5962-9214801QRA datasheet, PDF

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5962-9214801QRA: DescriptionBus Transceiver, ABT Series, 2-Func, 4-Bit, True Output, BICMOS, CDIP20, 0.300 INCH, CERDIP-20; Categorylogic logic; File Size90KB，18 Pages; Manufacturere2v technologies

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5962-9214801QRA Overview

Bus Transceiver, ABT Series, 2-Func, 4-Bit, True Output, BICMOS, CDIP20, 0.300 INCH, CERDIP-20

5962-9214801QRA Parametric

Parameter Name	Attribute value
Parts packaging code	DIP
package instruction	DIP, DIP20,.3
Contacts	20
Reach Compliance Code	compli
Other features	WITH DIRECTION CONTROL
Control type	COMMON CONTROL
Counting direction	BIDIRECTIONAL
series	ABT
JESD-30 code	R-GDIP-T20
JESD-609 code	e0
length	24.51 mm
Logic integrated circuit type	BUS TRANSCEIVER
MaximumI(ol)	0.048 A
Number of digits	4
Number of functions	2
Number of ports	2
Number of terminals	20
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Output characteristics	3-STATE
Output polarity	TRUE
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP20,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Prop。Delay @ Nom-Su	4.8 ns
propagation delay (tpd)	4.8 ns
Certification status	Qualified
Filter level	MIL-PRF-38535 Class Q
Maximum seat height	5.08 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	BICMOS
Temperature level	MILITARY
Terminal surface	TIN LEAD
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
translate	N/A
width	7.62 mm
Base Number Matches	1

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REVISIONS

LTR

DESCRIPTION

Add device type 02. Add ground bounce limits. Change input high and low

current. Change quiescent supply current, delta. Change input and input/output

capacitance. Change propagation delay times for device type 01 - jak.

Change I

, I

∆I

, V

OLP

, V

OLV

, V

OHP

, and V

OHV

for device type 02.

Editorial changes throughout. - jak.

Changes IAW NOR 5962-058-98 – jak.

Correct V

OH3

and I

in Table I. Editorial changes throughout – jak.

DATE (YR-MO-DA)

95-04-05

APPROVED

Monica L. Poelking

97-09-22

Thomas M. Hess

98-03-27

99-11-24

Monica L. Poelking

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

PMIC N/A

REV

SHEET

PREPARED BY

Joseph A. Kerby

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216

STANDARD

MICROCIRCUIT

DRAWING

THIS DRAWING IS AVAILABLE

FOR USE BY ALL

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

CHECKED BY

Thanh V. Nguyen

APPROVED BY

Monica L. Poelking

DRAWING APPROVAL DATE

93-12-15

REVISION LEVEL

MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR

CMOS, OCTAL TRANSCEIVER WITH THREE-STATE

OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC

SILICON

SIZE

CAGE CODE

AMSC N/A

SHEET

67268

5962-92148

DSCC FORM 2233

APR 97

DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.

5962-E021-00

HANDBOOKS

DEPARTMENT OF DEFENSE

MIL-HDBK-103

MIL-HDBK-780

List of Standard Microcircuit Drawings (SMD's).

Standard Microcircuit Drawings.

(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization Document Order

Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this

drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has

been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with

MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The

modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for

device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-

38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.

3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.

3.2.3 Truth table. The truth table shall be as specified on figure 2.

3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3.

3.2.5 Ground bounce test circuit and waveforms. The ground bounce test circuit and waveforms shall be as specified on figure 4.

3.2.6 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 5.

3.2.7 Radiation exposure circuit. The radiation exposure circuit shall be as specified when available.

3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical

performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating

temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each

subgroup are defined in table I.

3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked as listed

in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer

has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be marked.

Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with

MIL-PRF-38535, appendix A.

3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in MIL-PRF-

38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.

3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed

manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall

be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate

of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's

product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-

PRF-38535, appendix A and herein.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-92148

SHEET

3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or

for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.

3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2

herein) involving devices acquired to this drawing is required for any change as defined in MIL-STD-973.

3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain

the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made

available onshore at the option of the reviewer.

3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in

microcircuit group number 126 See MIL-PRF-38535, appendix A).

4. QUALITY ASSURANCE PROVISIONS

4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with

MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan

shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be

in accordance with MIL-PRF-38535, appendix A.

4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted

on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in

accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.

4.2.1 Additional criteria for device class M.

a. Burn-in test, method 1015 of MIL-STD-883.

(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document

revision level control and shall be made available to the preparing or acquiring activity upon request. The

test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance

with the intent specified in test method 1015.

(2) T

= +125°C, minimum.

b. Interim and final electrical test parameters shall be as specified in table II herein.

4.2.2 Additional criteria for device classes Q and V.

a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in

the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be

maintained under document revision level control of the device manufacturer's Technology Review Board

(TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity

upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable,

in accordance with the intent specified in test method 1015 of MIL-STD-883.

b. Interim and final electrical test parameters shall be as specified in table II herein.

c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in

MIL-PRF-38535, appendix B.

4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in

accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for

groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).

4.3.1 Electrostatic discharge sensitivity qualification inspection . Electrostatic discharge sensitivity (ESDS) testing shall

be performed in accordance with MIL-STD-883, method 3015. ESDS testing shall be measured only for initial qualification

and after process or design changes which may affect ESDS classification.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-92148

SHEET

5962-9214801QRA Related Products

	5962-9214801QRA	5962-9214801QSA
Description	Bus Transceiver, ABT Series, 2-Func, 4-Bit, True Output, BICMOS, CDIP20, 0.300 INCH, CERDIP-20	Bus Transceiver, ABT Series, 2-Func, 4-Bit, True Output, BICMOS, CDFP20, CERAMIC, DFP-20
Parts packaging code	DIP	DFP
package instruction	DIP, DIP20,.3	DFP, FL20,.3
Contacts	20	20
Reach Compliance Code	compli	compli
Other features	WITH DIRECTION CONTROL	WITH DIRECTION CONTROL
Control type	COMMON CONTROL	COMMON CONTROL
Counting direction	BIDIRECTIONAL	BIDIRECTIONAL
series	ABT	ABT
JESD-30 code	R-GDIP-T20	R-GDFP-F20
JESD-609 code	e0	e0
Logic integrated circuit type	BUS TRANSCEIVER	BUS TRANSCEIVER
MaximumI(ol)	0.048 A	0.048 A
Number of digits	4	4
Number of functions	2	2
Number of ports	2	2
Number of terminals	20	20
Maximum operating temperature	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C
Output characteristics	3-STATE	3-STATE
Output polarity	TRUE	TRUE
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
encapsulated code	DIP	DFP
Encapsulate equivalent code	DIP20,.3	FL20,.3
Package shape	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	FLATPACK
power supply	5 V	5 V
Prop。Delay @ Nom-Su	4.8 ns	4.8 ns
propagation delay (tpd)	4.8 ns	4.8 ns
Certification status	Qualified	Qualified
Filter level	MIL-PRF-38535 Class Q	MIL-PRF-38535 Class Q
Maximum seat height	5.08 mm	2.286 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V
surface mount	NO	YES
technology	BICMOS	BICMOS
Temperature level	MILITARY	MILITARY
Terminal surface	TIN LEAD	TIN LEAD
Terminal form	THROUGH-HOLE	FLAT
Terminal pitch	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL
translate	N/A	N/A
width	7.62 mm	6.731 mm
Base Number Matches	1	1

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