PK61FX512VMD12 datasheet, PDF - EEWORLD Datasheet

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PK61FX512VMD12: Descriptionarm microcontrollers - mcu kinetis 512 W/dryice (pre-qual sample); Categorysemiconductor Other integrated circuit (IC); File Size1MB，87 Pages; ManufacturerFREESCALE (NXP); Environmental Compliance

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arm microcontrollers - mcu kinetis 512 W/dryice (pre-qual sample)

PK61FX512VMD12 Parametric

Parameter Name	Attribute value
Manufacture	Freescale Semiconduc
Product Category	ARM Microcontrollers - MCU
RoHS	Yes
Core	ARM Cortex M4
Data Bus Width	32 bi
Maximum Clock Frequency	120 MHz
Program Memory Size	512 kB
Data RAM Size	128 kB
On-Chip ADC	Yes
Operating Supply Voltage	1.71 V to 3.6 V
Maximum Operating Temperature	+ 105 C
Package / Case	MAPBGA-144
Mounting Style	SMD/SMT
Minimum Operating Temperature	- 40 C
Packaging	Tray
Processor Series	Kinetis K61
Unit Weigh	441 mg

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Freescale Semiconductor

Data Sheet: Technical Data

Document Number K61P144M120SF3

Rev 5, 10/2013

Supports the following:

MK61FX512VMD12,

MK61FN1M0VMD12

Key features

• Operating Characteristics

– Voltage range: 1.71 to 3.6 V

– Flash write voltage range: 1.71 to 3.6 V

– Temperature range (ambient): -40 to 105°C

• Performance

– Up to 120 MHz ARM Cortex-M4 core with DSP

instructions delivering 1.25 Dhrystone MIPS per

MHz

• Memories and memory interfaces

– Up to 1024 KB program flash memory on non-

FlexMemory devices

– Up to 512 KB program flash memory on

FlexMemory devices

– Up to 512 KB FlexNVM on FlexMemory devices

– 16 KB FlexRAM on FlexMemory devices

– Up to 128 KB RAM

– Serial programming interface (EzPort)

– FlexBus external bus interface

– NAND flash controller interface

• Clocks

– 3 to 32 MHz crystal oscillator

– 32 kHz crystal oscillator

– Multi-purpose clock generator

• System peripherals

– Multiple low-power modes to provide power

optimization based on application requirements

– Memory protection unit with multi-master

protection

– 32-channel DMA controller, supporting up to

128 request sources

– External watchdog monitor

– Software watchdog

– Low-leakage wakeup unit

• Security and integrity modules

– Hardware CRC module to support fast cyclic

redundancy checks

– Tamper detect and secure storage

– Hardware random-number generator

– Hardware encryption supporting DES, 3DES,

AES, MD5, SHA-1, and SHA-256 algorithms

– 128-bit unique identification (ID) number per

chip

• Human-machine interface

– Low-power hardware touch sensor interface

(TSI)

– General-purpose input/output

• Analog modules

– Four 16-bit SAR ADCs

– Programmable gain amplifier (PGA) (up to x64)

integrated into each ADC

– Two 12-bit DACs

– Four analog comparators (CMP) containing a 6-

bit DAC and programmable reference input

– Voltage reference

• Timers

– Programmable delay block

– Two 8-channel motor control/general purpose/

PWM timers

– Two 2-channel quadrature decoder/general

purpose timers

– IEEE 1588 timers

– Periodic interrupt timers

– 16-bit low-power timer

– Carrier modulator transmitter

– Real-time clock

K61 Sub-Family

K61P144M120SF3

Freescale reserves the right to change the detail specifications as may be

required to permit improvements in the design of its products.

Table of Contents

1 Ordering parts...........................................................................5

1.1 Determining valid orderable parts......................................5

2 Part identification......................................................................5

2.1 Description.........................................................................5

2.2 Format...............................................................................5

2.3 Fields.................................................................................5

2.4 Example............................................................................6

3 Terminology and guidelines......................................................6

3.1 Definition: Operating requirement......................................6

3.2 Definition: Operating behavior...........................................6

3.3 Definition: Attribute............................................................7

3.4 Definition: Rating...............................................................7

3.5 Result of exceeding a rating..............................................8

3.6 Relationship between ratings and operating

requirements......................................................................8

3.7 Guidelines for ratings and operating requirements............8

3.8 Definition: Typical value.....................................................9

3.9 Typical value conditions....................................................10

4 Ratings......................................................................................10

4.1 Thermal handling ratings...................................................10

4.2 Moisture handling ratings..................................................11

4.3 ESD handling ratings.........................................................11

4.4 Voltage and current operating ratings...............................11

5 General.....................................................................................12

5.1 AC electrical characteristics..............................................12

5.2 Nonswitching electrical specifications...............................12

5.2.1

5.2.2

5.2.3

5.2.4

5.2.5

5.2.6

5.2.7

5.2.8

Voltage and current operating requirements......12

LVD and POR operating requirements...............13

Voltage and current operating behaviors............14

Power mode transition operating behaviors.......16

Power consumption operating behaviors............17

EMC radiated emissions operating behaviors....21

Designing with radiated emissions in mind.........21

Capacitance attributes........................................22

6.8.8

5.4.2

Thermal attributes...............................................25

5.5 Power sequencing.............................................................25

6 Peripheral operating requirements and behaviors....................26

6.1 Core modules....................................................................26

6.1.1

6.1.2

Debug trace timing specifications.......................26

JTAG electricals..................................................27

6.2 System modules................................................................30

6.3 Clock modules...................................................................30

6.3.1

6.3.2

6.3.3

MCG specifications.............................................30

Oscillator electrical specifications.......................32

32 kHz oscillator electrical characteristics..........34

6.4 Memories and memory interfaces.....................................35

6.4.1

6.4.2

6.4.3

6.4.4

Flash (FTFE) electrical specifications.................35

EzPort switching specifications...........................39

NFC specifications..............................................40

Flexbus switching specifications.........................43

6.5 Security and integrity modules..........................................46

6.5.1

DryIce Tamper Electrical Specifications.............46

6.6 Analog...............................................................................47

6.6.1

6.6.2

6.6.3

6.6.4

ADC electrical specifications..............................47

CMP and 6-bit DAC electrical specifications......54

12-bit DAC electrical characteristics...................56

Voltage reference electrical specifications..........59

6.7 Timers................................................................................60

6.8 Communication interfaces.................................................60

6.8.1

6.8.2

6.8.3

6.8.4

6.8.5

6.8.6

6.8.7

Ethernet switching specifications........................60

USB electrical specifications...............................62

USB DCD electrical specifications......................62

USB VREG electrical specifications...................63

ULPI timing specifications...................................63

CAN switching specifications..............................64

DSPI switching specifications (limited voltage

range).................................................................65

DSPI switching specifications (full voltage

range).................................................................66

6.8.9

6.8.10

6.8.11

6.8.12

Inter-Integrated Circuit Interface (I2C) timing..... 68

UART switching specifications............................69

SDHC specifications...........................................69

I2S/SAI switching specifications.........................70

5.3 Switching specifications.....................................................22

5.3.1

5.3.2

Device clock specifications.................................22

General switching specifications.........................23

5.4 Thermal specifications.......................................................24

5.4.1

Thermal operating requirements.........................24

K61 Sub-Family, Rev5, 10/2013.

Freescale Semiconductor, Inc.

PK61FX512VMD12 Related Products

	PK61FX512VMD12	MK61FN1M0VMD12	MK61FX512VMD12	PK61FN1M0VMD12
Description	arm microcontrollers - mcu kinetis 512 W/dryice (pre-qual sample)	arm microcontrollers - mcu kinetis 1mb ethnet usb	arm microcontrollers - mcu kinetis 512k with dryice	arm microcontrollers - mcu kinetis 144mapbga (pre-qual sample)
Manufacture	Freescale Semiconduc	Freescale Semiconduc	Freescale Semiconduc	Freescale Semiconduc
Product Category	ARM Microcontrollers - MCU	ARM Microcontrollers - MCU	ARM Microcontrollers - MCU	ARM Microcontrollers - MCU
RoHS	Yes	Yes	Yes	Yes
Core	ARM Cortex M4	ARM Cortex M4	ARM Cortex M4	ARM Cortex M4
Data Bus Width	32 bi	32 bi	32 bi	32 bi
Maximum Clock Frequency	120 MHz	120 MHz	120 MHz	120 MHz
Program Memory Size	512 kB	1024 kB	512 kB	1 MB
Data RAM Size	128 kB	128 kB	128 kB	128 kB
On-Chip ADC	Yes	Yes	Yes	Yes
Operating Supply Voltage	1.71 V to 3.6 V	1.71 V to 3.6 V	1.71 V to 3.6 V	1.71 V to 3.6 V
Maximum Operating Temperature	+ 105 C	+ 105 C	+ 105 C	+ 105 C
Package / Case	MAPBGA-144	BGA-144	BGA-144	MAPBGA-144
Mounting Style	SMD/SMT	SMD/SMT	SMD/SMT	SMD/SMT
Minimum Operating Temperature	- 40 C	- 40 C	- 40 C	- 40 C
Packaging	Tray	Tray	Tray	Tray
Unit Weigh	441 mg	441 mg	441 mg	441 mg

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