MAX5042ATN ............................................... -40°C to +125°C
MAX5043ETN ................................................. -40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range ............................ -65°C to +150°C
Lead Temperature (soldering, 10s)
................................. +300°C
Package Thermal Characteristics (Note 1)
TQFN
Junction-to-Ambient Thermal Resistance (θ
JA
) ..........21°C/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Absolute Maximum Ratings Diagram
12V
POSINHS,
POSINPWM
BST
XFRMRH, DRNH
XFRMRL
REG15
80V
80V
80V
40V
12V
6V
4V
REG9, UVLO, RAMP, CSS, FLTINT,
CSOUT, RCFF, RCOSC, DRVIN
REG5, OPTO, PWMSD, SYNC, CSP,
CSN, DRVDEL, SRC, PPWM
DEN
PWMNEG,
PWMPNEG,
HSDRAIN,
HSOK
HSGATE
HSEN
IC SUBSTRATE, NEGIN
80V
95V
80V
80V
12V
4V
www.maximintegrated.com
Maxim Integrated
│
2
MAX5042/MAX5043
Two-Switch Power ICs with Integrated
Power MOSFETs and Hot-Swap Controller
Electrical Characteristics
(V
POSINPWM
= 20V to 76V, V
REG15
= 18V, C
REG15
= 4.7µF, C
REG9
= 1µF, C
REG5
= 1µF, R
RCOSC
= 24kΩ, C
RCOSC
= 100pF, C
BST
= 0.22µF, R
DRVDEL
= 10kΩ, C
DRVDEL
= 0.22µF, V
CSS
= V
CSP
= V
CSN
= V
RAMP
= V
PWMNEG
= V
NEGIN
= 0, T
A
= T
MIN
to T
MAX
,
unless otherwise noted. Typical values are at V
POSINPWM
= 48V, T
A
= +25°C, unless otherwise noted. All voltages are referred to
PWMNEG, unless otherwise noted.)
PARAMETER
Input Supply Range
REG15 REGULATOR
REG15 Output Voltage Range
REG15 Output Voltage Load
Regulation
REG15 Output Current
REG15 Current Limit
REG15 Overdrive Voltage
REG9 REGULATOR
REG9 Output Voltage Range
REG9 Output Voltage Load
Regulation
REG9 Output Current
REG9 Current Limit
REG5 REGULATOR
REG5 Output Voltage Range
REG5 Output Voltage Load
Regulation
REG5 Output Current
REG5 Current Limit
PWM COMPARATOR
Common-Mode Range
Input Offset Voltage
Input Bias Current
Propagation Delay
RCOSC OSCILLATOR
PWM Period
Maximum Duty Cycle
Maximum RCOSC Frequency
RCOSC Peak Trip Level
RCOSC Valley Trip Level
RCOSC Input Bias Current
RCOSC Discharge MOSFET
RDS(ON)
RCOSC Discharge Pulse Width
SYNC High Level
SYNC Low Level
3.5
0.8
Sinking 10mA
f
RCOSC
V
TH
t
OSC-PWM
3.9
47
1.2
2.55
0.2
-0.3
60
50
120
µs
%
MHz
V
V
µA
Ω
ns
V
V
50mV overdrive, 0 ≤ V
CM-PWM
≤ 5.5V
-2.5
70
V
CM-PWM
0
10
+2.5
5.5
V
mV
µA
ns
V
REG15
= 18V to 40V
I
REG5
= 0 to 20mA
Inferred from load regulation test
REG5 shorted to PWMNEG with 10Ω
40
4.5
5.5
0.35
20
V
V
mA
mA
V
REG15
= 18V to 40V
I
REG9
= 0 to 40mA
Inferred from load regulation test
REG9 shorted to PWMNEG with 10Ω
100
8.3
10.1
0.35
40
V
V
mA
mA
V
REG15
V
POSINPWM
= 20V to 76V
V
POSINPWM
= 20V,
I
REG15
= 0 to 80mA
Inferred from load regulation test
REG15 shorted to PWMNEG with 10Ω
18
140
40
13.0
16.6
1.5
80
V
V
mA
mA
V
SYMBOL
V
POSINPWM
CONDITIONS
MIN
20
TYP
MAX
76
UNITS
V
www.maximintegrated.com
Maxim Integrated
│
3
MAX5042/MAX5043
Two-Switch Power ICs with Integrated
Power MOSFETs and Hot-Swap Controller
Electrical Characteristics (continued)
(V
POSINPWM
= 20V to 76V, V
REG15
= 18V, C
REG15
= 4.7µF, C
REG9
= 1µF, C
REG5
= 1µF, R
RCOSC
= 24kΩ, C
RCOSC
= 100pF, C
BST
= 0.22µF, R
DRVDEL
= 10kΩ, C
DRVDEL
= 0.22µF, V
CSS
= V
CSP
= V
CSN
= V
RAMP
= V
PWMNEG
= V
NEGIN
= 0, T
A
= T
MIN
to T
MAX
,
unless otherwise noted. Typical values are at V
POSINPWM
= 48V, T
A
= +25°C, unless otherwise noted. All voltages are referred to
PWMNEG, unless otherwise noted.)
PARAMETER
SYNC Leakage Current
SYNC Maximum Frequency
SYNC On-Time
SYNC Off-Time
PWM LOGIC
PWM Comparator Propagation
Delay
PPWM to XFRMRL Delay
DRVDEL Reference Voltage
PPWM Output High
PPWM Output Low
PWMSD
Logic High
PWMSD
Logic Low
PWMSD
Leakage Current
SOFT-START
Soft-Start Current
Minimum OPTO Voltage
RAMP GENERATOR
Minimum RCFF Voltage
RCFF Leakage
OVERLOAD FAULT
FLTINT Pulse Current
FLTINT Trip Point
FLTINT Hysteresis
INTERNAL POWER FETs
On-Resistance
Off-State Leakage Current
Total Gate Charge Per FET
HIGH-SIDE DRIVER
Low-to-High Latency
High-to-Low Latency
Output Drive Voltage
LOW-SIDE DRIVER
Low-to-High Latency
Driver delay until FET V
GS
reaches
0.9 x V
DRVIN
80
ns
Driver delay until FET V
GS
reaches 0.9 x
(V
BST
- V
XFRMRH
)
Driver delay until FET V
GS
reaches 0.1 x
(V
BST
- V
XFRMRH
)
BST to XFRMRH with high side on
80
45
8
ns
ns
V
Inferred from supply current with
V
DS
= 50V
45
R
DSON
V
DRVIN
= V
BST
= 9V,
V
XFRMRH
= V
SRC
= 0, I
DS
= 190mA
75
200
10
mΩ
µA
nC
I
FLTINT
2.0
80
2.7
0.75
3.5
µA
V
V
RCFF sinking 2mA
2.1
±0.1
±1
V
µA
I
CSS
CSS = 0, sinking 2mA
33
1.4
Sourcing 2mA
Sinking 2mA
3.5
0.8
±1
PPWM rising
1.14
2.8
0.4
70
120
1.38
ns
ns
V
V
V
V
V
µA
µA
V
f
SYNC
50
200
2.4
SYMBOL
CONDITIONS
MIN
TYP
MAX
±1
UNITS
µA
MHz
ns
ns
www.maximintegrated.com
Maxim Integrated
│
4
MAX5042/MAX5043
Two-Switch Power ICs with Integrated
Power MOSFETs and Hot-Swap Controller
Electrical Characteristics (continued)
(V
POSINPWM
= 20V to 76V, V
REG15
= 18V, C
REG15
= 4.7µF, C
REG9
= 1µF, C
REG5
= 1µF, R
RCOSC
= 24kΩ, C
RCOSC
= 100pF, C
BST
= 0.22µF, R
DRVDEL
= 10kΩ, C
DRVDEL
= 0.22µF, V
CSS
= V
CSP
= V
CSN
= V
RAMP
= V
PWMNEG
= V
NEGIN
= 0, T
A
= T
MIN
to T
MAX
,
unless otherwise noted. Typical values are at V
POSINPWM
= 48V, T
A
= +25°C, unless otherwise noted. All voltages are referred to
The STM32F103XX clock has been configured in the startup file, but I have seen some netizens repeatedly configure the clock when applying it. Will this cause any problems?...
[align=left][color=#000000]Many of today's [font=Calibri]PCB[/font] tools and [font=Calibri]FPGA[/font] development software have attached interfaces that can be converted to each other. The pins in t...
ZTE,
caught
in the vortex of
the US ban on the sale
of chips
, has sounded the alarm for China's information technology industry and revealed China's "chip disease". Let's follow the ...[Details]
On April 24, Sungrow released its annual financial report. The report shows that in 2017, Sungrow's global shipments reached 16.5GW, of which domestic shipments reached 13.2GW, a year-on-year incre...[Details]
For STM32, there are two ways to reset the software: 1) Use the official software library The system reset function is directly provided in the stm32f10x_nvic.c file of the official software li...[Details]
1.MAX31865 (1 Introduction The MAX31865 is an easy-to-use thermistor-to-digital converter optimized for platinum resistance temperature detectors (RTDs). External resistors set the RTD sensitivity, a...[Details]
On the eve of Qingming Festival, the trade friction between China and the United States is on the rise. Let's follow the automotive electronics editor to learn more about the relevant content. Ba...[Details]
On April 16, the U.S. Department of Commerce announced that it would ban U.S. companies from selling parts, goods, software, and technology to
ZTE
for seven years, until March 13, 2025.
Th...[Details]
Since the first draft of the 5G
NR standard was officially launched at
the end of 2017
, the
5G
commercialization process has taken a substantial step forward. From that moment on, mo...[Details]
The parking assistance system is an important application of the active anti-collision system of automobiles in low-speed and complex urban environments, and is also a specific embodiment of the inte...[Details]
The Wassenaar Arrangement, everything started during the Cold War. Let's learn more about it with the embedded editor.
background
After the end of World War II, the United States ...[Details]
This program mainly uses the comparison output function of the timer to generate PWM waves to control the LED. The comparison output of timer A corresponds to P2.3 P2.4. Therefore, a matching working...[Details]
Recently, Zhejiang Lipu Crushing Equipment Co., Ltd. invested 50 million yuan to build a new "annual production of 1,200 high-efficiency and energy-saving ultra-fine pulverizer construction project...[Details]
1. Brief description A summary of "How to build uClinux kernel transplantation on ARMSYS development board with S3C44B0X as core", including the analysis of Bootloader function and the key co...[Details]
According to MEMS Consulting, single-chip radar system-on-chip (SoC) is becoming one of the most popular new sensors . Its widespread adoption in automobiles has greatly increased sales, thereby pr...[Details]