Device mounted with all leads soldered to PC board.
Continuous Power Dissipation (T
A
= +70°C) (Note 1)
Plastic DIP (derate above +70°C by 11.11mW/°C) .....889mW
SO (derate above +70°C by 10.00mW/°C) ..................800mW
CERDIP (derate above +70°C by 11.11mW/°C) ..........889mW
TSSOP (derate above +70°C by 7mW/°C) ..................559mW
Operating Temperature Ranges:
MAX333AC_ _ .....................................................0°C to +70°C
MAX333AE_ _ ..................................................-40°C to +85°C
MAX333AMJP ................................................-55°C to +125°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10sec) .............................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and function-
al operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure
to absolute maximum rating conditions for extended periods may affect device reliability.
Let me be honest
At this stage, if MCU development boards cannot beat ESP32, they really have no future.
The hardware peripherals are definitely not as good as esp32, there is nothing much to say abou...
[i=s]This post was last edited by shijizai on 2018-5-14 15:54[/i] As a newbie, I am here again :congratulate:. This time I don't understand the role of TIM_ClockDivision. When I downloaded the PWM wav...
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