|
SN74ACT3631-20PQ |
SN74ACT3631-15PCB |
SN74ACT3631-20PCB |
SN74ACT3631-15PQ |
| Description |
FIFO 512 x 36 synchronous FIFO memory |
FIFO 512 x 36 synchronous FIFO memory |
FIFO 512 x 36 synchronous FIFO memory |
FIFO 512 x 36 synchronous FIFO memory |
| Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
| Is it lead-free? |
Contains lead |
Contains lead |
Contains lead |
Contains lead |
| Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
| Parts packaging code |
QFP |
QFP |
QFP |
QFP |
| package instruction |
BQFP, SPQFP132,1.1SQ |
HLFQFP, QFP120,.63SQ,16 |
HLFQFP, QFP120,.63SQ,16 |
BQFP, SPQFP132,1.1SQ |
| Contacts |
132 |
120 |
120 |
132 |
| Reach Compliance Code |
compli |
compli |
compli |
compli |
| ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
| Maximum access time |
13 ns |
11 ns |
13 ns |
11 ns |
| Other features |
MAILBOX |
MAILBOX |
MAILBOX |
MAILBOX |
| Maximum clock frequency (fCLK) |
50 MHz |
66.7 MHz |
50 MHz |
66.7 MHz |
| period time |
20 ns |
15 ns |
20 ns |
15 ns |
| JESD-30 code |
S-PQFP-G132 |
S-PQFP-G120 |
S-PQFP-G120 |
S-PQFP-G132 |
| JESD-609 code |
e4 |
e4 |
e4 |
e4 |
| length |
24.13 mm |
14 mm |
14 mm |
24.13 mm |
| memory density |
18432 bi |
18432 bi |
18432 bi |
18432 bi |
| Memory IC Type |
OTHER FIFO |
OTHER FIFO |
OTHER FIFO |
OTHER FIFO |
| memory width |
36 |
36 |
36 |
36 |
| Humidity sensitivity level |
4 |
3 |
3 |
4 |
| Number of functions |
1 |
1 |
1 |
1 |
| Number of terminals |
132 |
120 |
120 |
132 |
| word count |
512 words |
512 words |
512 words |
512 words |
| character code |
512 |
512 |
512 |
512 |
| Operating mode |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
| Maximum operating temperature |
70 °C |
70 °C |
70 °C |
70 °C |
| organize |
512X36 |
512X36 |
512X36 |
512X36 |
| Output characteristics |
3-STATE |
3-STATE |
3-STATE |
3-STATE |
| Exportable |
YES |
YES |
YES |
YES |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
BQFP |
HLFQFP |
HLFQFP |
BQFP |
| Encapsulate equivalent code |
SPQFP132,1.1SQ |
QFP120,.63SQ,16 |
QFP120,.63SQ,16 |
SPQFP132,1.1SQ |
| Package shape |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
| Package form |
FLATPACK, BUMPER |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
FLATPACK, BUMPER |
| Parallel/Serial |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
| Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
| power supply |
5 V |
5 V |
5 V |
5 V |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum seat height |
4.57 mm |
1.6 mm |
1.6 mm |
4.57 mm |
| Maximum standby current |
0.0004 A |
0.0004 A |
0.0004 A |
0.0004 A |
| Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
| Minimum supply voltage (Vsup) |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
| Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
5 V |
| surface mount |
YES |
YES |
YES |
YES |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
| Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal form |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
| Terminal pitch |
0.635 mm |
0.4 mm |
0.4 mm |
0.635 mm |
| Terminal location |
QUAD |
QUAD |
QUAD |
QUAD |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
24.13 mm |
14 mm |
14 mm |
24.13 mm |
| Factory Lead Time |
1 week |
- |
1 week |
1 week |
| Base Number Matches |
- |
1 |
1 |
1 |