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ADM00559

Description
board eval for mcp2221
CategoryDevelopment board/suite/development tools   
File Size1MB,82 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Environmental Compliance  
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ADM00559 Overview

board eval for mcp2221

MCP2221
USB 2.0 to I
2
C/UART Protocol Converter with GPIO
Features
Universal Serial Bus (USB)
• Supports Full-Speed USB (12 Mb/s)
• Implements USB Protocol Composite Device:
- Communication Device Class (CDC) for
USB-to-UART Conversion
- Human Interface Device (HID) for I
2
C Device
Control and Configuration
• 128-Byte Buffer to Handle Data Throughput at
Any Supported UART Baud Rate:
- 64-Byte Transmit
- 64-Byte Receive
• Human Interface Device (HID) for Both
I
2
C Communication and Control:
64-Byte Buffer to Handle Data Throughput at
Any I
2
C Baud Rate
• Fully-Configurable VID and PID Assignments and
String Descriptors
• Bus-Powered or Self-Powered
• USB 2.0-Compliant: TID# 40001594
I
2
C/SMBus
• The Device Runs as an I
2
C Master. The Data to
Write/Read on the I
2
C Bus is Conveyed by the
USB Interface
• I
2
C Master
- Up to 400 kHz Clock Rate
- Supports 7-Bit or 10-Bit Addressable
Devices; 10-Bit Addressable Devices are
Supported through the PC Host Library
- Supports Block Reads/Writes of up to 65,535
Bytes
• SMBus Master
- Supports All of the SMBus Transfers
- SMBus Functionality Is Achieved through a
Combination of Chip and Support Library
Processing
- Up to 400 kHz Clock Rate
General-Purpose Input/Output (GPIO) Pins
• Four General-Purpose Input/Output Pins
• All GP Pins Can Be Assigned to Other
Functionalities
USB Driver and Software Support
• Enumerates as a Composite USB Device (CDC
and HID) Using Standard Drivers for Virtual Com
Port (VCP) on the Following Windows
®
Operating
Systems: XP
®
(SP3), Vista
®
, 7, 8 and 8.1
• Configuration Utility for Establishing a Custom
Boot-Up Configuration
• I
2
C/SMBus Terminal
• Windows DLL
Other Functionalities
• UART Activity LED Outputs (UT
X
and UR
X
)
• SSPND Output Pin
• USBCFG Output Pin (Indicates When the
Enumeration Has Completed)
• Three ADC Inputs
• One DAC with Two Possible Output Options
• Clock Reference Output: 12 MHz or Other
Configurable Values
• External Interrupt Edge Detection
CDC and Universal Asynchronous
Receiver/Transmitter (UART) Options
• Communications Device Class (CDC) for the
USB-to-UART Option
• Responds to
SET LINE CODING
Commands to
Dynamically Change Baud Rates
• Supports Baud Rates: 300-115200
• UART T
X
and R
X
Pins Only
• Serial Number Used During the CDC
Enumeration Can Be Enabled by Using the
Microchip-Provided Configuration Utility or by
Calling the Proper API from the Support Libraries
for this Device
Other
• Operating Voltage: 3.0 to 5.5V
• Electrostatic Discharge (ESD) Protection: > 4 kV
Human Body Model (HBM)
• Industrial (I) Operating Temperature: –40°C to
+85°C
• Automotive AEC-Q100 Qualified
2014-2017 Microchip Technology Inc.
DS20005292C-page 1

ADM00559 Related Products

ADM00559 MCP2221T-I/SL MCP2221T-I/ST MCP2221-I/ST MCP2221-I/P MCP2221-I/ML
Description board eval for mcp2221 usb interface IC usb to i2c bridge device usb interface IC usb to i2c bridge device usb interface IC usb to i2c bridge device usb interface IC usb to i2c bridge device usb interface IC usb to i2c bridge device
Is it Rohs certified? - conform to conform to conform to conform to conform to
Maker - Microchip Microchip Microchip Microchip Microchip
package instruction - SOIC-14 SSOP-14 SSOP-14 DIP-14 QFN-16
Reach Compliance Code - compliant compli compli compli compli
ECCN code - EAR99 EAR99 EAR99 EAR99 EAR99
Factory Lead Time - 8 weeks 8 weeks 11 weeks 9 weeks 8 weeks
JESD-30 code - R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 R-PDIP-T14 S-PQCC-N16
JESD-609 code - e3 e3 e3 e3 e3
length - 8.65 mm 5 mm 5 mm 19.05 mm 4 mm
Humidity sensitivity level - 1 1 1 - 1
Number of terminals - 14 14 14 14 16
Maximum operating temperature - 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature - -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - SOP TSSOP TSSOP DIP HVQCCN
Package shape - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE
Package form - SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius) - 260 260 260 NOT APPLICABLE 260
Maximum seat height - 1.75 mm 1.2 mm 1.2 mm 5.334 mm 1 mm
Maximum supply voltage - 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage - 3 V 3 V 3 V 3 V 3 V
Nominal supply voltage - 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount - YES YES YES NO YES
technology - CMOS CMOS CMOS CMOS CMOS
Temperature level - INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface - Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed
Terminal form - GULL WING GULL WING GULL WING THROUGH-HOLE NO LEAD
Terminal pitch - 1.27 mm 0.65 mm 0.65 mm 2.54 mm 0.4 mm
Terminal location - DUAL DUAL DUAL DUAL QUAD
Maximum time at peak reflow temperature - 40 40 40 NOT APPLICABLE 40
width - 3.9 mm 4.4 mm 4.4 mm 7.62 mm 4 mm
uPs/uCs/peripheral integrated circuit type - MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT MICROPROCESSOR CIRCUIT
Encapsulate equivalent code - - TSSOP14,.25 TSSOP14,.25 DIP14,.3 LCC16,.16SQ,25
power supply - - 3.3/5 V 3.3/5 V 3.3/5 V 3.3/5 V
Certification status - - Not Qualified Not Qualified Not Qualified Not Qualified
Maximum slew rate - - 15 mA 15 mA 15 mA 15 mA

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