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74LVC11DB,112

Description
logic gates 3.3V triple 3-input
Categorylogic    logic   
File Size117KB,15 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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74LVC11DB,112 Overview

logic gates 3.3V triple 3-input

74LVC11DB,112 Parametric

Parameter NameAttribute value
Brand NameNXP Semiconduc
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeSSOP1
package instruction5.30 MM, PLASTIC, MO-150, SOT-337-1, SSOP-14
Contacts14
Manufacturer packaging codeSOT337-1
Reach Compliance Codecompli
seriesLVC/LCX/Z
JESD-30 codeR-PDSO-G14
JESD-609 codee4
length6.2 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeAND GATE
MaximumI(ol)0.024 A
Humidity sensitivity level1
Number of functions3
Number of entries3
Number of terminals14
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSSOP
Encapsulate equivalent codeSSOP14,.3
Package shapeRECTANGULAR
Package formSMALL OUTLINE, SHRINK PITCH
method of packingTUBE
Peak Reflow Temperature (Celsius)260
power supply3.3 V
Prop。Delay @ Nom-Su7.2 ns
propagation delay (tpd)7 ns
Certification statusNot Qualified
Schmitt triggerNO
Maximum seat height2 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)1.2 V
Nominal supply voltage (Vsup)2.7 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceNICKEL PALLADIUM GOLD
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width5.3 mm
74LVC11
Triple 3-input AND gate
Rev. 6 — 17 November 2011
Product data sheet
1. General description
The 74LVC11 provides three 3-input AND functions.
2. Features and benefits
Wide supply voltage range from 1.2 V to 3.6 V
Inputs accept voltages up to 5.5 V
CMOS low power consumption
Direct interface with TTL levels
Complies with JEDEC standard:
JESD8-7A (1.65 V to 1.95 V)
JESD8-5A (2.3 V to 2.7 V)
JESD8-C/JESD36 (2.7 V to 3.6 V)
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-B exceeds 200 V
CDM JESD22-C101E exceeds 1000 V
Specified from
40 C
to +85
C
and
40 C
to +125
C
3. Ordering information
Table 1.
Ordering information
Package
Temperature range
74LVC11D
74LVC11DB
74LVC11PW
74LVC11BQ
40 C
to +125
C
40 C
to +125
C
40 C
to +125
C
40 C
to +125
C
Name
SO14
SSOP14
TSSOP14
Description
plastic small outline package; 14 leads;
body width 3.9 mm
plastic shrink small outline package; 14 leads;
body width 5.3 mm
plastic thin shrink small outline package; 14 leads;
body width 4.4 mm
Version
SOT108-1
SOT337-1
SOT402-1
SOT762-1
Type number
DHVQFN14 plastic dual in-line compatible thermal enhanced very
thin quad flat package; no leads; 14 terminals;
body 2.5
3
0.85 mm

74LVC11DB,112 Related Products

74LVC11DB,112 74LVC11PW,112 74LVC11BQ,115 74LVC11PW,118 74LVC11D,112 74LVC11DB,118 74LVC11D,118
Description logic gates 3.3V triple 3-input logic gates 3.3V triple 3-input logic gates 3.3V triple 3-input logic gates triple 3-IN and gate logic gates 3.3V triple 3-input logic gates 3.3V triple 3-input logic gates 3.3V triple 3-input
Brand Name NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconductor NXP Semiconductor NXP Semiconductor NXP Semiconductor
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to
Maker NXP NXP NXP NXP NXP NXP NXP
Parts packaging code SSOP1 TSSOP QFN TSSOP SOIC SSOP1 SOIC
package instruction 5.30 MM, PLASTIC, MO-150, SOT-337-1, SSOP-14 4.40 MM, PLASTIC, MO-153, SOT-402-1, TSSOP-14 HVQCCN, LCC14,.1X.12,20 4.40 MM, PLASTIC, MO-153, SOT-402-1, TSSOP-14 SOP, SOP14,.25 SSOP, SSOP14,.3 SOP, SOP14,.25
Contacts 14 14 14 14 14 14 14
Manufacturer packaging code SOT337-1 SOT402-1 SOT762-1 SOT402-1 SOT108-1 SOT337-1 SOT108-1
Reach Compliance Code compli compli compli compliant compliant compliant compliant
series LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z
JESD-30 code R-PDSO-G14 R-PDSO-G14 R-PQCC-N14 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14
length 6.2 mm 5 mm 3 mm 5 mm 8.65 mm 6.2 mm 8.65 mm
Load capacitance (CL) 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type AND GATE AND GATE AND GATE AND GATE AND GATE AND GATE AND GATE
MaximumI(ol) 0.024 A 0.024 A 0.024 A 0.024 A 0.024 A 0.024 A 0.024 A
Humidity sensitivity level 1 1 1 1 1 1 1
Number of functions 3 3 3 3 3 3 3
Number of entries 3 3 3 3 3 3 3
Number of terminals 14 14 14 14 14 14 14
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SSOP TSSOP HVQCCN TSSOP SOP SSOP SOP
Encapsulate equivalent code SSOP14,.3 TSSOP14,.25 LCC14,.1X.12,20 TSSOP14,.25 SOP14,.25 SSOP14,.3 SOP14,.25
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE
method of packing TUBE TUBE TAPE AND REEL TAPE AND REEL TUBE TAPE AND REEL TAPE AND REEL
Peak Reflow Temperature (Celsius) 260 260 260 260 260 260 260
power supply 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
propagation delay (tpd) 7 ns 7 ns 7 ns 7 ns 7 ns 7 ns 7 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Schmitt trigger NO NO NO NO NO NO NO
Maximum seat height 2 mm 1.1 mm 1 mm 1.1 mm 1.75 mm 2 mm 1.75 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V
Nominal supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
surface mount YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface NICKEL PALLADIUM GOLD NICKEL/PALLADIUM/GOLD (NI/PD/AU) NICKEL PALLADIUM GOLD NICKEL/PALLADIUM/GOLD (NI/PD/AU) Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD
Terminal form GULL WING GULL WING NO LEAD GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.65 mm 0.65 mm 0.5 mm 0.65 mm 1.27 mm 0.65 mm 1.27 mm
Terminal location DUAL DUAL QUAD DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 30 30 30 30 30 30 30
width 5.3 mm 4.4 mm 2.5 mm 4.4 mm 3.9 mm 5.3 mm 3.9 mm
JESD-609 code e4 - e4 - e4 e4 e4
Prop。Delay @ Nom-Sup - - - 7.2 ns 7.2 ns 7.2 ns 7.2 ns

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