All Pins to GND .............................................................±2.5kV
IEC 61000-4-2 (R
D
= 330Ω, C
S
= 150pF)
LVDS Inputs to GND (Air-Gap Discharge).....................±15kV
LVDS Inputs to GND (Contact Discharge).......................±8kV
ISO 10605 (R
D
= 2.0kΩ, C
S
= 330pF)
LVDS Inputs to GND (Air-Gap Discharge).....................±30kV
LVDS Inputs to GND (Contact Discharge).......................±6kV
Operating Temperature Range .........................-40°C to +105°C
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
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Microcontroller MCU
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