EEWORLDEEWORLDEEWORLD

Part Number

Search

74LVC1G57GV,125

Description
logic gates 3.3V LP config gate
Categorylogic    logic   
File Size148KB,21 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
Download Datasheet Parametric Compare View All

74LVC1G57GV,125 Overview

logic gates 3.3V LP config gate

74LVC1G57GV,125 Parametric

Parameter NameAttribute value
Brand NameNXP Semiconductor
Is it Rohs certified?conform to
parentfamilyid1074898
MakerNXP
Objectid1815869521
Parts packaging codeTSOP
package instructionTSSOP, TSOP6,.11,37
Contacts6
Manufacturer packaging codeSOT457
Reach Compliance Codecompliant
compound_id2342287
seriesLVC/LCX/Z
JESD-30 codeR-PDSO-G6
JESD-609 codee3
length2.9 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeLOGIC CIRCUIT
MaximumI(ol)0.024 A
Humidity sensitivity level1
Number of functions1
Number of terminals6
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSOP6,.11,37
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packingTAPE AND REEL
Peak Reflow Temperature (Celsius)260
power supply3.3 V
Prop。Delay @ Nom-Sup7.9 ns
Certification statusNot Qualified
Schmitt triggerYES
Maximum seat height1.1 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)1.65 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceTin (Sn)
Terminal formGULL WING
Terminal pitch0.95 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width1.5 mm
74LVC1G57
Low-power configurable multiple function gate
Rev. 6 — 6 December 2011
Product data sheet
1. General description
The 74LVC1G57 provides configurable multiple functions. The output state is determined
by eight patterns of 3-bit input. The user can choose the logic functions AND, OR, NAND,
NOR, XNOR, inverter and buffer. All inputs can be connected to V
CC
or GND.
Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of this
device in a mixed 3.3 V and 5 V environment.
This device is fully specified for partial power-down applications using I
OFF
.
The I
OFF
circuitry disables the output, preventing the damaging backflow current through
the device when it is powered down.
All inputs (A, B and C) are Schmitt trigger inputs. They are capable of transforming slowly
changing input signals into sharply defined, jitter-free output signals.
2. Features and benefits
Wide supply voltage range from 1.65 V to 5.5 V
5 V tolerant input/output for interfacing with 5 V logic
High noise immunity
Complies with JEDEC standard:
JESD8-7 (1.65 V to 1.95 V)
JESD8-5 (2.3 V to 2.7 V)
JESD8B/JESD36 (2.7 V to 3.6 V).
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
24
mA output drive (V
CC
= 3.0 V)
CMOS low power consumption
Latch-up performance exceeds 250 mA
Direct interface with TTL levels
Inputs accept voltages up to 5 V
Multiple package options
Specified from
40 C
to +85
C
and
40 C
to +125
C.

74LVC1G57GV,125 Related Products

74LVC1G57GV,125 74LVC1G57GM,132 74LVC1G57GS,132 74LVC1G57GF,132 74LVC1G57GM,115
Description logic gates 3.3V LP config gate logic gates 3.3V single 2chan translation - voltage levels 18ns 5.5V 250mw logic gates 3.3V 1G low-P config logic gates 3.3V LP config gate
Brand Name NXP Semiconductor NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconductor
Is it Rohs certified? conform to conform to conform to conform to conform to
Maker NXP NXP NXP NXP NXP
package instruction TSSOP, TSOP6,.11,37 VSON, SOLCC6,.04,20 1 X 1 MM, 0.35 MM HEIGHT, SOT-1202, SON-6 VSON, SOLCC6,.04,14 VSON, SOLCC6,.04,20
Manufacturer packaging code SOT457 SOT886 SOT1202 SOT891 SOT886
Reach Compliance Code compliant compli compli compli compliant
Parts packaging code TSOP SON - SON SON
Contacts 6 6 - 6 6
series LVC/LCX/Z LVC/LCX/Z - LVC/LCX/Z LVC/LCX/Z
JESD-30 code R-PDSO-G6 R-PDSO-N6 - S-PDSO-N6 R-PDSO-N6
JESD-609 code e3 e3 - e3 e3
length 2.9 mm 1.45 mm - 1 mm 1.45 mm
Load capacitance (CL) 50 pF 50 pF - 50 pF 50 pF
Logic integrated circuit type LOGIC CIRCUIT LOGIC CIRCUIT - LOGIC CIRCUIT LOGIC CIRCUIT
MaximumI(ol) 0.024 A 0.024 A - 0.024 A 0.024 A
Humidity sensitivity level 1 1 - 1 1
Number of functions 1 1 - 1 1
Number of terminals 6 6 - 6 6
Maximum operating temperature 125 °C 125 °C - 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C - -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP VSON - VSON VSON
Encapsulate equivalent code TSOP6,.11,37 SOLCC6,.04,20 - SOLCC6,.04,14 SOLCC6,.04,20
Package shape RECTANGULAR RECTANGULAR - SQUARE RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE - SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE
method of packing TAPE AND REEL TAPE AND REEL - TAPE AND REEL TAPE AND REEL
Peak Reflow Temperature (Celsius) 260 260 - 260 260
power supply 3.3 V 3.3 V - 3.3 V 3.3 V
Certification status Not Qualified Not Qualified - Not Qualified Not Qualified
Schmitt trigger YES YES - YES YES
Maximum seat height 1.1 mm 0.5 mm - 0.5 mm 0.5 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V - 5.5 V 5.5 V
Minimum supply voltage (Vsup) 1.65 V 1.65 V - 1.65 V 1.65 V
Nominal supply voltage (Vsup) 1.8 V 1.8 V - 1.8 V 1.8 V
surface mount YES YES - YES YES
technology CMOS CMOS - CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE - AUTOMOTIVE AUTOMOTIVE
Terminal surface Tin (Sn) Tin (Sn) - Tin (Sn) Tin (Sn)
Terminal form GULL WING NO LEAD - NO LEAD NO LEAD
Terminal pitch 0.95 mm 0.5 mm - 0.35 mm 0.5 mm
Terminal location DUAL DUAL - DUAL DUAL
Maximum time at peak reflow temperature 30 30 - 30 30
width 1.5 mm 1 mm - 1 mm 1 mm
Can't find boot.hv when compiling PB?
I added boot.hv to the .bib file: FILES boot.hv $(_FLATRELEASEDIR)\boot.hv XIPKERNEL SH default.hv $(_FLATRELEASEDIR)\default.hv XIPKERNEL SH user.hv $(_FLATRELEASEDIR)\user.hv XIPKERNEL SH However, w...
tanling79467240 Embedded System
How to write image files to ARM
I am now doing some experiments on the ARM7 development board, but the experimental tutorial does not tell me how to generate an image file from the compiled C language program and how to write it int...
gjfzb ARM Technology
【McQueen Trial】Line Patrol Program
The McQueen car provides three programming environments [align=center][/align] [size=3] Mind+ is a graphical programming environment developed by DFRobot itself. It is a full Chinese environment and c...
xscc MicroPython Open Source section
Bug
When switching from the space to the forum, the URL is wrong. For example, the link in [url]https://home.eeworld.com.cn/my/space-uid-399373-blogid-228619.html[/url] points to [url]https://bbs.eeworld....
astwyg Suggestions & Announcements
Where can I buy a development board based on TMS570LS1224?
I am a novice in DSP. Can anyone tell me where I can buy a TMS570LS1224 development board? Or other models of the TMS570LS series are also fine....
你会记住我的3 TI Technology Forum
Arbitrary cascade principle of dot matrix screen
Using the serial move and storage functions of 75HC595, it supports cascading of any length in theory. Is this correct? Welcome to correct me....
eeleader Industrial Control Electronics

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 97  1536  1889  871  2051  2  31  39  18  42 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号