EEWORLDEEWORLDEEWORLD

Part Number

Search

MCP2221T-I/SL

Description
usb interface IC usb to i2c bridge device
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,82 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Environmental Compliance
Download Datasheet Parametric Compare View All

MCP2221T-I/SL Overview

usb interface IC usb to i2c bridge device

MCP2221T-I/SL Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicrochip
package instructionSOIC-14
Reach Compliance Codecompliant
ECCN codeEAR99
Factory Lead Time8 weeks
JESD-30 codeR-PDSO-G14
JESD-609 codee3
length8.65 mm
Humidity sensitivity level1
Number of terminals14
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
Maximum seat height1.75 mm
Maximum supply voltage5.5 V
Minimum supply voltage3 V
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMatte Tin (Sn) - annealed
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
width3.9 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR CIRCUIT
MCP2221
USB 2.0 to I
2
C/UART Protocol Converter with GPIO
Features
Universal Serial Bus (USB)
• Supports Full-Speed USB (12 Mb/s)
• Implements USB Protocol Composite Device:
- Communication Device Class (CDC) for
USB-to-UART Conversion
- Human Interface Device (HID) for I
2
C Device
Control and Configuration
• 128-Byte Buffer to Handle Data Throughput at
Any Supported UART Baud Rate:
- 64-Byte Transmit
- 64-Byte Receive
• Human Interface Device (HID) for Both
I
2
C Communication and Control:
64-Byte Buffer to Handle Data Throughput at
Any I
2
C Baud Rate
• Fully-Configurable VID and PID Assignments and
String Descriptors
• Bus-Powered or Self-Powered
• USB 2.0-Compliant: TID# 40001594
I
2
C/SMBus
• The Device Runs as an I
2
C Master. The Data to
Write/Read on the I
2
C Bus is Conveyed by the
USB Interface
• I
2
C Master
- Up to 400 kHz Clock Rate
- Supports 7-Bit or 10-Bit Addressable
Devices; 10-Bit Addressable Devices are
Supported through the PC Host Library
- Supports Block Reads/Writes of up to 65,535
Bytes
• SMBus Master
- Supports All of the SMBus Transfers
- SMBus Functionality Is Achieved through a
Combination of Chip and Support Library
Processing
- Up to 400 kHz Clock Rate
General-Purpose Input/Output (GPIO) Pins
• Four General-Purpose Input/Output Pins
• All GP Pins Can Be Assigned to Other
Functionalities
USB Driver and Software Support
• Enumerates as a Composite USB Device (CDC
and HID) Using Standard Drivers for Virtual Com
Port (VCP) on the Following Windows
®
Operating
Systems: XP
®
(SP3), Vista
®
, 7, 8 and 8.1
• Configuration Utility for Establishing a Custom
Boot-Up Configuration
• I
2
C/SMBus Terminal
• Windows DLL
Other Functionalities
• UART Activity LED Outputs (UT
X
and UR
X
)
• SSPND Output Pin
• USBCFG Output Pin (Indicates When the
Enumeration Has Completed)
• Three ADC Inputs
• One DAC with Two Possible Output Options
• Clock Reference Output: 12 MHz or Other
Configurable Values
• External Interrupt Edge Detection
CDC and Universal Asynchronous
Receiver/Transmitter (UART) Options
• Communications Device Class (CDC) for the
USB-to-UART Option
• Responds to
SET LINE CODING
Commands to
Dynamically Change Baud Rates
• Supports Baud Rates: 300-115200
• UART T
X
and R
X
Pins Only
• Serial Number Used During the CDC
Enumeration Can Be Enabled by Using the
Microchip-Provided Configuration Utility or by
Calling the Proper API from the Support Libraries
for this Device
Other
• Operating Voltage: 3.0 to 5.5V
• Electrostatic Discharge (ESD) Protection: > 4 kV
Human Body Model (HBM)
• Industrial (I) Operating Temperature: –40°C to
+85°C
• Automotive AEC-Q100 Qualified
2014-2017 Microchip Technology Inc.
DS20005292C-page 1

MCP2221T-I/SL Related Products

MCP2221T-I/SL MCP2221T-I/ST MCP2221-I/ST MCP2221-I/P MCP2221-I/ML ADM00559
Description usb interface IC usb to i2c bridge device usb interface IC usb to i2c bridge device usb interface IC usb to i2c bridge device usb interface IC usb to i2c bridge device usb interface IC usb to i2c bridge device board eval for mcp2221
Is it Rohs certified? conform to conform to conform to conform to conform to -
Maker Microchip Microchip Microchip Microchip Microchip -
package instruction SOIC-14 SSOP-14 SSOP-14 DIP-14 QFN-16 -
Reach Compliance Code compliant compli compli compli compli -
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 -
Factory Lead Time 8 weeks 8 weeks 11 weeks 9 weeks 8 weeks -
JESD-30 code R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 R-PDIP-T14 S-PQCC-N16 -
JESD-609 code e3 e3 e3 e3 e3 -
length 8.65 mm 5 mm 5 mm 19.05 mm 4 mm -
Humidity sensitivity level 1 1 1 - 1 -
Number of terminals 14 14 14 14 16 -
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C -
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code SOP TSSOP TSSOP DIP HVQCCN -
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE -
Package form SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE -
Peak Reflow Temperature (Celsius) 260 260 260 NOT APPLICABLE 260 -
Maximum seat height 1.75 mm 1.2 mm 1.2 mm 5.334 mm 1 mm -
Maximum supply voltage 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V -
Minimum supply voltage 3 V 3 V 3 V 3 V 3 V -
Nominal supply voltage 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V -
surface mount YES YES YES NO YES -
technology CMOS CMOS CMOS CMOS CMOS -
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL -
Terminal surface Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed -
Terminal form GULL WING GULL WING GULL WING THROUGH-HOLE NO LEAD -
Terminal pitch 1.27 mm 0.65 mm 0.65 mm 2.54 mm 0.4 mm -
Terminal location DUAL DUAL DUAL DUAL QUAD -
Maximum time at peak reflow temperature 40 40 40 NOT APPLICABLE 40 -
width 3.9 mm 4.4 mm 4.4 mm 7.62 mm 4 mm -
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT -
Encapsulate equivalent code - TSSOP14,.25 TSSOP14,.25 DIP14,.3 LCC16,.16SQ,25 -
power supply - 3.3/5 V 3.3/5 V 3.3/5 V 3.3/5 V -
Certification status - Not Qualified Not Qualified Not Qualified Not Qualified -
Maximum slew rate - 15 mA 15 mA 15 mA 15 mA -

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 147  2470  2893  2782  1225  3  50  59  57  25 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号