ATC, the industry leader, offers new improved ESR/ESL performance
for the 200 B Series Capacitors. This Series exhibits high volumetric
efficiency with superior IR characteristics. Ceramic construction
provides a rugged, hermetic package.
ATC offers an encapsulation option for applications requiring extended
protection against arc-over and corona.
Typical functional applications: Bypass, Coupling and DC Blocking.
Typical circuit applications: Switching Power Supplies and High Power
Broadband Coupling.
*For leaded styles only.
ELECTRICAL AND MECHANICAL
SPECIFICATIONS
DISSIPATION FACTOR (DF):
2.5% max. @ 1 KHz
TEMPERATURE COEFFICIENT OF CAPACITANCE (TCC):
±15% maximum (-55°C to +125°C)
INSULATION RESISTANCE (IR):
5000 pF to 0.1 MFd:
10
4
Megohms min. @ +25°C at rated WVDC.
10
3
Megohms min. @ +125°C at rated WVDC.
WORKING VOLTAGE (WVDC):
See Capacitance Values Table, page 2.
ENVIRONMENTAL TESTS
ATC 200 B Series Capacitors are designed and manufactured to
meet and exceed the requirements of EIA-198, MIL-PRF-55681 and
MIL-PRF-123.
DIELECTRIC WITHSTANDING VOLTAGE (DWV):
Case B: 250% of rated WVDC for 5 secs. (125 VDC)
AGING EFFECTS:
3% maximum per decade hour.
PIEZOELECTRIC EFFECTS:
Negligible
DIELECTRIC ABSORPTION:
2% typical
OPERATING TEMPERATURE RANGE:
From -55°C to +125°C (No derating of working voltage).
THERMAL SHOCK:
MIL-STD-202, Method 107, Condition A.
MOISTURE RESISTANCE:
MIL-STD-202, Method 106.
LOW VOLTAGE HUMIDITY:
MIL-STD-202, Method 103, Condition A, with 1.5 Volts DC applied
while subjected to an environment of 85°C with 85% relative
humidity for 240 hours min.
TERMINATION STYLES:
Available in various surface mount and leaded styles.
See Mechanical Configurations, page 3.
TERMINAL STRENGTH:
Terminations for chips and pellets
withstand a pull of 5 lbs. min., 15 lbs. typical, for 5 seconds in direc-
tion perpendicular to the termination surface of the capacitor. Test
per MIL-STD-202, method 211.
LIFE TEST:
MIL-STD-202, Method 108, for 2000 hours, at 125°C.
200% WVDC applied.
ATC # 001-812 Rev. J 1/07
ATC 200 B Capacitance Values
CAP.
CODE
502
562
682
822
103
123
153
183
203
223
CAP.
(pF)
5000
5600
6800
8200
10,000
12,000
15,000
18,000
20,000
22,000
TOL.
RATED WVDC
CAP.
CODE
273
333
393
473
503
563
683
823
104
CAP.
(pF)
27,000
33,000
39,000
47,000
50,000
56,000
68,000
82,000
100,000
TOL.
RATED WVDC
K, M, N
50
K, M, N
50
VRMS = 0.707 x WVDC
• SPECIAL VALUES, TOLERANCES, HIGHER WVDC AND MATCHING AVAILABLE. • ENCAPSULATION OPTION AVAILABLE.
PLEASE CONSULT FACTORY.
CAPACITANCE TOLERANCE
Code
Tol.
K
±10%
M
±20%
N
±30%
ATC PART NUMBER CODE
ATC200 B
Series
Case Size
Capacitance Code:
First 2 significant digits for capacitance.
Indicates number of zeros following digits
of capacitance in picofarads except for decimal values.
Capacitance Tolerance
Laser Marking
Termination Code
WVDC
The above part number refers to a 200 B Series (case size B) 8200 pF capacitor,
M tolerance (±20%), 50 WVDC, with W termination (Tin /Lead, Solder Plated over Nickel Barrier), laser marking and ATC Cap-Pac
®
packaging.
82 2
M W 50 X
C
Packaging
T - Tape and Reel, 1000 pc. qty.*
TV - Vertical Orientation of Product,
Tape and Reel, 1000 pc. qty.*
C - ATC Cap-Pac
®
, 100 pc. qty. std.*
I - Special Packaging. Consult Factory.
*
Consult ATC for other quantities
ATC accepts orders for our parts using designations
with
or
without
the
“ATC” prefix. Both methods of defining the part number are equivalent, i.e.,
part numbers referenced with the “ATC” prefix are interchangeable to parts
referenced without the “ATC” prefix. Customers are free to use either in
specifying or procuring parts from American Technical Ceramics.
For additional information and catalogs contact your ATC
representative or call direct at (+1-631) 622-4700.
Consult factory for additional performance data.
A M E R I C A N
2
ATC North America
+1-631-622-4700 • sales@atceramics.com
T E C H N I C A L
ATC Europe
+46 8 6800410 • sales@atceramics-europe.com
C E R A M I C S
ATC Asia
+86-755-2396-8759 • sales@atceramics-asia.com
w
w
w
.
a
t
c
e
r
a
m
i
c
s
.
c
o
m
ATC 200 B Capacitors: Mechanical Configurations
ATC
SERIES
& CASE
SIZE
ATC
TERM.
CODE
OUTLINES
CASE SIZE
& TYPE
W/T IS A
TERMINATION SURFACE
LENGTH
(L)
.110
+.020 -.010
(2.79
+0.51 -0.25)
.110
+.035 -.010
(2.79
+0.89 -0.25)
.110
+.020 -.010
(2.79
+0.51 -0.25)
.110
+.020 -.010
(2.79
+0.51 -0.25)
TL
BODY DIMENSIONS
INCHES (mm)
WIDTH
(W)
THICKNESS
(T)
LEAD AND TERMINATION
DIMENSIONS AND MATERIALS
OVERLAP
(Y)
MATERIALS
Y
200B
W
B
Solder Plate
Y
W
L
T
.110 ±.015
(2.79 ±0.38)
Tin /Lead, Solder Plated over
Nickel Barrier Termination
200B
P
B
Pellet
Y
L
W
T
.110 ±.015
(2.79 ±0.38)
.102 (2.59)
max.
.110 ±.015
(2.79 ±0.38)
.015 (0.38)
±.010 (0.25)
Heavy Tin/Lead Coated,
over Nickel Barrier Termination
200B
T
B
RoHS Compliant
Tin Plated over
Nickel Barrier Termination
Solderable
Nickel Barrier
Y
W
L
T
200B
CA
B
Gold Chip
W
L
T
.110 ±.015
(2.79 ±0.38)
RoHS Compliant
Gold Plated over
Nickel Barrier Termination
Length
( LL )
Width
( WL )
Thickness
( TL )
200B
MS
B
WL
LL
W
L
T
.120 (3.05)
max.
Microstrip
B
WL
TL
LL
200B
AR
W
L
T
.135 ±.015
(3.43 ±0.38)
Axial Ribbon
LL
.250 (6.35)
min.
.093 ±.005 .004 ±.001
(.102
(2.36
±0.13)
±.025)
200B
RR
B
Radial Ribbon
W
L
T
WL
.110 ±.015
(2.79 ±0.38)
.100 (2.54)
max.
N/A
LL
200B
RW
B
Radial Wire
T
L
W
.145 ±.020
(3.68 ±0.51)
LL
.500 (12.7)
min.
#26 AWG.,
.016 (.406) dia.
nominal
200B
AW
B
Axial Wire
W
L
•
T
Additional lead styles available: Narrow Microstrip (NM), Narrow Axial Ribbon (NA) and Vertical Narrow Microstrip (H). Other lead lengths are available; consult factory.
All leads are high purity silver attached with high temperature solder and are
RoHS
compliant. For a complete military catalog, request American Technical Ceramics
document ATC 001-818.
A M E R I C A N
3
ATC North America
+1-631-622-4700 • sales@atceramics.com
T E C H N I C A L
ATC Europe
+46 8 6800410 • sales@atceramics-europe.com
C E R A M I C S
ATC Asia
+86-755-2396-8759 • sales@atceramics-asia.com
w
w
w
.
a
t
c
e
r
a
m
i
c
s
.
c
o
m
ATC 200 B Capacitors: Non-Magnetic Mechanical Configurations
ATC
SERIES
& CASE
SIZE
ATC
TERM.
CODE
OUTLINES
CASE SIZE
& TYPE
W/T IS A
TERMINATION SURFACE
Y
BODY DIMENSIONS
INCHES (mm)
LENGTH
(L)
.110
+.025 -.010
(2.79
+0.64 -0.25)
.110
+.035 -.010
(2.79
+0.89 -0.25)
.110
+.025 -.010
(2.79
+0.64 -0.25)
TL
LEAD AND TERMINATION
DIMENSIONS AND MATERIALS
OVERLAP
(Y)
MATERIALS
WIDTH
(W)
THICKNESS
(T)
200B
WN
B
Non-Mag
Solder Plate
Y
W
L
T
.110 ±.015
(2.79 ±0.38)
Tin/Lead, Solder Plated over
Non-Magnetic Barrier Termination
200B
PN
B
Non-Mag
Pellet
B
Non-Mag
Y
W
L
T
.110 ±.015
(2.79 ±0.38)
.102 (2.59)
max.
Heavy Tin/Lead Coated, over
.015 (0.38)
±.010 (0.25)
Non-Magnetic Barrier Termination
200B
TN
Solderable
Barrier
B
W
L
T
.110 ±.015
(2.79 ±0.38)
RoHS Compliant
Tin Plated over
Non-Magnetic Barrier Termination
Length
( LL )
Width
( WL )
Thickness
( TL )
LL
200B
MN
Non-Mag
Microstrip
B
WL
W
L
T
.120 (3.05)
max.
TL
LL
200B
AN
Non-Mag
Axial Ribbon
WL
W
L
T
.135 ±.015
(3.43 ±0.38)
.250 (6.35)
min.
.110 ±.015
(2.79 ±0.38)
.100 (2.54)
max.
.093 ±.005 .004 ±.001
(2.36
(.102
±0.13)
±.025)
LL
200B
FN
B
Non-Mag
Radial Ribbon
W
L
T
WL
N/A
LL
200B
RN
B
Non-Mag
Radial Wire
L
T
W
.145 ±.020
(3.68 ±0.51)
LL
.500 (12.7)
min.
#26 AWG.,
.016 (.406) dia.
nominal
200B
BN
B
Non-Mag
Axial Wire
L
W
•
T
Additional lead styles available: Narrow Microstrip (DN), Narrow Axial Ribbon (GN) and Vertical Narrow Microstrip (HN). Other lead lengths are available; consult factory.
All leads are high purity silver attached with high temperature solder and are
The nRF905 development document states: 1. The voltage range of the VCC pin is between 3.3V and 3.6V. It cannot be outside this range. Exceeding 3.6V will burn the module. 2. When connecting to the P0...
Hello, everyone. I am porting the CSMA/CA algorithm program in the TI-Mac protocol stack recently. The T2 timer and the random number module have been adjusted, and the CSP code is also copied from th...
Packaging is critical to LED reliability
Packaging technology is closely related to LED reliability
LED street lights already have energy-saving advantages, but reliability needs to be further im...
At present, I have two network cards on my board. Both drivers are successfully configured and TCP/IP protocol is loaded, but they are independent. How to make them communicate with each other to real...
[i=s]This post was last edited by yangjiaxu on 2018-12-24 00:26[/i] This morning I wanted to transplant the serial communication to the capacitive touch button, but failed. I would like to ask for hel...
This program is written to simulate the serial port hardware mechanism. When used, a timed interrupt can be set with a time interval of 1/4 baud rate. The receiving function is called once for ea...[Details]
Introduction
Power subsystems are becoming more and more integrated into the overall system. Power systems have moved from being separate "essential dangerous devices" to being monitorable...[Details]
DSP (digital signal processor) is used more and more frequently in today's engineering applications. There are three main reasons for this: first, it has powerful computing power and is capable of ...[Details]
introduction
The emergence of high-performance, low-power embedded CPUs and high-reliability network operating systems has made it possible to implement applications with large amounts of comp...[Details]
1 Introduction
Water resources are the basic conditions for human survival and the lifeline of economic development. The reality shows that due to the global shortage of water resources and th...[Details]
1. Disadvantages of choosing too high a voltage level
Choosing too high a voltage level will result in too high an investment and a long payback period. As the voltage level increases, the...[Details]
The rectified DC voltage is then converted back to AC using power electronics such as insulated gate bipolar transistors.
The output voltage is switched on and off at a high frequency, control...[Details]
This article discusses the six design steps of LED lighting system design in detail: (1) determine the lighting requirements; (2) determine the design goals and estimate the optics; (3) the efficie...[Details]
The production process of lithium batteries does not mention the previous processes such as material preparation, winding, liquid injection, and packaging, but only talks about the final formation ...[Details]
Applying fieldbus technology on new beer production lines is the first choice for large beer companies with strong management level and technical strength. Guangzhou Zhujiang Beer Group Co., Ltd. i...[Details]
1. Brief Introduction
With the continuous development and improvement of single-chip microcomputer technology, single-chip microcomputers have been widely used in all walks of life, and ...[Details]
The platemaking machine is an indispensable device in platemaking and printing, and plays a very important role. The platemaking machine is a device used to make printing plates. The principle is c...[Details]
1 Introduction
The early stage control system used relay control. Due to the large number of stage equipment, the number of control elements is huge and the wiring is complicated. Therefore, th...[Details]
This paper first proposed an elevator controller algorithm based on a finite state machine, and then designed a three-story elevator controller based on the algorithm. The correctness of the elevat...[Details]
Conventional crystalline silicon solar cells are made on high-quality silicon wafers with a thickness of 350-450μm, which are sawn from pulled or cast silicon ingots. Therefore, more silicon materi...[Details]