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74LVC3G17GD,125

Description
buffers & line drivers schmitt trig buffer 3-CH non-invert cmos
Categorylogic    logic   
File Size289KB,23 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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74LVC3G17GD,125 Overview

buffers & line drivers schmitt trig buffer 3-CH non-invert cmos

74LVC3G17GD,125 Parametric

Parameter NameAttribute value
Brand NameNXP Semiconduc
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeSON
package instruction3 X 2 MM, 0.50 MM HEIGHT, PLASTIC, SOT996-2, XSON-8
Contacts8
Manufacturer packaging codeSOT996-2
Reach Compliance Codecompli
seriesLVC/LCX/Z
JESD-30 codeR-PDSO-N8
JESD-609 codee4
length3 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeBUFFER
MaximumI(ol)0.024 A
Humidity sensitivity level1
Number of functions3
Number of entries1
Number of terminals8
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeVSON
Encapsulate equivalent codeSOLCC8,.11,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE, VERY THIN PROFILE
method of packingTAPE AND REEL
Peak Reflow Temperature (Celsius)260
power supply3.3 V
Prop。Delay @ Nom-Su7.1 ns
propagation delay (tpd)13.1 ns
Certification statusNot Qualified
Schmitt triggerYES
Maximum seat height0.5 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)1.65 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceNICKEL PALLADIUM GOLD
Terminal formNO LEAD
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width2 mm
Base Number Matches1
74LVC3G17
Triple non-inverting Schmitt trigger with 5 V tolerant input
Rev. 11 — 9 April 2013
Product data sheet
1. General description
The 74LVC3G17 provides three non-inverting buffers with Schmitt trigger input. It is
capable of transforming slowly changing input signals into sharply defined, jitter-free
output signals.
Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of the
74LVC3G17 as a translator in a mixed 3.3 V and 5 V environment.
This device is fully specified for partial power-down applications using I
OFF
. The I
OFF
circuitry disables the output, preventing a damaging backflow current through the device
when it is powered down.
2. Features and benefits
Wide supply voltage range from 1.65 V to 5.5 V
5 V tolerant input/output for interfacing with 5 V logic
High noise immunity
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
24
mA output drive (V
CC
= 3.0 V)
CMOS low-power consumption
Latch-up performance exceeds 250 mA
Direct interface with TTL levels
Multiple package options
Specified from
40 C
to +85
C
and
40 C
to +125
C
3. Applications
Wave and pulse shapers for highly noisy environments

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Description buffers & line drivers schmitt trig buffer 3-CH non-invert cmos buffers & line drivers trip NO-inv sch trig buffers & line drivers 3.3V 3X NO-inv sch inverters triple non-inverting schmitt trigger buffers & line drivers 3.3V tri ninv buffers & line drivers 6.5 V xson8 inverters triple non-inv schmt trigger W/ 5V input
Brand Name NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconduc
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to
Maker NXP NXP NXP NXP NXP NXP NXP
Parts packaging code SON TSSOP SSOP SON QFN SON SON
package instruction 3 X 2 MM, 0.50 MM HEIGHT, PLASTIC, SOT996-2, XSON-8 3 MM, PLASTIC, SOT505-2, TSSOP-8 2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8 SON, SOLCC8,.04,12 1.60 X 1.60 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT902-1, XQFN-8 VSON, SOLCC8,.04,14 VSON, SOLCC8,.04,14
Contacts 8 8 8 8 8 8 8
Manufacturer packaging code SOT996-2 SOT505-2 SOT765-1 SOT1116 SOT902-2 SOT1203 SOT1089
Reach Compliance Code compli compli compli compli compli compli compli
series LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z
JESD-30 code R-PDSO-N8 S-PDSO-G8 R-PDSO-G8 R-PDSO-N8 R-PBCC-B8 R-PDSO-N8 R-PDSO-N8
JESD-609 code e4 e4 e4 e3 e4 e3 e3
length 3 mm 3 mm 2.3 mm 1.2 mm 1.95 mm 1.35 mm 1.35 mm
Load capacitance (CL) 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type BUFFER BUFFER BUFFER BUFFER BUFFER BUFFER BUFFER
MaximumI(ol) 0.024 A 0.024 A 0.024 A 0.024 A 0.024 A 0.024 A 0.024 A
Humidity sensitivity level 1 1 1 1 1 1 1
Number of functions 3 3 3 3 3 3 3
Number of entries 1 1 1 1 1 1 1
Number of terminals 8 8 8 8 8 8 8
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code VSON TSSOP VSSOP SON VBCC VSON VSON
Encapsulate equivalent code SOLCC8,.11,20 TSSOP8,.16 TSSOP8,.12,20 SOLCC8,.04,12 LCC8,.06SQ,20 SOLCC8,.04,14 SOLCC8,.04,14
Package shape RECTANGULAR SQUARE RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE CHIP CARRIER, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE
method of packing TAPE AND REEL TAPE AND REEL TAPE AND REEL TAPE AND REEL TAPE AND REEL TAPE AND REEL TAPE AND REEL
Peak Reflow Temperature (Celsius) 260 260 260 NOT SPECIFIED 260 NOT SPECIFIED NOT SPECIFIED
power supply 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Prop。Delay @ Nom-Su 7.1 ns 7.1 ns 7.1 ns 7.1 ns 7.1 ns 7.1 ns 7.1 ns
propagation delay (tpd) 13.1 ns 13.1 ns 13.1 ns 13.1 ns 13.1 ns 13.1 ns 13.1 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Schmitt trigger YES YES YES YES YES YES YES
Maximum seat height 0.5 mm 1.1 mm 1 mm 0.35 mm 0.5 mm 0.35 mm 0.5 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 1.65 V 1.65 V 1.65 V 1.65 V 1.65 V 1.65 V 1.65 V
Nominal supply voltage (Vsup) 1.8 V 1.8 V 1.8 V 3.3 V 1.8 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD Tin (Sn) NICKEL PALLADIUM GOLD Tin (Sn) Tin (Sn)
Terminal form NO LEAD GULL WING GULL WING NO LEAD BUTT NO LEAD NO LEAD
Terminal pitch 0.5 mm 0.65 mm 0.5 mm 0.3 mm 0.5 mm 0.35 mm 0.35 mm
Terminal location DUAL DUAL DUAL DUAL BOTTOM DUAL DUAL
Maximum time at peak reflow temperature 30 30 30 NOT SPECIFIED 30 NOT SPECIFIED NOT SPECIFIED
width 2 mm 3 mm 2 mm 1 mm 0.95 mm 1 mm 1 mm
Base Number Matches 1 1 1 1 1 1 1

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