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MCP2562-E/MF

Description
can interface IC
CategoryWireless rf/communication    Telecom circuit   
File Size782KB,30 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Environmental Compliance
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MCP2562-E/MF Overview

can interface IC

MCP2562-E/MF Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicrochip
package instructionHVSON,
Reach Compliance Codecompli
Factory Lead Time13 weeks
Samacsys DescriptiMicrochip MCP2562-E/MF, CAN Transceiver 1Mbit/s 1-Channel ISO 11898-2, ISO 11898-5, 8-Pin DFN
JESD-30 codeS-PDSO-N8
JESD-609 codee3
length3 mm
Humidity sensitivity level1
Number of functions1
Number of terminals8
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeHVSON
Package shapeSQUARE
Package formSMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)260
Maximum seat height1 mm
Nominal supply voltage5 V
surface mountYES
Telecom integrated circuit typesSUPPORT CIRCUIT
Temperature levelAUTOMOTIVE
Terminal surfaceMatte Tin (Sn) - annealed
Terminal formNO LEAD
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
width3 mm
Base Number Matches1
MCP2561/2
High-Speed CAN Transceiver
Features:
• Supports 1 Mb/s Operation
• Implements ISO-11898-2 and ISO-11898-5
Standard Physical Layer Requirements
• Very Low Standby Current (5 µA, typical)
• V
IO
Supply Pin to Interface Directly to
CAN Controllers and Microcontrollers with
1.8V to 5.5V I/O
• SPLIT Output Pin to Stabilize Common Mode in
Biased Split Termination Schemes
• CAN Bus Pins are Disconnected when Device is
Unpowered:
- An Unpowered Node or Brown-Out Event will
Not Load the CAN Bus
• Detection of Ground Fault:
- Permanent Dominant Detection on T
XD
- Permanent Dominant Detection on Bus
• Power-on Reset and Voltage Brown-Out
Protection on V
DD
Pin
• Protection Against Damage Due to Short-Circuit
Conditions (Positive or Negative Battery Voltage)
• Protection Against High-Voltage Transients in
Automotive Environments
• Automatic Thermal Shutdown Protection
• Suitable for 12V and 24V Systems
• Meets or exceeds stringent automotive design
requirements including “Hardware Requirements
for LIN, CAN and FlexRay Interfaces in Automo-
tive Applications”, Version 1.3, May 2012
• High-Noise Immunity Due to Differential Bus
Implementation
• High Electrostatic Discharge (ESD) Protection on
CANH and CANL, meeting the IEC61000-4-2 up
to ±14 kV
• Available in PDIP-8L, SOIC-8L and 3x3 DFN-8L
• Temperature ranges:
- Extended (E): -40°C to +125°C
- High (H): -40°C to +150°C
Description:
The MCP2561/2 is a Microchip Technology Inc. second
generation high-speed CAN transceiver. It serves as an
interface between a CAN protocol controller and the
physical two-wire CAN bus.
The device meets the automotive requirements for
high-speed (up to 1 Mb/s), low quiescent current,
electromagnetic compatibility (EMC) and electrostatic
discharge (ESD).
Package Types
MCP2561
PDIP, SOIC
T
XD
1
V
SS
2
V
DD
3
R
XD
4
8 STBY
7 CANH
6 CANL
5 SPLIT
MCP2562
PDIP, SOIC
T
XD
1
V
SS
2
V
DD
3
R
XD
4
8 STBY
7 CANH
6 CANL
5 V
IO
MCP2561
3x3 DFN*
T
XD
1
V
SS
2
V
DD
3
R
XD
4
EP
9
8 STBY
7 CANH
6 CANL
5 SPLIT
MCP2562
3x3 DFN*
T
XD
1
V
SS
2
V
DD
3
R
XD
4
EP
9
8 STBY
7 CANH
6 CANL
5 V
IO
* Includes Exposed Thermal Pad (EP); see
Table 1-2.
MCP2561/2 Family Members
Device
MCP2561
MCP2562
Note:
Feature
Split pin
V
IO
pin
Description
Common mode stabilization
Internal level shifter on digital I/O pins
For ordering information, see the
“Product Identification System”
section on page 27.
2013-2014 Microchip Technology Inc.
DS20005167C-page 1

MCP2562-E/MF Related Products

MCP2562-E/MF MCP2561-H/P MCP2561-H/MF MCP2562T-H/MF MCP2561T-H/MF MCP2562-H/MF MCP2562-H/P MCP2561T-H/SN MCP2562-H/SN
Description can interface IC can interface IC can interface IC can interface IC can interface IC can interface IC can interface IC can interface IC can interface IC
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to conform to conform to
package instruction HVSON, DIP, DIP8,.3 DFN-8 HVSON, DFN-8 HVSON, DIP, SOP, SOP8,.25 SOP,
Reach Compliance Code compli compli compli compli compli compli compli compli compli
Factory Lead Time 13 weeks 6 weeks 5 weeks 1 week 5 weeks 17 weeks 12 weeks 15 weeks 14 weeks
JESD-30 code S-PDSO-N8 R-PDIP-T8 S-PDSO-N8 S-PDSO-N8 S-PDSO-N8 S-PDSO-N8 R-PDIP-T8 R-PDSO-G8 R-PDSO-G8
JESD-609 code e3 e3 e3 e3 e3 e3 e3 e3 e3
length 3 mm 9.271 mm 3 mm 3 mm 3 mm 3 mm 9.271 mm 4.9 mm 4.9 mm
Number of functions 1 1 1 1 1 1 1 1 1
Number of terminals 8 8 8 8 8 8 8 8 8
Maximum operating temperature 125 °C 150 °C 150 °C 150 °C 150 °C 150 °C 150 °C 150 °C 150 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code HVSON DIP HVSON HVSON HVSON HVSON DIP SOP SOP
Package shape SQUARE RECTANGULAR SQUARE SQUARE SQUARE SQUARE RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE IN-LINE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE IN-LINE SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Celsius) 260 NOT APPLICABLE 260 260 260 260 NOT APPLICABLE 260 260
Maximum seat height 1 mm 5.334 mm 1 mm 1 mm 1 mm 1 mm 5.334 mm 1.75 mm 1.75 mm
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES NO YES YES YES YES NO YES YES
Telecom integrated circuit types SUPPORT CIRCUIT CAN TRANSCEIVER CAN TRANSCEIVER SUPPORT CIRCUIT CAN TRANSCEIVER SUPPORT CIRCUIT SUPPORT CIRCUIT CAN TRANSCEIVER SUPPORT CIRCUIT
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed
Terminal form NO LEAD THROUGH-HOLE NO LEAD NO LEAD NO LEAD NO LEAD THROUGH-HOLE GULL WING GULL WING
Terminal pitch 0.65 mm 2.54 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 2.54 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 40 NOT APPLICABLE 40 40 40 40 NOT APPLICABLE 40 40
width 3 mm 7.62 mm 3 mm 3 mm 3 mm 3 mm 7.62 mm 3.9 mm 3.9 mm
Maker Microchip Microchip Microchip - Microchip - - Microchip -
Humidity sensitivity level 1 - 1 1 1 1 - 3 3
Base Number Matches 1 - - 1 - 1 1 - 1
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