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74AHCT541D,112

Description
buffers & line drivers octal buf/drivr 3-ST
Categorylogic    logic   
File Size88KB,17 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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74AHCT541D,112 Overview

buffers & line drivers octal buf/drivr 3-ST

74AHCT541D,112 Parametric

Parameter NameAttribute value
Brand NameNXP Semiconduc
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeSOP
package instruction7.50 MM, PLASTIC, MS-013, SOT163-1, SOP-20
Contacts20
Manufacturer packaging codeSOT163-1
Reach Compliance Codecompli
Other featuresWITH DUAL OUTPUT ENABLE
Control typeENABLE LOW
seriesAHCT/VHCT/VT
JESD-30 codeR-PDSO-G20
JESD-609 codee4
length12.8 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeBUS DRIVER
MaximumI(ol)0.008 A
Humidity sensitivity level1
Number of digits8
Number of functions1
Number of ports2
Number of terminals20
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Output characteristics3-STATE
Output polarityTRUE
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP20,.4
Package shapeRECTANGULAR
Package formSMALL OUTLINE
method of packingTUBE
Peak Reflow Temperature (Celsius)260
power supply5 V
Prop。Delay @ Nom-Su9.5 ns
propagation delay (tpd)11 ns
Certification statusNot Qualified
Maximum seat height2.65 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceNICKEL PALLADIUM GOLD
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width7.5 mm
74AHC541; 74AHCT541
Octal buffer/line driver; 3-state
Rev. 03 — 12 November 2007
Product data sheet
1. General description
The 74AHC541; 74AHCT541 is a high-speed Si-gate CMOS device.
The 74AHC541; 74AHCT541 are octal non-inverting buffer/line drivers with 3-state bus
compatible outputs.
The 3-state outputs are controlled by the output enable inputs OE0 and OE1.
A HIGH on OEn causes the outputs to assume a high-impedance OFF-state.
2. Features
s
s
s
s
s
s
Balanced propagation delays
All inputs have a Schmitt-trigger action
Inputs accepts voltages higher than V
CC
For 74AHC541 only: operates with CMOS input levels
For 74AHCT541 only: operates with TTL input levels
ESD protection:
x
HBM JESD22-A114E exceeds 2000 V
x
MM JESD22-A115-A exceeds 200 V
x
CDM JESD22-C101C exceeds 1000 V
s
Multiple package options
s
Specified from
−40 °C
to +85
°C
and from
−40 °C
to +125
°C
3. Ordering information
Table 1.
Ordering information
Package
Temperature range
74AHC541D
74AHCT541D
74AHC541PW
74AHCT541PW
74AHC541BQ
74AHCT541BQ
−40 °C
to +125
°C
DHVQFN20
−40 °C
to +125
°C
TSSOP20
−40 °C
to +125
°C
Name
SO20
Description
plastic small outline package; 20 leads;
body width 7.5 mm
plastic thin shrink small outline package; 20 leads;
body width 4.4 mm
Version
SOT163-1
SOT360-1
Type number
plastic dual-in-line compatible thermal enhanced
SOT764-1
very thin quad flat package; no leads; 20 terminals;
body 2.5
×
4.5
×
0.85 mm

74AHCT541D,112 Related Products

74AHCT541D,112 74AHC541PW,112 74AHCT541BQ,115 74AHC541PW,118 74AHC541BQ,115
Description buffers & line drivers octal buf/drivr 3-ST buffers & line drivers octal buf/drivr 3-ST buffers & line drivers 5V octal buffer/line buffers & line drivers octal buf/drivr 3-ST buffers & line drivers 5V octal buffer/line
Brand Name NXP Semiconduc NXP Semiconduc NXP Semiconductor NXP Semiconductor NXP Semiconductor
Is it Rohs certified? conform to conform to conform to conform to conform to
Maker NXP NXP NXP NXP NXP
Parts packaging code SOP TSSOP2 QFN TSSOP2 QFN
package instruction 7.50 MM, PLASTIC, MS-013, SOT163-1, SOP-20 4.40 MM, PLASTIC, MO-153, SOT360-1, TSSOP-20 HVQCCN, LCC20/24,.14X.18,20 TSSOP, TSSOP20,.25 HVQCCN, LCC20/24,.14X.18,20
Contacts 20 20 20 20 20
Manufacturer packaging code SOT163-1 SOT360-1 SOT764-1 SOT360-1 SOT764-1
Reach Compliance Code compli compli compliant compliant compliant
Control type ENABLE LOW ENABLE LOW ENABLE LOW ENABLE LOW ENABLE LOW
series AHCT/VHCT/VT AHC/VHC/H/U/V AHCT/VHCT/VT AHC/VHC/H/U/V AHC/VHC/H/U/V
JESD-30 code R-PDSO-G20 R-PDSO-G20 R-PQCC-N20 R-PDSO-G20 R-PQCC-N20
JESD-609 code e4 e4 e4 e4 e4
length 12.8 mm 6.5 mm 4.5 mm 6.5 mm 4.5 mm
Load capacitance (CL) 50 pF 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
MaximumI(ol) 0.008 A 0.008 A 0.008 A 0.008 A 0.008 A
Humidity sensitivity level 1 1 1 1 1
Number of digits 8 8 8 8 8
Number of functions 1 1 1 1 1
Number of ports 2 2 2 2 2
Number of terminals 20 20 20 20 20
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Output polarity TRUE TRUE TRUE TRUE TRUE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP TSSOP HVQCCN TSSOP HVQCCN
Encapsulate equivalent code SOP20,.4 TSSOP20,.25 LCC20/24,.14X.18,20 TSSOP20,.25 LCC20/24,.14X.18,20
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius) 260 260 260 260 260
power supply 5 V 2/5.5 V 5 V 2/5.5 V 2/5.5 V
propagation delay (tpd) 11 ns 13.5 ns 11 ns 13.5 ns 13.5 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 2.65 mm 1.1 mm 1 mm 1.1 mm 1 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 2 V 4.5 V 2 V 2 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 5 V 3.3 V 3.3 V
surface mount YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD
Terminal form GULL WING GULL WING NO LEAD GULL WING NO LEAD
Terminal pitch 1.27 mm 0.65 mm 0.5 mm 0.65 mm 0.5 mm
Terminal location DUAL DUAL QUAD DUAL QUAD
Maximum time at peak reflow temperature 30 30 30 30 30
width 7.5 mm 4.4 mm 2.5 mm 4.4 mm 2.5 mm
Other features WITH DUAL OUTPUT ENABLE WITH DUAL OUTPUT ENABLE - WITH DUAL OUTPUT ENABLE -
method of packing TUBE TUBE - TAPE AND REEL TAPE AND REEL
Prop。Delay @ Nom-Sup - - 9.5 ns 12 ns 12 ns

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