OTP ROM, 128KX8, 150ns, CMOS, PDIP32, PLASTIC, DIP-32
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Parts packaging code | DIP |
| package instruction | DIP, DIP32,.6 |
| Contacts | 32 |
| Reach Compliance Code | unknow |
| ECCN code | EAR99 |
| Maximum access time | 150 ns |
| I/O type | COMMON |
| JESD-30 code | R-PDIP-T32 |
| JESD-609 code | e0 |
| length | 41.91 mm |
| memory density | 1048576 bi |
| Memory IC Type | OTP ROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 32 |
| word count | 131072 words |
| character code | 128000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 128KX8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP32,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 4.83 mm |
| Maximum standby current | 0.0001 A |
| Maximum slew rate | 0.03 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 15.24 mm |
| Base Number Matches | 1 |

| P27C100-150V10 | 27C100-120V10 | 27C100-150V10 | 27C100-200V10 | P27C100-200V10 | |
|---|---|---|---|---|---|
| Description | OTP ROM, 128KX8, 150ns, CMOS, PDIP32, PLASTIC, DIP-32 | UVPROM, 128KX8, 120ns, CMOS, CDIP32, WINDOWED, CERDIP-32 | UVPROM, 128KX8, 150ns, CMOS, CDIP32, WINDOWED, CERDIP-32 | UVPROM, 128KX8, 200ns, CMOS, CDIP32, WINDOWED, CERDIP-32 | OTP ROM, 128KX8, 200ns, CMOS, PDIP32, PLASTIC, DIP-32 |
| Parts packaging code | DIP | DIP | DIP | DIP | DIP |
| package instruction | DIP, DIP32,.6 | WDIP, | WDIP, | WDIP, | DIP, DIP32,.6 |
| Contacts | 32 | 32 | 32 | 32 | 32 |
| Reach Compliance Code | unknow | unknow | unknow | unknow | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 150 ns | 120 ns | 150 ns | 200 ns | 200 ns |
| JESD-30 code | R-PDIP-T32 | R-GDIP-T32 | R-GDIP-T32 | R-GDIP-T32 | R-PDIP-T32 |
| length | 41.91 mm | 42.165 mm | 42.165 mm | 42.165 mm | 41.91 mm |
| memory density | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bit |
| Memory IC Type | OTP ROM | UVPROM | UVPROM | UVPROM | OTP ROM |
| memory width | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 32 | 32 | 32 | 32 | 32 |
| word count | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
| character code | 128000 | 128000 | 128000 | 128000 | 128000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| encapsulated code | DIP | WDIP | WDIP | WDIP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE, WINDOW | IN-LINE, WINDOW | IN-LINE, WINDOW | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 4.83 mm | 5.72 mm | 5.72 mm | 5.72 mm | 4.83 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
| width | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |