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74AHC541BQ,115

Description
buffers & line drivers 5V octal buffer/line
Categorylogic    logic   
File Size88KB,17 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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74AHC541BQ,115 Overview

buffers & line drivers 5V octal buffer/line

74AHC541BQ,115 Parametric

Parameter NameAttribute value
Brand NameNXP Semiconductor
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeQFN
package instructionHVQCCN, LCC20/24,.14X.18,20
Contacts20
Manufacturer packaging codeSOT764-1
Reach Compliance Codecompliant
Is SamacsysN
Control typeENABLE LOW
seriesAHC/VHC/H/U/V
JESD-30 codeR-PQCC-N20
JESD-609 codee4
length4.5 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeBUS DRIVER
MaximumI(ol)0.008 A
Humidity sensitivity level1
Number of digits8
Number of functions1
Number of ports2
Number of terminals20
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Output characteristics3-STATE
Output polarityTRUE
Package body materialPLASTIC/EPOXY
encapsulated codeHVQCCN
Encapsulate equivalent codeLCC20/24,.14X.18,20
Package shapeRECTANGULAR
Package formCHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
method of packingTAPE AND REEL
Peak Reflow Temperature (Celsius)260
power supply2/5.5 V
Prop。Delay @ Nom-Sup12 ns
propagation delay (tpd)13.5 ns
Certification statusNot Qualified
Maximum seat height1 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)2 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceNICKEL PALLADIUM GOLD
Terminal formNO LEAD
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
width2.5 mm
Base Number Matches1
74AHC541; 74AHCT541
Octal buffer/line driver; 3-state
Rev. 03 — 12 November 2007
Product data sheet
1. General description
The 74AHC541; 74AHCT541 is a high-speed Si-gate CMOS device.
The 74AHC541; 74AHCT541 are octal non-inverting buffer/line drivers with 3-state bus
compatible outputs.
The 3-state outputs are controlled by the output enable inputs OE0 and OE1.
A HIGH on OEn causes the outputs to assume a high-impedance OFF-state.
2. Features
s
s
s
s
s
s
Balanced propagation delays
All inputs have a Schmitt-trigger action
Inputs accepts voltages higher than V
CC
For 74AHC541 only: operates with CMOS input levels
For 74AHCT541 only: operates with TTL input levels
ESD protection:
x
HBM JESD22-A114E exceeds 2000 V
x
MM JESD22-A115-A exceeds 200 V
x
CDM JESD22-C101C exceeds 1000 V
s
Multiple package options
s
Specified from
−40 °C
to +85
°C
and from
−40 °C
to +125
°C
3. Ordering information
Table 1.
Ordering information
Package
Temperature range
74AHC541D
74AHCT541D
74AHC541PW
74AHCT541PW
74AHC541BQ
74AHCT541BQ
−40 °C
to +125
°C
DHVQFN20
−40 °C
to +125
°C
TSSOP20
−40 °C
to +125
°C
Name
SO20
Description
plastic small outline package; 20 leads;
body width 7.5 mm
plastic thin shrink small outline package; 20 leads;
body width 4.4 mm
Version
SOT163-1
SOT360-1
Type number
plastic dual-in-line compatible thermal enhanced
SOT764-1
very thin quad flat package; no leads; 20 terminals;
body 2.5
×
4.5
×
0.85 mm

74AHC541BQ,115 Related Products

74AHC541BQ,115 74AHC541PW,112 74AHCT541D,112 74AHCT541BQ,115 74AHC541PW,118
Description buffers & line drivers 5V octal buffer/line buffers & line drivers octal buf/drivr 3-ST buffers & line drivers octal buf/drivr 3-ST buffers & line drivers 5V octal buffer/line buffers & line drivers octal buf/drivr 3-ST
Brand Name NXP Semiconductor NXP Semiconduc NXP Semiconduc NXP Semiconductor NXP Semiconductor
Is it Rohs certified? conform to conform to conform to conform to conform to
Maker NXP NXP NXP NXP NXP
Parts packaging code QFN TSSOP2 SOP QFN TSSOP2
package instruction HVQCCN, LCC20/24,.14X.18,20 4.40 MM, PLASTIC, MO-153, SOT360-1, TSSOP-20 7.50 MM, PLASTIC, MS-013, SOT163-1, SOP-20 HVQCCN, LCC20/24,.14X.18,20 TSSOP, TSSOP20,.25
Contacts 20 20 20 20 20
Manufacturer packaging code SOT764-1 SOT360-1 SOT163-1 SOT764-1 SOT360-1
Reach Compliance Code compliant compli compli compliant compliant
Control type ENABLE LOW ENABLE LOW ENABLE LOW ENABLE LOW ENABLE LOW
series AHC/VHC/H/U/V AHC/VHC/H/U/V AHCT/VHCT/VT AHCT/VHCT/VT AHC/VHC/H/U/V
JESD-30 code R-PQCC-N20 R-PDSO-G20 R-PDSO-G20 R-PQCC-N20 R-PDSO-G20
JESD-609 code e4 e4 e4 e4 e4
length 4.5 mm 6.5 mm 12.8 mm 4.5 mm 6.5 mm
Load capacitance (CL) 50 pF 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
MaximumI(ol) 0.008 A 0.008 A 0.008 A 0.008 A 0.008 A
Humidity sensitivity level 1 1 1 1 1
Number of digits 8 8 8 8 8
Number of functions 1 1 1 1 1
Number of ports 2 2 2 2 2
Number of terminals 20 20 20 20 20
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Output polarity TRUE TRUE TRUE TRUE TRUE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code HVQCCN TSSOP SOP HVQCCN TSSOP
Encapsulate equivalent code LCC20/24,.14X.18,20 TSSOP20,.25 SOP20,.4 LCC20/24,.14X.18,20 TSSOP20,.25
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius) 260 260 260 260 260
power supply 2/5.5 V 2/5.5 V 5 V 5 V 2/5.5 V
propagation delay (tpd) 13.5 ns 13.5 ns 11 ns 11 ns 13.5 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1 mm 1.1 mm 2.65 mm 1 mm 1.1 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 2 V 2 V 4.5 V 4.5 V 2 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 5 V 3.3 V
surface mount YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD
Terminal form NO LEAD GULL WING GULL WING NO LEAD GULL WING
Terminal pitch 0.5 mm 0.65 mm 1.27 mm 0.5 mm 0.65 mm
Terminal location QUAD DUAL DUAL QUAD DUAL
Maximum time at peak reflow temperature 30 30 30 30 30
width 2.5 mm 4.4 mm 7.5 mm 2.5 mm 4.4 mm
method of packing TAPE AND REEL TUBE TUBE - TAPE AND REEL
Prop。Delay @ Nom-Sup 12 ns - - 9.5 ns 12 ns
Other features - WITH DUAL OUTPUT ENABLE WITH DUAL OUTPUT ENABLE - WITH DUAL OUTPUT ENABLE
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