|
ICL7667CPA+ |
ICL7667EBA+T |
ICL7667CBA+T |
| Description |
gate drivers dual power inverting mosfet driver |
gate drivers dual power inverting mosfet driver |
gate drivers dual power inverting mosfet driver |
| Is it lead-free? |
Lead free |
Lead free |
Lead free |
| Is it Rohs certified? |
conform to |
conform to |
conform to |
| Parts packaging code |
DIP |
SOIC |
SOIC |
| package instruction |
DIP, DIP8,.3 |
SOP, |
SOP, SOP8,.25 |
| Contacts |
8 |
8 |
8 |
| Reach Compliance Code |
compli |
compli |
compli |
| ECCN code |
EAR99 |
EAR99 |
EAR99 |
| Factory Lead Time |
6 weeks |
6 weeks |
4 weeks |
| high side driver |
YES |
YES |
YES |
| Interface integrated circuit type |
BUFFER OR INVERTER BASED MOSFET DRIVER |
BUFFER OR INVERTER BASED MOSFET DRIVER |
BUFFER OR INVERTER BASED MOSFET DRIVER |
| JESD-30 code |
R-PDIP-T8 |
R-PDSO-G8 |
R-PDSO-G8 |
| JESD-609 code |
e3 |
e3 |
e3 |
| length |
9.375 mm |
4.9 mm |
4.9 mm |
| Humidity sensitivity level |
1 |
1 |
1 |
| Number of functions |
2 |
2 |
2 |
| Number of terminals |
8 |
8 |
8 |
| Maximum operating temperature |
70 °C |
85 °C |
70 °C |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
DIP |
SOP |
SOP |
| Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
IN-LINE |
SMALL OUTLINE |
SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum seat height |
4.572 mm |
1.75 mm |
1.75 mm |
| Maximum supply voltage |
17 V |
17 V |
17 V |
| Minimum supply voltage |
4.5 V |
4.5 V |
4.5 V |
| Nominal supply voltage |
15 V |
15 V |
15 V |
| surface mount |
NO |
YES |
YES |
| Temperature level |
COMMERCIAL |
INDUSTRIAL |
COMMERCIAL |
| Terminal surface |
Matte Tin (Sn) |
MATTE TIN |
Matte Tin (Sn) |
| Terminal form |
THROUGH-HOLE |
GULL WING |
GULL WING |
| Terminal pitch |
2.54 mm |
1.27 mm |
1.27 mm |
| Terminal location |
DUAL |
DUAL |
DUAL |
| Maximum time at peak reflow temperature |
30 |
NOT SPECIFIED |
30 |
| Disconnect time |
0.06 µs |
0.06 µs |
0.06 µs |
| connection time |
0.04 µs |
0.04 µs |
0.04 µs |
| width |
7.62 mm |
3.9 mm |
3.9 mm |
| Encapsulate equivalent code |
DIP8,.3 |
- |
SOP8,.25 |
| power supply |
4.5/15 V |
- |
4.5/15 V |
| technology |
CMOS |
- |
CMOS |
| Maker |
- |
Maxim |
Maxim |