 3
1, 3
2
1
1, 3
2
Input bias current
I
IB
V
S
= ±20 V, V
CM
= 0 V 5/
M,D,P,L,R
1, 3
2
1
1, 3
2
Common mode rejection 4/
ratio
Output voltage swing 4/
V
O
CMRR
V
CM
= IVR = ±10.5 V
V
CM
= IVR = ±10.4 V
R
L
= 2 kΩ
R
L
= 10 kΩ
Large-signal voltage gain
A
VO
V
O
= ±10 V, R
L
= 2 kΩ
M,D,P,L,R
1
2, 3
4
5, 6
4
5, 6
4
4
5, 6
See footnotes at end of table.
03
02
01, 03
All
All
86
85
±11.0
±12.0
100
35
50
75
30
V/mV
V
03
02
01, 03
03
02
03
01, 03
03
02
01, 03
Limits
Unit
Max
0.5
0.9
1.0
1.0
2.0
10
±10
±4
±0.3
±20
±6
±50
±5.0
±3.0
±100
±7.5
µV/°C
pA
nA
nA
pA
nA
pA
nA
nA
pA
nA
dB
mV
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-89542
SHEET
D
5
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