27C100-150V10 datasheet, PDF - EEWORLD Datasheet

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27C100-150V10: DescriptionUVPROM, 128KX8, 150ns, CMOS, CDIP32, WINDOWED, CERDIP-32; Categorystorage storage; File Size583KB，10 Pages; ManufacturerIntel; Websitehttp://www.intel.com/

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27C100-150V10 Overview

UVPROM, 128KX8, 150ns, CMOS, CDIP32, WINDOWED, CERDIP-32

27C100-150V10 Parametric

Parameter Name	Attribute value
Parts packaging code	DIP
package instruction	WDIP,
Contacts	32
Reach Compliance Code	unknow
ECCN code	EAR99
Maximum access time	150 ns
JESD-30 code	R-GDIP-T32
length	42.165 mm
memory density	1048576 bi
Memory IC Type	UVPROM
memory width	8
Number of functions	1
Number of terminals	32
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128KX8
Output characteristics	3-STATE
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	WDIP
Package shape	RECTANGULAR
Package form	IN-LINE, WINDOW
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	5.72 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm
Base Number Matches	1

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27C100-150V10 Related Products

	27C100-150V10	27C100-120V10	P27C100-150V10	27C100-200V10	P27C100-200V10
Description	UVPROM, 128KX8, 150ns, CMOS, CDIP32, WINDOWED, CERDIP-32	UVPROM, 128KX8, 120ns, CMOS, CDIP32, WINDOWED, CERDIP-32	OTP ROM, 128KX8, 150ns, CMOS, PDIP32, PLASTIC, DIP-32	UVPROM, 128KX8, 200ns, CMOS, CDIP32, WINDOWED, CERDIP-32	OTP ROM, 128KX8, 200ns, CMOS, PDIP32, PLASTIC, DIP-32
Parts packaging code	DIP	DIP	DIP	DIP	DIP
package instruction	WDIP,	WDIP,	DIP, DIP32,.6	WDIP,	DIP, DIP32,.6
Contacts	32	32	32	32	32
Reach Compliance Code	unknow	unknow	unknow	unknow	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	150 ns	120 ns	150 ns	200 ns	200 ns
JESD-30 code	R-GDIP-T32	R-GDIP-T32	R-PDIP-T32	R-GDIP-T32	R-PDIP-T32
length	42.165 mm	42.165 mm	41.91 mm	42.165 mm	41.91 mm
memory density	1048576 bi	1048576 bi	1048576 bi	1048576 bi	1048576 bit
Memory IC Type	UVPROM	UVPROM	OTP ROM	UVPROM	OTP ROM
memory width	8	8	8	8	8
Number of functions	1	1	1	1	1
Number of terminals	32	32	32	32	32
word count	131072 words	131072 words	131072 words	131072 words	131072 words
character code	128000	128000	128000	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C
organize	128KX8	128KX8	128KX8	128KX8	128KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY
encapsulated code	WDIP	WDIP	DIP	WDIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE, WINDOW	IN-LINE, WINDOW	IN-LINE	IN-LINE, WINDOW	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.72 mm	5.72 mm	4.83 mm	5.72 mm	4.83 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL
width	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm
Base Number Matches	1	1	1	1	1

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