Device mounted with all leads soldered to PC board.
Continuous Power Dissipation (T
A
= +70°C) (Note 1)
Plastic DIP (derate above +70°C by 11.11mW/°C) .....889mW
SO (derate above +70°C by 10.00mW/°C) ..................800mW
CERDIP (derate above +70°C by 11.11mW/°C) ..........889mW
TSSOP (derate above +70°C by 7mW/°C) ..................559mW
Operating Temperature Ranges:
MAX333AC_ _ .....................................................0°C to +70°C
MAX333AE_ _ ..................................................-40°C to +85°C
MAX333AMJP ................................................-55°C to +125°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10sec) .............................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and function-
al operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure
to absolute maximum rating conditions for extended periods may affect device reliability.
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