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MCP2561T-H/SN

Description
can interface IC
CategoryWireless rf/communication    Telecom circuit   
File Size782KB,30 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Environmental Compliance
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MCP2561T-H/SN Overview

can interface IC

MCP2561T-H/SN Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicrochip
package instructionSOP, SOP8,.25
Reach Compliance Codecompli
Factory Lead Time15 weeks
data rate1000 Mbps
JESD-30 codeR-PDSO-G8
JESD-609 codee3
length4.9 mm
Humidity sensitivity level3
Number of functions1
Number of terminals8
Transceiver quantity1
Maximum operating temperature150 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP8,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
Filter levelTS 16949
Maximum seat height1.75 mm
Maximum slew rate70 mA
Nominal supply voltage5 V
surface mountYES
Telecom integrated circuit typesCAN TRANSCEIVER
Temperature levelAUTOMOTIVE
Terminal surfaceMatte Tin (Sn) - annealed
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
width3.9 mm
MCP2561/2
High-Speed CAN Transceiver
Features:
• Supports 1 Mb/s Operation
• Implements ISO-11898-2 and ISO-11898-5
Standard Physical Layer Requirements
• Very Low Standby Current (5 µA, typical)
• V
IO
Supply Pin to Interface Directly to
CAN Controllers and Microcontrollers with
1.8V to 5.5V I/O
• SPLIT Output Pin to Stabilize Common Mode in
Biased Split Termination Schemes
• CAN Bus Pins are Disconnected when Device is
Unpowered:
- An Unpowered Node or Brown-Out Event will
Not Load the CAN Bus
• Detection of Ground Fault:
- Permanent Dominant Detection on T
XD
- Permanent Dominant Detection on Bus
• Power-on Reset and Voltage Brown-Out
Protection on V
DD
Pin
• Protection Against Damage Due to Short-Circuit
Conditions (Positive or Negative Battery Voltage)
• Protection Against High-Voltage Transients in
Automotive Environments
• Automatic Thermal Shutdown Protection
• Suitable for 12V and 24V Systems
• Meets or exceeds stringent automotive design
requirements including “Hardware Requirements
for LIN, CAN and FlexRay Interfaces in Automo-
tive Applications”, Version 1.3, May 2012
• High-Noise Immunity Due to Differential Bus
Implementation
• High Electrostatic Discharge (ESD) Protection on
CANH and CANL, meeting the IEC61000-4-2 up
to ±14 kV
• Available in PDIP-8L, SOIC-8L and 3x3 DFN-8L
• Temperature ranges:
- Extended (E): -40°C to +125°C
- High (H): -40°C to +150°C
Description:
The MCP2561/2 is a Microchip Technology Inc. second
generation high-speed CAN transceiver. It serves as an
interface between a CAN protocol controller and the
physical two-wire CAN bus.
The device meets the automotive requirements for
high-speed (up to 1 Mb/s), low quiescent current,
electromagnetic compatibility (EMC) and electrostatic
discharge (ESD).
Package Types
MCP2561
PDIP, SOIC
T
XD
1
V
SS
2
V
DD
3
R
XD
4
8 STBY
7 CANH
6 CANL
5 SPLIT
MCP2562
PDIP, SOIC
T
XD
1
V
SS
2
V
DD
3
R
XD
4
8 STBY
7 CANH
6 CANL
5 V
IO
MCP2561
3x3 DFN*
T
XD
1
V
SS
2
V
DD
3
R
XD
4
EP
9
8 STBY
7 CANH
6 CANL
5 SPLIT
MCP2562
3x3 DFN*
T
XD
1
V
SS
2
V
DD
3
R
XD
4
EP
9
8 STBY
7 CANH
6 CANL
5 V
IO
* Includes Exposed Thermal Pad (EP); see
Table 1-2.
MCP2561/2 Family Members
Device
MCP2561
MCP2562
Note:
Feature
Split pin
V
IO
pin
Description
Common mode stabilization
Internal level shifter on digital I/O pins
For ordering information, see the
“Product Identification System”
section on page 27.
2013-2014 Microchip Technology Inc.
DS20005167C-page 1

MCP2561T-H/SN Related Products

MCP2561T-H/SN MCP2562-E/MF MCP2561-H/P MCP2561-H/MF MCP2562T-H/MF MCP2561T-H/MF MCP2562-H/MF MCP2562-H/P MCP2562-H/SN
Description can interface IC can interface IC can interface IC can interface IC can interface IC can interface IC can interface IC can interface IC can interface IC
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to conform to conform to
package instruction SOP, SOP8,.25 HVSON, DIP, DIP8,.3 DFN-8 HVSON, DFN-8 HVSON, DIP, SOP,
Reach Compliance Code compli compli compli compli compli compli compli compli compli
Factory Lead Time 15 weeks 13 weeks 6 weeks 5 weeks 1 week 5 weeks 17 weeks 12 weeks 14 weeks
JESD-30 code R-PDSO-G8 S-PDSO-N8 R-PDIP-T8 S-PDSO-N8 S-PDSO-N8 S-PDSO-N8 S-PDSO-N8 R-PDIP-T8 R-PDSO-G8
JESD-609 code e3 e3 e3 e3 e3 e3 e3 e3 e3
length 4.9 mm 3 mm 9.271 mm 3 mm 3 mm 3 mm 3 mm 9.271 mm 4.9 mm
Number of functions 1 1 1 1 1 1 1 1 1
Number of terminals 8 8 8 8 8 8 8 8 8
Maximum operating temperature 150 °C 125 °C 150 °C 150 °C 150 °C 150 °C 150 °C 150 °C 150 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP HVSON DIP HVSON HVSON HVSON HVSON DIP SOP
Package shape RECTANGULAR SQUARE RECTANGULAR SQUARE SQUARE SQUARE SQUARE RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE IN-LINE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Celsius) 260 260 NOT APPLICABLE 260 260 260 260 NOT APPLICABLE 260
Maximum seat height 1.75 mm 1 mm 5.334 mm 1 mm 1 mm 1 mm 1 mm 5.334 mm 1.75 mm
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES NO YES YES YES YES NO YES
Telecom integrated circuit types CAN TRANSCEIVER SUPPORT CIRCUIT CAN TRANSCEIVER CAN TRANSCEIVER SUPPORT CIRCUIT CAN TRANSCEIVER SUPPORT CIRCUIT SUPPORT CIRCUIT SUPPORT CIRCUIT
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed
Terminal form GULL WING NO LEAD THROUGH-HOLE NO LEAD NO LEAD NO LEAD NO LEAD THROUGH-HOLE GULL WING
Terminal pitch 1.27 mm 0.65 mm 2.54 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm 2.54 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 40 40 NOT APPLICABLE 40 40 40 40 NOT APPLICABLE 40
width 3.9 mm 3 mm 7.62 mm 3 mm 3 mm 3 mm 3 mm 7.62 mm 3.9 mm
Maker Microchip Microchip Microchip Microchip - Microchip - - -
Humidity sensitivity level 3 1 - 1 1 1 1 - 3
Base Number Matches - 1 - - 1 - 1 1 1
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