74LVC3G17GF,115 datasheet, PDF

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74LVC3G17GF,115: Descriptioninverters triple non-inv schmt trigger W/ 5V input; Categorylogic logic; File Size289KB，23 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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74LVC3G17GF,115 Overview

inverters triple non-inv schmt trigger W/ 5V input

74LVC3G17GF,115 Parametric

Parameter Name	Attribute value
Brand Name	NXP Semiconduc
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	SON
package instruction	VSON, SOLCC8,.04,14
Contacts	8
Manufacturer packaging code	SOT1089
Reach Compliance Code	compli
series	LVC/LCX/Z
JESD-30 code	R-PDSO-N8
JESD-609 code	e3
length	1.35 mm
Load capacitance (CL)	50 pF
Logic integrated circuit type	BUFFER
MaximumI(ol)	0.024 A
Humidity sensitivity level	1
Number of functions	3
Number of entries	1
Number of terminals	8
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	VSON
Encapsulate equivalent code	SOLCC8,.04,14
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, VERY THIN PROFILE
method of packing	TAPE AND REEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Prop。Delay @ Nom-Su	7.1 ns
propagation delay (tpd)	13.1 ns
Certification status	Not Qualified
Schmitt trigger	YES
Maximum seat height	0.5 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	1.65 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	Tin (Sn)
Terminal form	NO LEAD
Terminal pitch	0.35 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	1 mm
Base Number Matches	1

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74LVC3G17

Triple non-inverting Schmitt trigger with 5 V tolerant input

Rev. 11 — 9 April 2013

Product data sheet

1. General description

The 74LVC3G17 provides three non-inverting buffers with Schmitt trigger input. It is

capable of transforming slowly changing input signals into sharply defined, jitter-free

output signals.

Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of the

74LVC3G17 as a translator in a mixed 3.3 V and 5 V environment.

This device is fully specified for partial power-down applications using I

OFF

. The I

OFF

circuitry disables the output, preventing a damaging backflow current through the device

when it is powered down.

2. Features and benefits



Wide supply voltage range from 1.65 V to 5.5 V

5 V tolerant input/output for interfacing with 5 V logic

High noise immunity

ESD protection:



HBM JESD22-A114F exceeds 2000 V



MM JESD22-A115-A exceeds 200 V

24

mA output drive (V

= 3.0 V)

CMOS low-power consumption

Latch-up performance exceeds 250 mA

Direct interface with TTL levels

Multiple package options

Specified from

40 C

to +85

C

and

40 C

to +125

C



3. Applications



Wave and pulse shapers for highly noisy environments

74LVC3G17GF,115 Related Products

	74LVC3G17GF,115	74LVC3G17DP,125	74LVC3G17DC,125	74LVC3G17GD,125	74LVC3G17GN,115	74LVC3G17GM,125	74LVC3G17GS,115
Description	inverters triple non-inv schmt trigger W/ 5V input	buffers & line drivers trip NO-inv sch trig	buffers & line drivers 3.3V 3X NO-inv sch	buffers & line drivers schmitt trig buffer 3-CH non-invert cmos	inverters triple non-inverting schmitt trigger	buffers & line drivers 3.3V tri ninv	buffers & line drivers 6.5 V xson8
Brand Name	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Maker	NXP	NXP	NXP	NXP	NXP	NXP	NXP
Parts packaging code	SON	TSSOP	SSOP	SON	SON	QFN	SON
package instruction	VSON, SOLCC8,.04,14	3 MM, PLASTIC, SOT505-2, TSSOP-8	2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8	3 X 2 MM, 0.50 MM HEIGHT, PLASTIC, SOT996-2, XSON-8	SON, SOLCC8,.04,12	1.60 X 1.60 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT902-1, XQFN-8	VSON, SOLCC8,.04,14
Contacts	8	8	8	8	8	8	8
Manufacturer packaging code	SOT1089	SOT505-2	SOT765-1	SOT996-2	SOT1116	SOT902-2	SOT1203
Reach Compliance Code	compli	compli	compli	compli	compli	compli	compli
series	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z
JESD-30 code	R-PDSO-N8	S-PDSO-G8	R-PDSO-G8	R-PDSO-N8	R-PDSO-N8	R-PBCC-B8	R-PDSO-N8
JESD-609 code	e3	e4	e4	e4	e3	e4	e3
length	1.35 mm	3 mm	2.3 mm	3 mm	1.2 mm	1.95 mm	1.35 mm
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	BUFFER	BUFFER	BUFFER	BUFFER	BUFFER	BUFFER	BUFFER
MaximumI(ol)	0.024 A	0.024 A	0.024 A	0.024 A	0.024 A	0.024 A	0.024 A
Humidity sensitivity level	1	1	1	1	1	1	1
Number of functions	3	3	3	3	3	3	3
Number of entries	1	1	1	1	1	1	1
Number of terminals	8	8	8	8	8	8	8
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	VSON	TSSOP	VSSOP	VSON	SON	VBCC	VSON
Encapsulate equivalent code	SOLCC8,.04,14	TSSOP8,.16	TSSOP8,.12,20	SOLCC8,.11,20	SOLCC8,.04,12	LCC8,.06SQ,20	SOLCC8,.04,14
Package shape	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE	CHIP CARRIER, VERY THIN PROFILE	SMALL OUTLINE, VERY THIN PROFILE
method of packing	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	260	260	260	NOT SPECIFIED	260	NOT SPECIFIED
power supply	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Prop。Delay @ Nom-Su	7.1 ns	7.1 ns	7.1 ns	7.1 ns	7.1 ns	7.1 ns	7.1 ns
propagation delay (tpd)	13.1 ns	13.1 ns	13.1 ns	13.1 ns	13.1 ns	13.1 ns	13.1 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Schmitt trigger	YES	YES	YES	YES	YES	YES	YES
Maximum seat height	0.5 mm	1.1 mm	1 mm	0.5 mm	0.35 mm	0.5 mm	0.35 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	1.65 V	1.65 V	1.65 V	1.65 V	1.65 V	1.65 V	1.65 V
Nominal supply voltage (Vsup)	3.3 V	1.8 V	1.8 V	1.8 V	3.3 V	1.8 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Terminal surface	Tin (Sn)	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	Tin (Sn)	NICKEL PALLADIUM GOLD	Tin (Sn)
Terminal form	NO LEAD	GULL WING	GULL WING	NO LEAD	NO LEAD	BUTT	NO LEAD
Terminal pitch	0.35 mm	0.65 mm	0.5 mm	0.5 mm	0.3 mm	0.5 mm	0.35 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	BOTTOM	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	30	30	30	NOT SPECIFIED	30	NOT SPECIFIED
width	1 mm	3 mm	2 mm	2 mm	1 mm	0.95 mm	1 mm
Base Number Matches	1	1	1	1	1	1	1

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