74LVC1G57GM,132 datasheet, PDF

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74LVC1G57GM,132: Descriptionlogic gates 3.3V single 2chan; Categorylogic logic; File Size148KB，21 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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74LVC1G57GM,132 Overview

logic gates 3.3V single 2chan

74LVC1G57GM,132 Parametric

Parameter Name	Attribute value
Brand Name	NXP Semiconduc
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	SON
package instruction	VSON, SOLCC6,.04,20
Contacts	6
Manufacturer packaging code	SOT886
Reach Compliance Code	compli
series	LVC/LCX/Z
JESD-30 code	R-PDSO-N6
JESD-609 code	e3
length	1.45 mm
Load capacitance (CL)	50 pF
Logic integrated circuit type	LOGIC CIRCUIT
MaximumI(ol)	0.024 A
Humidity sensitivity level	1
Number of functions	1
Number of terminals	6
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	VSON
Encapsulate equivalent code	SOLCC6,.04,20
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, VERY THIN PROFILE
method of packing	TAPE AND REEL
Peak Reflow Temperature (Celsius)	260
power supply	3.3 V
Prop。Delay @ Nom-Su	7.9 ns
Certification status	Not Qualified
Schmitt trigger	YES
Maximum seat height	0.5 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	1.65 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	Tin (Sn)
Terminal form	NO LEAD
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	1 mm

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74LVC1G57

Low-power configurable multiple function gate

Rev. 6 — 6 December 2011

Product data sheet

1. General description

The 74LVC1G57 provides configurable multiple functions. The output state is determined

by eight patterns of 3-bit input. The user can choose the logic functions AND, OR, NAND,

NOR, XNOR, inverter and buffer. All inputs can be connected to V

or GND.

Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of this

device in a mixed 3.3 V and 5 V environment.

This device is fully specified for partial power-down applications using I

OFF

The I

OFF

circuitry disables the output, preventing the damaging backflow current through

the device when it is powered down.

All inputs (A, B and C) are Schmitt trigger inputs. They are capable of transforming slowly

changing input signals into sharply defined, jitter-free output signals.

2. Features and benefits



Wide supply voltage range from 1.65 V to 5.5 V

5 V tolerant input/output for interfacing with 5 V logic

High noise immunity

Complies with JEDEC standard:



JESD8-7 (1.65 V to 1.95 V)



JESD8-5 (2.3 V to 2.7 V)



JESD8B/JESD36 (2.7 V to 3.6 V).

ESD protection:



HBM JESD22-A114F exceeds 2000 V



MM JESD22-A115-A exceeds 200 V

24

mA output drive (V

= 3.0 V)

CMOS low power consumption

Latch-up performance exceeds 250 mA

Direct interface with TTL levels

Inputs accept voltages up to 5 V

Multiple package options

Specified from

40 C

to +85

C

and

40 C

to +125

C.



74LVC1G57GM,132 Related Products

	74LVC1G57GM,132	74LVC1G57GS,132	74LVC1G57GF,132	74LVC1G57GM,115	74LVC1G57GV,125
Description	logic gates 3.3V single 2chan	translation - voltage levels 18ns 5.5V 250mw	logic gates 3.3V 1G low-P config	logic gates 3.3V LP config gate	logic gates 3.3V LP config gate
Brand Name	NXP Semiconduc	NXP Semiconduc	NXP Semiconduc	NXP Semiconductor	NXP Semiconductor
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to
Maker	NXP	NXP	NXP	NXP	NXP
package instruction	VSON, SOLCC6,.04,20	1 X 1 MM, 0.35 MM HEIGHT, SOT-1202, SON-6	VSON, SOLCC6,.04,14	VSON, SOLCC6,.04,20	TSSOP, TSOP6,.11,37
Manufacturer packaging code	SOT886	SOT1202	SOT891	SOT886	SOT457
Reach Compliance Code	compli	compli	compli	compliant	compliant
Parts packaging code	SON	-	SON	SON	TSOP
Contacts	6	-	6	6	6
series	LVC/LCX/Z	-	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z
JESD-30 code	R-PDSO-N6	-	S-PDSO-N6	R-PDSO-N6	R-PDSO-G6
JESD-609 code	e3	-	e3	e3	e3
length	1.45 mm	-	1 mm	1.45 mm	2.9 mm
Load capacitance (CL)	50 pF	-	50 pF	50 pF	50 pF
Logic integrated circuit type	LOGIC CIRCUIT	-	LOGIC CIRCUIT	LOGIC CIRCUIT	LOGIC CIRCUIT
MaximumI(ol)	0.024 A	-	0.024 A	0.024 A	0.024 A
Humidity sensitivity level	1	-	1	1	1
Number of functions	1	-	1	1	1
Number of terminals	6	-	6	6	6
Maximum operating temperature	125 °C	-	125 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	VSON	-	VSON	VSON	TSSOP
Encapsulate equivalent code	SOLCC6,.04,20	-	SOLCC6,.04,14	SOLCC6,.04,20	TSOP6,.11,37
Package shape	RECTANGULAR	-	SQUARE	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, VERY THIN PROFILE	-	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packing	TAPE AND REEL	-	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL
Peak Reflow Temperature (Celsius)	260	-	260	260	260
power supply	3.3 V	-	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified
Schmitt trigger	YES	-	YES	YES	YES
Maximum seat height	0.5 mm	-	0.5 mm	0.5 mm	1.1 mm
Maximum supply voltage (Vsup)	5.5 V	-	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	1.65 V	-	1.65 V	1.65 V	1.65 V
Nominal supply voltage (Vsup)	1.8 V	-	1.8 V	1.8 V	1.8 V
surface mount	YES	-	YES	YES	YES
technology	CMOS	-	CMOS	CMOS	CMOS
Temperature level	AUTOMOTIVE	-	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Terminal surface	Tin (Sn)	-	Tin (Sn)	Tin (Sn)	Tin (Sn)
Terminal form	NO LEAD	-	NO LEAD	NO LEAD	GULL WING
Terminal pitch	0.5 mm	-	0.35 mm	0.5 mm	0.95 mm
Terminal location	DUAL	-	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	30	-	30	30	30
width	1 mm	-	1 mm	1 mm	1.5 mm

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